• Title/Summary/Keyword: air-cooling heat sink

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Experimental and Numerical Studies on the Flow Characteristics of a Fan-Sink (팬싱크의 유동 특성에 관한 실험 및 수치해석적 연구)

  • Lee Kyoung-Yong;Choi Young-Seok;Yun Jae-Ho
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.18 no.3
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    • pp.225-230
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    • 2006
  • The overall performance and local flow fields of the fan, heat sink, and fan-sink were experimentally and numerically studied to investigate the flow characteristics of a fan-sink. The flow resistance of the heat sink was measured by small fan tester based on AMCA standards and compared with the CFD results to select available cooling fan for the fan-sink. The nonuniform velocity profile behind the fan outlet was shown by the flow visualization. The effects of nonuniform velocities on the performance of heat sink were discussed. To validate the commercial CFD code CFX-5.6, the predicted performance curve was compared with that of fan testing. The local flow fields of the fan-sink were analyzed by CFD results. MFR (multiple frame of reference) was used as a computational model combining rotating fan and stationary heat sink. Through the CFD results of the fan-sink, the flow patterns behind the fan outlet influenced the flow resistance and overall performance of the heat sink.

A Primary Study on the Enhancement of Efficiency in the Computer Cooling System using Entrance Tube of Outer Air (외부공기 유입관을 이용한 컴퓨터 냉각시스템의 효율향상에 관한 연구)

  • Kim, S.H.;Kim, M.H.
    • Journal of Power System Engineering
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    • v.13 no.4
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    • pp.56-61
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    • 2009
  • In recent years, since the continuing increase in the capacity in personal computer such as the optimal performance, high quality and high resolution image, the computer system's components produce large amounts of heat during operation. This study analyzes and investigates the ability and efficiency of a cooling system inside a computer by means of central processing unit (CPU) and power supply cooling fan. This research was conducted to enhancement of efficiency of the cooling system inside the computer by making a structure which produces different air pressures in an air inflow tube. Consequently, when temperatures of the CPU and room inside computer were compared with a general personal computer, temperatures of the tested CPU, the room and the heat sink were as low as $5^{\circ}C$, $2.5^{\circ}C$ and $7^{\circ}C$ respectively. In addition to, revolution per minute (RPM) was shown as low as 250 after 1 hour operation. This research explored the possibility of enhancing the effective cooling of high-performance computer systems.

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NUMERICAL STUDY OF CHIP COOLING ENHANCEMENT WITH EVAPORATING MIST FLOW (분무 증발을 이용한 칩 냉각 향상에 대한 수치적 연구)

  • Roh, S.E.;Kim, D.;Son, G.
    • Journal of computational fluids engineering
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    • v.18 no.2
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    • pp.9-16
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    • 2013
  • The heat transfer enhancement of heat sink with mist flow is studied numerically by solving the conservation equations for mass, momentum and energy in the continuous and dispersed phases. A Lagrangian method is used for tracing dispersed water droplets in the heat sink and an Eulerian species transport model for air and steam mixture. The continuous and dispersed phases are interacted with the drag and evaporation source terms. The computed results show that addition of evaporating mist droplets enhances the cooling performance of heat sink significantly.

A Study on the Thermal Characteristics of COB LED using Thermoelectric Element (열전소자를 이용한 COB LED의 열적 특성 분석에 관한 연구)

  • Kim, Hyo-Jun;Kim, Tae-Hyung;Kim, Yong-Kab;Hoang, Geun-Chang
    • The Journal of the Korea institute of electronic communication sciences
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    • v.9 no.12
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    • pp.1435-1440
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    • 2014
  • This paper was designed to analyze thermal properties using thermoelectric element for air-cooling heat dissipation of 13.2W-class COB LED. For comparative analysis with generally used air cooling methods, the heat sink was designed and produced, and this experiment was conducted to measure the temperature distribution using a contact thermometer while the COB LED was operating for 100 minutes. One result was about $75^{\circ}C$ for the general cooling method, and the other was $57^{\circ}C$ while the thermoelectric element was operating with applying the current of 0.8A to the thermoelectric element. This results confirmed that the method of applying thermoelectric element was much better in the dissipation of thermal condense on the COB LED than that of the general air cooling one. The temperature on the contact points of COB LED using thermoelectric element was decreased about 31% compared with the air cooling method from $75^{\circ}C$ to $57^{\circ}C$.

Thermal Analysis of the Heat Sink Performance using FEM (유한 요소법을 이용한 히트싱크의 성능평가를 위한 열해석 연구)

  • Lee, Bong-Gu;Lee, Min
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.15 no.9
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    • pp.5467-5473
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    • 2014
  • This study examined the numerical analysis results with respect to the thermal behavior of a natural convection cooled pin-fin heat sink. The heat sink consisted of pin fins integrated with plate fins. The heat sinks were designed with two different types to fit the limited internal space. The two types of heat sinks designed were analyzed using the ANSYS software package, and the numerical analysis results were compared with the cooling performance of the two types of heat sinks. The results of the simulation were analyzed according to the temperature distribution and air flow characteristics, heat flux etc. This study examined the correlation of the cooling performance with the heat sink internal structure and fin shape. FEM (Finite Element Method) confirmed the cooling performance of heat sink type A under natural convection conditions as the best results. The results of the numerical simulation showed that the heat sink type A shape showed an approximately 70 percent better heat transfer rate with natural convection than that of type B.

