• Journal of the Korean Ceramic Society
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• v.40 no.3
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• pp.317-321
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• 2003

The grain-boundary microcracking materials in the system A1$_2$Ti $O_{5}$ -ZrTi $O_4$(ZAT) is influenced by the thermal expansion anisotropy. The range of ZAT compositions investigated had showed very low thermal expansions of 0.3~1.3$\times$10$^{-6}$K compared to 8.29$\times$10$^{-6}$K of pure ZrTi $O_4$and 0.68$\times$10$^{-6}$K of polycrystalline A1$_2$Ti $O_{5}$ , respectively, compared with the theoretical thermal expansion coefficient for a single crystal of A1$_2$Ti $O_{5}$ , 9.70$\times$10$^{-6}$K. The low thermal expansion and microcraking temperature are apparently due to a combination of thermal contraction and expansion caused by the large thermal expansion anisotropy of the crystal axes of the A1$_2$Ti $O_{5}$ phase.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.7
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• pp.193-200
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• 2003

The energy release rate for an interface crack in pseudo-isotropic dissimilar materials was obtained by the eigenfunction expansion method using the two-term William's type complex stress function. The complex stress function for pseudo-isotropic materials must be different from that for anisotropic materials. The energy release rate for an interface crack in pseudo-isotropic dissimilar materials was analyzed numerically by RWCIM. The results obtained were verified by comparing the other worker's results and discussed.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.2
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• pp.13-21
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• 1999

Flip chip assembly directly on organic boards offers miniaturization of package size as well as reduction in interconnection distances resulting in a high performance and cost-competitive Packaging method. This paper describes the investigation of alternative low cost flip-chip mounting processes using electroless Ni/Au bump and anisotropic conductive adhesives/films as an interconnection material on organic boards such as FR-4. As bumps for flip chip, electroless Ni/Au plating was performed and characterized in mechanical and metallurgical point of view. Effect of annealing on Ni bump characteristics informed that the formation of crystalline nickel with $Ni_3$P precipitation above $300^{\circ}C$ causes an increase of hardness and an increase of the intrinsic stress resulting in a reliability limitation. As an interconnection material, modified ACFs composed of nickel conductive fillers for electrical conductor and non-conductive inorganic fillers for modification of film properties such as coefficient of thermal expansion(CTE) and tensile strength were formulated for improved electrical and mechanical properties of ACF interconnection. The thermal fatigue life of ACA/F flip chip on organic board limited by the thermal expansion mismatch between the chip and the board could be increased by a modified ACA/F. Three ACF materials with different CTE values were prepared and bonded between Si chip and FR-4 board for the thermal strain measurement using moire interferometry. The thermal strain of ACF interconnection layer induced by temperature excursion of $80^{\circ}C$ was decreased with decreasing CTEs of ACF materials.

• The Bulletin of The Korean Astronomical Society
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• v.40 no.1
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• pp.43.3-44
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• 2015

We analyze the clustering of large scale structure in the Universe in a model independent method, accounting for anisotropic effects along and transverse to the line of sight. A large sample of 690,000 galaxies from The Baryon Oscillation Spectroscopy Survey Data Release 11 are used to determine the Hubble expansion H, angular distance D_A, and growth rate GT at an effective redshift of z=0.57. After careful bias and convergence studies of the effects from small scale clustering, we find that cutting transverse separations below 40 Mpc/h delivers robust results while smaller scale data leads to a bias due to unmodelled nonlinear and velocity effects. The converged results are in agreement with concordance LCDM cosmology, general relativity, and minimal neutrino mass, all within the $68{\backslash}%$ confidence level. We also present results separately for the northern and southern hemisphere sky, finding a slight tension in the growth rate -- potentially a signature of anisotropic stress, or just covariance with small scale velocities -- but within $68{\backslash}%$ CL.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.160.2-160.2
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• 2014

