• Title/Summary/Keyword: and flexible display

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Direct Fabrication of a-Si:H Thin Film Transistor Arrays on Flexible Substrates: Critical Challenges and Enabling Solutions

  • O'Rourke, Shawn M.;Loy, Douglas E.;Moyer, Curt;Bawolek, Edward J.;Ageno, Scott K.;O'Brien, Barry P.;Marrs, Michael;Bottesch, Dirk;Dailey, Jeff;Naujokaitis, Rob;Kaminski, Jann P.;Allee, David R.;Venugopal, Sameer M.;Haq, Jesmin;Colaneri, Nicholas;Raupp, Gregory B.
    • 한국정보디스플레이학회:학술대회논문집
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    • 2008.10a
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    • pp.1459-1462
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    • 2008
  • In this paper we describe solutions to address critical challenges in direct fabrication of amorphous silicon thin film transistor (TFTs) arrays for active matrix flexible displays. For all flexible substrates a manufacturable handling protocol in automated display-scale equipment is required. For metal foil substrates the principal challenges are planarization and electrical isolation, and management of stress (CTE mismatch) during TFT fabrication. For plastic substrates the principal challenge is dimensional instability management.

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Direct Fabrication of a-Si:H TFT Arrays on Flexible Substrates;Principal Manufacturing Challenges and Solutions

  • O’Rourke, Shawn M.;Loy, Douglas E.;Moyer, Curt;Ageno, Scott K.;O’Brien, Barry P.;Bottesch, Dirk;Marrs, Michael;Dailey, Jeff;Bawolek, Edward J.;Trujillo, Jovan;Kaminski, Jann;Allee, David R.;Venugopal, Sameer M.;Cordova, Rita;Colaneri, Nick;Raupp, Gregory B.
    • 한국정보디스플레이학회:학술대회논문집
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    • 2007.08a
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    • pp.251-254
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    • 2007
  • Principal challenges to $\underline{direct\;fabrication}$ of high performance a-Si:H transistor arrays on flexible substrates include automated handling through bonding-debonding processes, substrate-compatible low temperature fabrication processes, management of dimensional instability of plastic substrates, and planarization and management of CTE mismatch for stainless steel foils. Viable solutions to address these challenges are described.

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Threshold Voltage Instability in a-Si:H TFTs and the Implications for Flexible Displays and Circuits

  • Allee, D.R.;Venugopal, S.M.;Shringarpure, R.;Kaftanoglu, K.;Uppili, S.G.;Clark, L.T.;Vogt, B.;Bawolek, E.J.
    • 한국정보디스플레이학회:학술대회논문집
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    • 2008.10a
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    • pp.1297-1300
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    • 2008
  • Electrical stress degradation of low temperature, amorphous silicon thin film transistors is reviewed, and the implications for various types of flexible circuitry including active matrix backplanes, integrated drivers and general purpose digital circuitry are examined. A circuit modeling tool that enables the prediction of complex circuit degradation is presented.

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Design and Implementation of a Wearable LED Display Device

  • Shin, Seung-Hyeok
    • Journal of the Korea Society of Computer and Information
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    • v.20 no.10
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    • pp.7-13
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    • 2015
  • Wearable device, next generation smart device, is consistently growing. The flexible display will be a kind of display in the wearable device. The flexible display technology is now evolving with end-user requirement such as portability and easy installation. Previous wearable display products still have some difficulties in manufacturing and in flexibility whole device. But it can be a flexible display with LED device and utilized in commercial area. In this paper, we propose a driver to control the LED display and implement a flexible LED display system.

A Review of Flexible Display Technology and Its Applications

  • Heo, Yoon;Park, Hyunwoo;Jo, Sung-Hun
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2022.05a
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    • pp.550-551
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    • 2022
  • In the present study, flexible display technology, which has attracted significant attention in recent years, is discussed. The technology has been widely applied to various devices, such as foldable smartphones and rollable TVs. Notably, different flexible display types from LCD to OLED and E-paper have been employed to implement such devices in practice. Among them, the OLED technology has thus far led the flexible display market. In the present study, the concept and current application fields of the technology are analyzed, and further its potential applications are discussed.