Design of a Heat Dissipation System for the 400kW IGBT Inverter (400kW급 IGBT 인버터용 방열 시스템 설계)

  • 이진우
    • The Transactions of the Korean Institute of Power Electronics
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    • v.9 no.4
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    • pp.350-355
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    • 2004
  • This paper deals with the design of a heat dissipation system, which consists of a heat source of power semiconductor devices, a heat sink ;md a fan for the forced air cooling. It suggests the method of appropriately dividing the whole heat transfer system into analytical subsystems and also presents the correspondent analytic or experimental design equations for the subsystems. The experimental results on the designed heat dissipation system for the 400kW IGBT inverter show less than 10[%] error with respect to the design temperature and therefore verify the validity of the proposed analytical design method in the steady state.

Study on the Cooling Performance of Single and Cascade Refrigeration Systems Using Thermoelectric Modules (열전소자를 이용한 싱글 및 캐스케이드 냉동시스템의 냉각 성능에 관한 연구)

  • Lim, Changhak;Kim, Dongwoo;Kim, Yongchan;Seo, Kookjeong
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.25 no.12
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    • pp.641-646
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    • 2013
  • The purpose of this study is to improve the cooling performance of single and cascade refrigeration systems using thermoelectric modules. The system consists of a heat sink, fan, and thermoelectric module. The operating parameters considered in this study include power distribution between the first- and second-stage thermoelectric modules, air flow, and variable condensing unit. The cooling capacity increased with decreases in the temperature difference between hot and cold surfaces, but decreased with increases in the condensing temperature. The COP decreased with increasing electric power of the thermoelectric module because of the increased Joule heat. The cooling performance improvement using the thermoelectric module is represented by the freezer temperature.

Experimental Investigation of Forced Air Cooled Plate Fin Heat Sinks (강제 공냉 평판형 핀 방열판에 대한 실험적 고찰)

  • Kim, Tae-Yeop
    • The Transactions of the Korean Institute of Power Electronics
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    • v.24 no.6
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    • pp.428-437
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    • 2019
  • Analytical thermal models based on average convection heat transfer are frequently used for the design and selection of forced air-cooled plate fin heat sinks. In this paper, a convection heat transfer model within a ±10% margin of error was presented through experimental investigation. Five types of heat sinks with inlet widths of 1.7-6.8 mm were tested at 50-160 W heat sources to derive and verify the model. Causes of error between the experiment and analytical thermal model were analyzed and listed to design the heat sink. Using proposed method and the lists to be considered in the paper, a quick and accurate heat sink design of the power-conversion system is expected.

A Study on the Heat Dissipation Characteristics of Layered Heat Sink for CPU Cooling (CPU 냉각을 위한 적층형 히트싱크의 방열 특성 연구)

  • Lee, Kyu-Chill;Kim, Joung-Ha;Yun, Jae-Ho;Park, Sang-Il;Choi, Yun-Ho;Kwon, Oh-Kyung
    • Proceedings of the SAREK Conference
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    • 2006.06a
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    • pp.182-187
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    • 2006
  • This research presented the heat resistance characteristics of heat sink which is newly designed through the experiment. For the same volume and base plate of heat sinks, the experiment of heat transfer characteristics was conducted for forced convection of layered type heat sink. The heat transfer and pressure drop characteristics of the layered type heat sink were compared for the various kinds of fin pitches, fin heights and heights of heat sink. The results show that thermal resistance is decreased as the height of heat sink increases and the fin height and fin pitch decrease, From the experimental data of layered type heat sink, the correlation equation of Nusselt number was obtained as follows ; $$Nu=0.845{\cdot}Re^{0.393}{\cdot}(\frac{f_h}{D_h})^{0.160}{\cdot}(\frac{f_p}{D_h})^{0.372}{\cdot}(\frac{H_{hs}}{D_h})^{-0.942}$$

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A Study on the Numerical Analysis of Heat Sink for Radiant Heat of Automotive LED Head Lamp (자동차 LED Head Lamp의 방열을 위한 Heat Sink의 수치해석적 연구)

  • Choi, Byung-Hui;Kim, Chang-Oh
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.13 no.10
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    • pp.4398-4404
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    • 2012
  • This thesis was conducted a numerical analysis on the radiant heat performance according to factors of design of heat sink for cooling of the automotive LED head lamp. The heat sinks were designed with 5 different types to fit the limited internal space by formula based on an existing product (Type 1). Designed heat sinks of five types were analyzed by ANSYS CFD V12.1, and the analysis results were compared with the existing type. The results of simulation were analyzed temperature distribution and average temperature, air flow characteristic, heat flux etc. This thesis was researched on the correlation of the cooling performance according to the heat sink structure and the fin shape. Through numerical analysis, could be confirmed heat sink Type 2 as the best results.