• Journal of the Korean Society for Precision Engineering
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• v.19 no.10
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• pp.156-162
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• 2002

There are many factors affecting the results of CMP (Chemical Mechanical Polishing). Among them, the temperature is related to the removal rate and WIWNU (Within Wafer Non-Uniformity). In other words, the removal rate is proportional to the temperature and the variation of temperature distribution on a pad affects the non-uniformity within a wafer. In the former case, the active chemistry improves the rate of chemical reaction and the removal rate becomes better. But, there are not many advanced studies. In the latter case, a kinematical analysis between work-piece and pad can be obtained. And such result analysed from the mechanical aspect can be directly related to the temperature distribution on a pad affecting WIWNU. Meanwhile, the temperature change affects the quantities of both slurry and pad. The change of a pH value of the slurry chemistry due to a temperature variation affects the surface state of an abrasive particle and hence the agglomeration of abrasives happens above the certain temperature. And the pH alteration also affects the zeta potential of a pad surface and therefore the electrical force between pad and abrasive changes. Such results could affect the removal rate and etc. Moreover, the temperature changes the 1st and 2nd elastic moduli of a pad which are closely related to the removal rate and the WIWNU.

• Membrane and Water Treatment
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• v.7 no.6
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• pp.507-520
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• 2016

The effect of ZnO on cellulose acetate in the removal of benzophenone-3 (BP-3) was investigated. The benzophenone-3 (BP-3) which is an endocrine disrupting chemical (EDC) was completely removed (100%) from the drinking water using Cellulose Acetate (CA) and zinc oxide (ZnO) composite membranes. The membranes were prepared by DIPS method and the filtration experiments were conducted by dead end filtration unit. The macrostructure of the membrane were studied by ATR-IR and XRD Spectra's. Atomic force microscopy (AFM) and Scanning electron microscopy (SEM) were used to study the micro properties of the membranes. The laboratory experiments such as water uptake study and pure water flux performed to confirm the increasing hydrophilicity. The enhancing hydrophilicity was confirmed with respect to higher the concentration of nanoparticles. Evaluation of BP-3 removal was carried in different experimental conditions, such as, different Trans membrane pressure and different concentration of feed. The membrane with low pressure showed better performance by rejecting 100% of BP-3. However, 1 ppm, 3 ppm and 6 ppm of feed solution was used and among them 3 ppm of feed solution gives 100% rejection. The ZnO nanoparticales enhances the performance of CA membrane by showing maximum rejection.

• Nuclear Engineering and Technology
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• v.49 no.5
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• pp.953-967
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• 2017

In this paper, a complete station blackout (SBO) or complete loss of electrical power supplies is simulated and analyzed in a downward cooling 5-MW pool-type Material Testing Reactor (MTR). The scenario is traced in the absence of active cooling systems and operators. The code nodalization is successfully benchmarked against experimental data of the reactor's operating parameters. The passive heat removal system includes downward water cooling after pump breakdown by the force of gravity (where the coolant streams down to the unfilled portion of the holdup tank), safety flapper opening, flow reversal from a downward to an upward cooling direction, and then the upward free convection heat removal throughout the flapper safety valve, lower plenum, and fuel assemblies. Both short-term and long-term natural core cooling conditions are simulated and investigated using the RELAP5 code. Short-term analyses focus on the safety flapper valve operation and flow reversal mode. Long-term analyses include simulation of both complete SBO and long-term operation of the free convection mode. Results are promising for pool-type MTRs because this allows operators to investigate RELAP code abilities for MTR thermal-hydraulic simulations without any oscillation; moreover, the Tehran Research Reactor is conservatively safe against the complete SBO and long-term free convection operation.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.4
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• pp.303-308
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• 2005

In this paper, the effects of oxidants on tungsten chemical mechanical polishing (CMP) process were investigated using three different oxidizers such as Fe(NO₃)₃, KIO₃ and H₂O₂. Moreover, the interaction between the tungsten film and the oxidizer was discussed by potentiodynamic polarization measurement with three different oxidizers, in order to compare the effects of W-CMP and electrochemical characteristics on the tungsten film as a function of oxidizer. As an experimental result, the tungsten removal rate reached a maximum at 5 wt％ Fe(NO₃)₃concentration, and when 5 wt％ H₂O₂was added in the slurry, the removal rate of W increased. Also, the microstructures of surface layer by atomic force microscopy(AFM) image were greatly influenced by the slurry chemical composition of oxidizers. It was shown that the surface roughness and removal rate of the polished surface were improved in Fe(NO₃)₃than KIO₃. The electrochemical results indicate that the corrosion current density of the 5 wt％ H₂O₂ and 5 wt％ H₂O/sub 2+/＋ 5 wt％ Fe(NO₃)₃was higher than the other oxidizers. Therefore, we conclude that the W-CMP characteristics are strongly dependent on the kinds of oxidizers and the amounts of oxidizer additive.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.88-91
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• 2003

