The effect of COG bonding process variables on bubble generation in ACF (COG 접합 공정 변수가 ACF 내 기포형성에 미치는 영향)

• Paik, H.W.;Jin, S.W.;Yun, W.S.;Jeong, Y.H.;Kim, B.S.;Kim, D.M.
• • Proceedings of the Korean Society of Precision Engineering Conference
  • /
  • 2009.10a
  • /
  • pp.719-720
  • /
  • 2009
• PDF

Chip on Film Interconnection using Lateral Thermosonic Bonding Technology (횡방향 열초음파 본딩 기법을 이용한 COF 접합)

• Ha, C.W.;Kim, K.R.;Yun, W.S.;Kim, K.S.;Kim, S.
• • Proceedings of the Korean Society of Precision Engineering Conference
  • /
  • 2011.06a
  • /
  • pp.45-46
  • /
  • 2011
• PDF

Thermo-Compression Ultrasonic Bonding Technology for Mounting IT Components with High-Density Pin Counts (고밀도 핀배열의 IT 부품 실장을 위한 열압착 초음파 본딩 기술)

• Jang, T.Y.;Yun, W.S.;Kim, K.S.
• • Proceedings of the Korean Society of Precision Engineering Conference
  • /
  • 2008.11a
  • /
  • pp.47-48
  • /
  • 2008
• PDF

Study on Fabrication of 3-Dimensional Stacked Chip Package with Anisotropic Conductive Film (ACF를 이용한 3차원 패키지의 제조 공정에 대한 연구)

• Lee, Young-Chul;Kim, Jong-Woong;Kim, Kwang-Seok;Yu, Chong-Hee;Jung, Seung-Boo
• • Journal of Welding and Joining
  • /
  • v.27 no.3
  • /
  • pp.32-37
  • /
  • 2009
• https://doi.org/10.5781/KWJS.2009.27.3.032 인용 PDF KSCI

Design of heating tool for COG bonding process considering thermal behavior (열전달 특성을 고려한 COG 접합 공정용 히팅툴의 설계)

• Jung, S.W.;Jeong, Y.H.;Yun, W.S.
• • Proceedings of the Korean Society of Precision Engineering Conference
  • /
  • 2009.06a
  • /
  • pp.1049-1050
  • /
  • 2009
• PDF

Temperature characteristics of COG bonding equipment assessment and impact analysis (COG본딩 장비의 온도특성 평가 및 영향분석)

• Choi, Y.J.;Yang, C.W.;Shin, J.H.;Nam, S.H.;Lee, S.W.
• • Proceedings of the Korean Society of Precision Engineering Conference
  • /
  • 2009.06a
  • /
  • pp.1053-1054
  • /
  • 2009
• PDF

Analysis of temperature distribution of Heating Tool in Flip Chip Bonding Process (플립 칩 본딩 공정의 히팅툴 형상에 따른 압접면의 온도 해석)

• Kweon, S.H.;Kwon, S.R.;Ko, D.J.;Park, K.S.;Yang, S.H.
• • Proceedings of the Korean Society of Precision Engineering Conference
  • /
  • 2008.06a
  • /
  • pp.925-926
  • /
  • 2008
• PDF

Optimization of Process Condition for Flip-Chip Bonding Process using Anisotropic Conductive Film(ACF) (ACF를 이용한 Flip-Chip 본딩 공정에서의 공정조건 최적화)

• Kang, H.W.;Choi, Y.J.;Nam, S.H.;Lee, S.W.;Choi, H.J.
• • Proceedings of the Korean Society of Precision Engineering Conference
  • /
  • 2008.06a
  • /
  • pp.531-532
  • /
  • 2008
• PDF

Development of ACF bonding using Thermo-compression Ultrasonic Technique (열압착 초음파 기법을 이용한 ACF 본딩기술 개발)

• Joung, S.W.;Jang, T.Y.;Yun, W.S.;Kim, K.S.
• • Proceedings of the Korean Society of Precision Engineering Conference
  • /
  • 2008.06a
  • /
  • pp.933-934
  • /
  • 2008
• PDF

Lateral Thermosonic Interconnection with Elasticity of ACF (ACF 탄성영역을 이용한 횡방향 열초음파 본딩 기술)

• Ha, C.W.;Yun, W.S.;Park, K.S.;Kim, K.S.
• • Proceedings of the Korean Society of Precision Engineering Conference
  • /
  • 2009.10a
  • /
  • pp.713-714
  • /
  • 2009
• PDF

---