• Title/Summary/Keyword: anisotropic damage

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HRTEM Observations on the Modulated Structure in Pseudo-brookite-type Compound, $(In_{0.36}Zn_{1.09})Ti_2O_{5.64}$ (HRTEM에 의한 pseudo-brookite 형 화합물$(In_{0.36}Zn_{1.09})Ti_2O_{5.64}$에서의 변조구조 관찰)

  • Lee, Hwack-Joo;Park, Hyun-Min;Cho, Yang-Koo;Ryu, Hyun;Nahm, Sahn;Bando, Y.
    • Applied Microscopy
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    • v.29 no.1
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    • pp.95-103
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    • 1999
  • Microstructural observations on the pseudo-brookite $MgTi_2O_5$ and the similar type of $(In_{0.36}Zn_{1.09})Ti_2O_{5.64}$ were carried out using a top-entry HRTEM working at 200 kV. The modulated structures were found in $(In_{0.36}Zn_{1.09})Ti_2O_{5.64}$, however, not in $MgTi_2O_5$. The electron diffraction patterns of sublattice in $(In_{0.36}Zn_{1.09})Ti_2O_{5.64}$ are quite similar to those of pseudo-brookite $MgTi_2O_5$. but the complicated superlattice reflections are present in the diffraction patterns. Four types of modulations have been found. The periodicities for the modulated structure are found to be 3.63 nm, 0.79 nm and 0.64 nm along [220] direction, and 0.81 nm along [420] direction. The phase transition from the modulated structure to the unmodulated one was also observed in situ due to the electron beam irradiation reversibly. Further damage by the electron beam made the crystal to be fragmented into many small crystals with the formation of the voids at the kinks in ledged structure of the surface. The anisotropic arrangements of In and O atoms in $(In_{0.36}Zn_{1.09})Ti_2O_{5.64}$ might cause the compound to be unstable under the electron beam.

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Second harmonic generation of pulsed corona - poled nonlinear optical polymer films (펄스 corona 배향된 비선형광학 고분자박막의 제2 고조파발생)

  • Kim, Jun-Soo;Lee, Jong-Ha;Lee, Hwang-Un;Kim, Sang-Youl;Won, Young-Hee
    • Korean Journal of Optics and Photonics
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    • v.13 no.4
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    • pp.356-362
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    • 2002
  • The molecular orientational dynamics of the nonlinear optical(NLO) side-chain polymer N-(4-nitrophenyl)-(L)-prolinol-poly (pphenylene terephthalates) have been studied using nonlinear optical responses as measured by second harmonic generation (SHG). A new pulsed corona poling is used to orient the NLO chromophores and the polymer segments into the noncentrosymmetric structure required to obtain the SHG signal. By corona poling of negative high voltage pulses with variable repetition rates (between 0.5 and 10 ㎑) at temperature between 25$^{\circ}C$ and 80$^{\circ}C$, well below and about the glass transition temperature 70$^{\circ}C$, the side-chain chromophores and the polymer chain contour rearrange themselves and create the domain structure observed by atomic force microscopy(AFM). The pulsed corona voltage enhances the orientational ordering of the NLO chromophores and also significantly influences the growth of SHG signal and the improved relaxation behavior after the poling field is removed, reducing the visible damage to the polymer film dramatically. This new pulsed corona poling experiment gave direct in situ evidence that the NLO chromophore and the polymer backbone undergo anisotropic rearrangement during the poling process.

Fabrication of Microwire Arrays for Enhanced Light Trapping Efficiency Using Deep Reactive Ion Etching

  • Hwang, In-Chan;Seo, Gwan-Yong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2014.02a
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    • pp.454-454
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    • 2014
  • Silicon microwire array is one of the promising platforms as a means for developing highly efficient solar cells thanks to the enhanced light trapping efficiency. Among the various fabrication methods of microstructures, deep reactive ion etching (DRIE) process has been extensively used in fabrication of high aspect ratio microwire arrays. In this presentation, we show precisely controlled Si microwire arrays by tuning the DRIE process conditions. A periodic microdisk arrays were patterned on 4-inch Si wafer (p-type, $1{\sim}10{\Omega}cm$) using photolithography. After developing the pattern, 150-nm-thick Al was deposited and lifted-off to leave Al microdisk arrays on the starting Si wafer. Periodic Al microdisk arrays (diameter of $2{\mu}m$ and periodic distance of $2{\mu}m$) were used as an etch mask. A DRIE process (Tegal 200) is used for anisotropic deep silicon etching at room temperature. During the process, $SF_6$ and $C_4F_8$ gases were used for the etching and surface passivation, respectively. The length and shape of microwire arrays were controlled by etching time and $SF_6/C_4F_8$ ratio. By adjusting $SF_6/C_4F_8$ gas ratio, the shape of Si microwire can be controlled, resulting in the formation of tapered or vertical microwires. After DRIE process, the residual polymer and etching damage on the surface of the microwires were removed using piranha solution ($H_2SO_4:H_2O_2=4:1$) followed by thermal oxidation ($900^{\circ}C$, 40 min). The oxide layer formed through the thermal oxidation was etched by diluted hydrofluoric acid (1 wt% HF). The surface morphology of a Si microwire arrays was characterized by field-emission scanning electron microscopy (FE-SEM, Hitachi S-4800). Optical reflection measurements were performed over 300~1100 nm wavelengths using a UV-Vis/NIR spectrophotometer (Cary 5000, Agilent) in which a 60 mm integrating sphere (Labsphere) is equipped to account for total light (diffuse and specular) reflected from the samples. The total reflection by the microwire arrays sample was reduced from 20 % to 10 % of the incident light over the visible region when the length of the microwire was increased from $10{\mu}m$ to $30{\mu}m$.

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