• Title/Summary/Keyword: amorphous silicon interlayer

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Sodalime-sodalime Electrostatic Bonding using Amorphous Silicon Interlayer and Its Application to FEA Packging (비정질 실리콘 박막을 이용한 Sodalime-Sodalime 정전 열 접합 및 FEA Packaging 응용)

  • Ju, Byeong-Kwon;Lee, Duck-Jung;Choi, Woo-Beom;Kim, Young-Cho;Lee, Nam-Yang;Oh, Myung-Hwan
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.48 no.9
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    • pp.656-661
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    • 1999
  • As a fundamental study for FED tubeless packaging, sodalime-sodalime electrostatic bonding was performed by using on the developed bonding mechanism. Thebonding properties of the bonded sodalime-sodalime structure were investigated through SEM and SIMS analyses. Mo-tip FEA was vacuum-packaged by the developed bonding process and the packaged device generated the field emission current.

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Epitaxial Growth of CoSi2 Layer on (100)Si Substrate using CoNx Interlayer deposited by Reactive Sputtering (반응성 스퍼터링법으로 증착된 CoNx 중간층을 이용한 (100)Si 기판 위에서의 에피택셜 CoSi2 성장 연구)

  • Lee, Seung-Ryul;Kim, Sun-Il;Ahn, Byung-Tae
    • Korean Journal of Materials Research
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    • v.16 no.1
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    • pp.30-36
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    • 2006
  • A novel method was proposed to grow an epitaxial $CoSi_2$ on (100)Si substrate. A $CoN_x$ interlayer was deposited by reactive sputtering of Co in an Ar+$N_2$ flow. From the Ti/Co/$CoN_x$/Si structure, a uniform and thin $CoSi_2$ layer was epitaxially grown on (100)Si by annealing above $700^{\circ}C$. Two amorphous layers were found at the $CoN_x$/Si interface, where the top layer has a silicon nitride (Si-N) bonding state with some Co content and the bottom layer has a Co-Si intermixing state. The SiNx amorphous layer seems to play a critical role of suppressing the diffusion of Co into Si substrate for the direct formation of epitaxial $CoSi_2$.

Investigation of the interface between diamond film and silicon substrate using transmission electron microscopy (투과 전자 현미경을 이용한 다이아몬드 박막과 실리콘 기판의 계면 연구)

  • 김성훈
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.10 no.2
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    • pp.100-104
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    • 2000
  • Diamond film was deposited on Si substrate by using microwave plasma-enhanced chemical vapor deposition (MPECVD) system. After thinning the cross section between diamond film and Si substrate by ion milling method, we investigated its interface via transmission electron microscopy We could observe that the diamond film was grown either directly on Si substrate or via the interlayer between diamond film and Si substrate. Thickness of the interlayer was varied along the cross section. The interlayer might mainly composed of Sic andlor amorphous carbon. We could observe the well-developed electron diffraction pattern of both Si and diamond around the interface. Based on this result, we can conjecture the initial growth behavior of diamond film on Si substrate.

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Synthesis of Zirconium Oxides on silicon by Radio-Frequency Magnetron Sputtering Deposition

  • Ma, Chunyu;Zhang, Qingyu
    • Journal of the Korean Vacuum Society
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    • v.12 no.S1
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    • pp.83-87
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    • 2003
  • Zirconium oxide films have been synthesized by radio-frequency magnetron sputtering deposition on n-Si(001) substrate with metal zirconium target at variant $O_2$ partial pressures. The influences of $O_2$ partial pressures of the morphology, deposition rate, microstructure, and the dielectric constant of $ZrO_2$ have been discussed. The results show that deposition rate of $ZrO_2$ films decreases, the roughness, and the thickness of the native $SiO_2$ interlayer increases with the increase of $O_2$ partial pressure. $ZrO_2$ films synthesized at low $O_2$ partial pressure are amorphous and monoclinic polycrystalline in nanometer scale at low $O_2$ partial pressure. The relative dielectrics of $ZrO_2$ films are in the range of 12 to 25.