Tungsten is widely used as a plug for the multi-level interconnection structures. However, due to the poor adhesive properties of tungsten (W) on $SiO_2$ layer, the Ti/TiN barrier layer is usually deposited onto $SiO_2$ for increasing adhesion ability with W film. Generally, for the W-CMP (chemical mechanical polishing) process, the passivation layer on the tungsten surface during CMP plays an important role. In this paper, the effect of oxidants controlling the polishing selectivity of W/Ti/TiN layer were investigated. The alumina ($Al_2O_3$) abrasive containing slurry with $H_2O_2$ as the oxidizer, was studied. As our preliminary experimental results, very low removal rates were observed for the case of no-oxidant slurry. This low removal rate is only due to the mechanical abrasive force. However, for Ti and TiN with $H_2O_2$ oxidizer, different removal rate was observed. The removal mechanism of Ti during CMP is mainly due to mechanical abrasive, whereas for TiN, it is due to the formation of metastable soluble peroxide complex.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.161-161
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• 2008

The oxide film of silicon wafer has been mainly polished by fumed silica, colloidal silica or ceria slurry. Because colloidal silica slurry is uniform and highly dispersed composed of spherical shape particles, by which the oxide film polished remains to be less scratched in finishing polishing process. Even though the uniformity and spherical shape is advantage for reducing the scratch, it may also be the factor to decrease the removal rate. We have studied the correlation of silica abrasive particles and CMP characteristics by varying pH, down force, and table rotation rate in polishing. It was found that the CMP polishing is dependent on the morphology, aggregation, and the surface property of the silica particles.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.33 no.9
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• pp.938-948
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• 2009

In this paper, permanent magnets were used to remove magnetic sludge in the condenser of the power plant. To obtain the flow characteristics and magnetic information that are needed for determining a proper design of the magnetics sludge removal apparatus, numerical simulations were performed through the use of two commercial codes, ANSYS Workbench-Emag and CFX. Experiments were also performed on various kinds and sizes of magnets to obtain the magnetic information through a gauss meter. By analyzing the results of simulations and experiments, the minimum magnetic force that is able to remove the any size of the magnetic sludge in the condenser was calculated, and the design of the removal apparatus was confirmed. The test model which was confirmed by simulations and experiments was made. After testing, the test results were compared with those of numerical simulations and have good agreements.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05c
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• pp.41-44
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• 2003

As the device feature size is reduced to the deep sub-micron regime, the chemical mechanical polishing (CMP) technology is widely recognized as the most promising method to achieve the global planarization of the multilevel interconnection for ULSI applications. However, cost of ownership (COO) and cost of consumables (COC) were relatively increased because of expensive slurry. In this paper, the effects of different slurry composition on the oxide CMP characteristics were investigated to obtain the higher removal rate and lower non-uniformity. We prepared the various kinds of slurry. In order to save the costs of slurry, the original slurry was diluted by de-ionized water (DIW). And then, alunima abrasives were added in the diluted slurry in order to promote the mechanical force of diluted slurry.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05c
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• pp.33-36
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• 2003

Tungsten is widely used as a plug for the multi-level interconnection structures. However, due to the poor adhesive properties of tungsten (W) on $SiO_2$ layer, the Ti/TiN barrier layer is usually deposited onto $SiO_2$ for increasing adhesion ability with W film. Generally, for the W-CMP (chemical mechanical polishing) process, the passivation layer on the tungsten surface during CMP plays an important role. In this paper, the effect of oxidants controlling the polishing selectivity of W/Ti/TiN layer were investigated. The alumina $(Al_2O_3)$ abrasive containing slurry with 5 % $H_2O_2$ as the oxidizer, was studied. As our preliminary experimental results, very low removal rates were observed for the case of no-oxidant slurry. This low removal rate is only due to the mechanical abrasive force. However, for Ti and TiN with 5 % $H_2O_2$ oxidizer, different removal rate was observed. The removal mechanism of Ti during CMP is mainly due to mechanical abrasive, whereas for TiN, it is due to the formation of metastable soluble peroxide complex.

• Steel and Composite Structures
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• v.21 no.3
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• pp.553-571
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• 2016

The progressive collapse potential of steel moment framed structures due to abrupt removal of a column is investigated based on the energy principle. Based on the changes of component's internal energy, this paper analyzes structural member's sensitivity to abrupt removal of a column to determine a sub-structure resisting progressive collapse. An energy-based structural damage index is defined to judge whether progressive collapse occurs in a structure. Then, a simplified beam damage model is proposed to analyze the energies absorbed and dissipated by structural beams at large deflections, and a simplified modified plastic hinges model is developed to consider catenary action in beams. In addition, the correlation between bending moment and axial force in a beam during the whole deformation development process is analyzed and modified, which shows good agreement with the experimental results.