• Title/Summary/Keyword: anti-reflection trilayer structure

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The optical analysis of Te-based ART structure for the optical recording media (광기록 매질로 이용되는 Te계 ART구조의 광학적 해석)

  • 이성준;박태성;정홍배
    • Electrical & Electronic Materials
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    • v.7 no.3
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    • pp.220-224
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    • 1994
  • In this study, we discussed the optical property to find the optimal condition of Te-based antireflection trilayer(ART) structure for a high density optical recording. It was found that the optical property was improved by suggesting the environmental parameters satisfied the optimum condition. As the results, the optimized(.lambda.=8.000${\AA}$.) thickness of the recording layer is 27${\AA}$, and the 1st and 2nd minimum ART conditions of dielectric layers are 1080${\AA}$, 3820${\AA}$, respectively. And the high SNR, the contrast ratio and the sensitivity are achieved by using the ART conditions.

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The thermal analysis of te-based media for the optical recording (광기록에 이용되는 Te-based media에 대한 열적 해석)

  • 이성준;천석표;이현용;정홍배
    • Electrical & Electronic Materials
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    • v.8 no.1
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    • pp.64-70
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    • 1995
  • We discussed the thermal analysis for a recording media with the variation of the laser pulse duration, the laser power and the temperature distribution in order to optimize the Te-based antireflection structure from the computer calculations. In the case that the radial heat diffusion is negligible, we can calculate the maximum temperature of the recording layer at the center of the spot by the Simple Model. The temperature profile of the recording layer is obtained from the Numerical Model by considering the total specific heat and the latent heat. As a result, the effect of the heat sinking acting as a thermal loss for the hole formation could be minimized by introducing the pulse with the hole formation duration(.tau.) below the thermal time constant(.tau.$_{D}$) of a dielectric layer. These requirments can be satisfied by using the dielectric thickness of the 2nd ART(Anti-Reflection Trilayer) condition or the dielectric materials with a low thermal diffusivity.y.

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