Recently silicon has attracted intense interest as a promising anode material of lithium-ion batteries due to its extremely high capacity of 4200 mA/g (for Li4.2Si) that is much higher than 372 mAh/g (for LiC6) of graphite. However, it seriously suffers from large volume change (even up to 300%) of the electrode upon lithiation, leading to its pulverization or mechanical failure during lithiation/delithiation processes and the rapid capacity fading. To overcome this problem, Si nanowires have been considered. Use of such Si nanowires provides their facile relaxation during lithiation/delithiation without mechanical breaking. To design better Si electrodes, a study to unveil atomic-scale mechanisms involving the volume expansion and the phase transformation upon lithiation is critical. In order to investigate the lithiation mechanism in Si nanowires, we have developed a reactive force field (ReaxFF) for Si-Li systems based on density functional theory calculations. The ReaxFF method provides a highly transferable simulation method for atomistic scale simulation on chemical reactions at the nanosecond and nanometer scale. Molecular dynamics (MD) simulations with the ReaxFF reproduces well experimental anisotropic volume expansion of Si nanowires during lithiation and diffusion behaviors of lithium atoms, indicating that it would be definitely helpful to investigate lithiation mechanism of Si electrodes and then design new Si electrodes.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.99-100
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• 2006

Cold gas dynamic spray or cold-spray is a deposition process, which causes deformation of a thin substrate. The deformation is usually convex to the deposited side. In this research, the main cause of the deformation was investigated using 6061-T6 aluminum alloy. The effects or anisotropic coefficient or thermal expansion (CTE) or the deposited layer by cold-spray and residual stress were studied by experiments and finite element analysis. The Hole Drilling method was applied to measure residual stress in the cold-spray layer and substrate. The data obtained by the experiments were used for the analysis of substrate deformation. From the result of the analysis, it was concluded that compressive residual stress was the main reason of substrate deformation while CTE had little effect.

• Journal of the Korea institute for structural maintenance and inspection
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• v.26 no.1
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• pp.58-66
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• 2022

In this study, to examine the effect of the transverse thermal expansion behavior of FRP reinforcing bars and concrete on the concrete cover thickness, based on 20℃, when the temperature changes from -70℃ to 80℃, the behavior of concrete was studied theoretically and numerically. Theoretical elastic analysis and nonlinear finite element analysis were performed on FRP reinforced concrete with different diameters and cover thicknesses of FRP reinforcement. As a result, at a negative temperature difference, concrete was compressed, and the theoretical strain result and the finite element result were similar, but at a positive temperature difference, tensile stress and further cracks occurred in the concrete, which was 1.2 to 1.4 times larger than the theoretical result. The ratio of the diameter of the FRP reinforcing bar to the thickness of the concrete cover (c/db) is closely related to the occurrence of cracks. Since the transverse thermal expansion coefficient of FRP reinforcing bars is three times greater than that of concrete, it is necessary to consider this in design.

• Fisheries and Aquatic Sciences
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• v.7 no.2
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• pp.90-95
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• 2004

An analytical model for predicting the convection-diffusion of solute dumped in a homogeneous open sea of constant water depth has been developed in a time-integral form. The model incorporates spatially uniform, uni-directional, mean and oscillatory currents for horizontal convection, the settling velocity for the vertical convection, and the anisotropic turbulent diffusion. Two transformations were introduced to reduce the convection-diffusion equation to the Fickian type diffusion equation, and then the Galerkin method was then applied via the expansion of eigenfunctions over the water column derived from the Sturm-Liouville problem. A series of calculations has been performed to demonstrate the applicability of the model.

• The Bulletin of The Korean Astronomical Society
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• v.42 no.2
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• pp.78.3-78.3
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• 2017

The positions of galaxies in comoving Cartesian space varies under different cosmological parameter choices, inducing a redshift-dependent scaling in the galaxy distribution. The shape of the two-point correlation of galaxies exhibits a significant redshift evolution when the galaxy sample is analyzed under a cosmology differing from the true, simulated one. In our previous works, we can made use of this geometrical distortion to constrain the values of cosmological parameters governing the expansion history of the universe. This current work is a continuation of our previous works as a strategy to constrain cosmological parameters using redshift-invariant physical quantities. We now aim to understand the redshift evolution of the full shape of the small scale, anisotropic galaxy clustering and give a firmer theoretical footing to our previous works.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1277-1282
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• 2008

Recently LCD panels have becom very important components for portable electronics. In the high density interconnection material, ACF's are used to connect the outer lead of the tape automated bonding to the transparent indium tin oxide electrodes of the LCD panel. ACF consists of an adhesive polymer matrix and randomly dispersed conductive balls. In this study, we analyzed Failure Mode / Mechanism of ACF which is identified Conductive ball Corrsion, Delamination, Crack and Polymer Expansion / Swelling. In ALT(Accelerated Life Test), we select primary stress factors as temperature and humidity. As time passes by, an increase of connection resistance was observed. In conclusion, we have found that high temperature / humidity affects the adhesion.