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Two-step polyimide curing technique for flexible plastic liquid crystal devices

  • Kim, Ki-Seo;Kim, Hyun-Jin;Kim, Min-Jeong;Kim, Hyun-Gi;Choi, Suk-Won;Kim, Sung-Soo
    • 한국정보디스플레이학회:학술대회논문집
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    • 2009.10a
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    • pp.883-885
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    • 2009
  • We proposed intriguing and simple technique for fabricating flexible plastic liquid crystal (LC) devices. We made a preliminary version of a flexible LC display employing this concept, and we confirmed this technique was useful for the flexible LC display; the electro-optical reproducibility of the flexible LC device fabricated here was remarkably improved against external perturbation compared with the conventional one.

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Where's my Flexible Display?

  • Drzaic, Paul
    • 한국정보디스플레이학회:학술대회논문집
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    • 2008.10a
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    • pp.5-5
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    • 2008
  • Research and development on flexible electronic displays has gone on for over 20 years. Despite this history, very few flexible displays have entered the marketplace. I will discuss the history of development of flexible display technology and the technical and market forces that have slowed the commercialization of this technology.

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Backplane Technologies for Flexible Display (플렉시블 디스플레이 백플레인 기술)

  • Lee, Yong Uk
    • Vacuum Magazine
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    • v.1 no.2
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    • pp.24-29
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    • 2014
  • Display is a key component in electronic devices. OLED is growing very fast recently due to the explosion of the smart phone market although still LCD is the dominating display technology in the display market at the moment. Also needs for the large area and high resolution TVs and flexible displays are increasing these days. Especially flexible display is expected to be one of the key technologies in mobile devices requiring small device size and large display size. Contrary to the conventional displays, flexible display requires organic materials for the substrate, the active driving element and also for the display element. Plastic film as a substrate, organic semiconductor as an active component of the transistor and organic light emitting materials or electronic paper as a display element are studied actively. In this article, mainly backplane technologies such as substrates and the transistor materials for flexible display will be introduced.

Commercialization of Microencapsulated Electrophoretic Displays

  • McCreary, Michael
    • 한국정보디스플레이학회:학술대회논문집
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    • 2006.08a
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    • pp.524-524
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    • 2006
  • For decades, the pursuit of volume commercialization of low-power reflective displays with a paper-like look has been an unfulfilled dream. While steady technical progress was made throughout the late 1990s, there were still no volume products incorporating electronic paper displays (EPD) on the market. Now, microencapsulated electrophoretic display technology, also called electronic ink, has moved into volume production with a frontplane laminate (FPL) display component called E Ink Imaging Film™. This film is coated roll to roll on a flexible plastic substrate and integrated into a display module. Today, all-plastic segmented displays are being shipped as well as displays with electronic ink FPL being driven by glass TFT backplanes. A roadmap to active matrix flexible electrophoretic displays is being enabled by rapid technical progress on flexible TFT backplanes by a variety companies. Each of the approaches to these backplanes and flexible active matrix displays has different advantages for the various market segments being pursued including large format flexible displays for e-news and other reader applications, rollable displays for compact readers, and high resolution small format displays up to 400 ppi that can have fully integrated drive electronics to reduce size and drive down costs. Backplane approaches include Si on plastic, organic transistors on plastic, and Si transistors on flexible stainless steel substrate. Progress is also being made on next generation inks, including more reflective inks with higher contrast ratios. A full color 6 inch, 170 pixel per inch (PPI) active matrix display using a newer generation ink has been developed and this will be described and demonstrated. Large format segmented flexible displays will also be described.

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Rigid and flexible displays with solution processed dielectric passivation layer integrated with E-Ink imaging films

  • Krishnamoorthy, Ahila;Spear, Richard;Gebrebrhan, Amanuel;Stifanos, Mehari;Yellowaga, Deborah;O'Rourke, Shawn;Loy, Doug;Dailey, Jeff;Marrs, Michael;Ageno, Scott
    • 한국정보디스플레이학회:학술대회논문집
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    • 2008.10a
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    • pp.86-88
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    • 2008
  • Organosiloxane based spin on planarizing dielectrics (PTS-E and PTS-R) were developed for application in flat panel displays as a replacement to conformal chemical vapor deposited SiNx. Here we demonstrate the successful use of siloxane-based material as a passivation layer for active matrix $\alpha$-Si thin film transistors (TFT) on both rigid and flexible substrates.

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