• Biomolecules & Therapeutics
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• 제23권3호
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• pp.290-295
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• 2015

Aging is defined as a collective process that alters organism's functional capacity and appearance over the course of life. Apart from an increase in susceptibility to many diseases, aging affects the cellular system that is responsible for decoding painful stimuli. Yet, aging-associated molecular mechanisms of pain perception remains elusive. Using Drosophila, we showed a decrease in temperature tolerance and a reduction in high temperature thermal avoidance with aging. Locomotor activity assay demonstrated that the age-dependent changes in heat nociception did not stem from the general decline in muscular activity. However, we identified pain-related gene expression alteration with aging. We anticipate that our findings would help opening a new window onto developing the optimal pain treatment for the elderly.

• 한국산학기술학회논문지
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• 제21권10호
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• pp.499-508
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• 2020

연구의 목적은 폐경기 이후 여성의 성공적 노화를 돕고 우울감을 낮추는 자가 관리 프로그램을 개발하고자 대상자의 참여 동기, 성공적 노화 수준, 건강행위 정도와 우울감 수준을 파악하고, 상관관계를 알아보는 것이다. 연구의 방법은 폐경기 이후 여성 252명을 대상으로 빈도, 백분율 및 일원분류 분산분석(One Way ANOVA)을 사용하여 자료를 분석하였다. 연구의 결과는 일반적 특성에 따른 운동 참여 동기와 성공적 노화의 수준 차이는 건강수준, 운동 종류, 운동 도움 여부, 거주지 등에 따라 통계적으로 유의미한 차이를 보였다. 건강행위 수준과 우울감의 수준은 연령, 건강수준, 운동 종류, 운동 수행 기간 등에 따라 유의한 차이를 보였다. 또한 우울감의 수준은 동거가족에서도 유의한 차이를 보였다. 상관관계 분석결과 운동 참여 동기와 성공적 노화, 건강행동 간은 상관계수 .001 수준에서, 우울감과 건강행동 간은 상관계수 .05 수준에서 유의한 것으로 나타났다. 결론은 폐경기 이후 여성의 자가 관리 운동 프로그램 개발은 매우 중요하며, 이는 성공적 노화를 돕고 우울감을 낮출 수 있을 것이다.

• Journal of Advanced Marine Engineering and Technology
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• 제23권6호
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• pp.761-769
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• 1999

In this paper the effect of aging heat treatment to the Corrosion behavior for the Nimonic 80A superalloy was studied by AC Impedance methods. Tested solution was 3.5% with tempera-ture $25^{\circ}C$ Electro-chemical corrosion test were carried out for the Nimonic 80A super-alloy which solution heat treated at $1080^{\circ}C$ for 8 hours followed by aging heat treated at $650^{\circ}C,\;700^{\circ}C,\;750^{\circ}C\;800^{\circ}C$ and $850^{\circ}C$ with 16hours under vacuum environment. The obtained results were as follows; 1. Base metal and solution-treated materials were exhibited similar corrosion tendency as Ran-dle equivalent cell. The value of passive film resistance was 579 ohms for the base metal and 124,770 ohms for the solutionized metal such a difference was arose by the ${{\gamma}_^'}$ precipitate on the metal surface during heat treatment. 2. The measure value of $R_p$ for heat-treated at $650^{\circ}C,\;700^{\circ}C,\;800^{\circ}C$and $850^{\circ}C$ were 97,943, 93, 111, 26,961, 15,798 and 11,780ohm respectively. Which indicated that the passive film resistance Rp was reduced as aging temperature increased due to the growth of grain size and sensitization at the grain boundary. 3. The similar tendency was exhibited for corrosion behavior of the electro-chemical corrosion polarization method and AC impedance method and confirmed that AC impedance method was useful tool for corrosion research.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2008년도 추계학술대회 논문집
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• pp.203-206
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• 2008

Transformation of austenite to martensite during cold rolling has been widely used to strengthen metastable austenitic stainless steel grades. Aging treatment of cold worked metastable austenitic stainless steels, including ${\alpha}'$-martensite phase, results in the further increase of strength, when aging is performed in $200^{\circ}C$ to $450^{\circ}C$ temperature range. The purpose of the present study was to evaluate the effect of time and temperature on the stress-strain behavior of cold worked austenitic stainless steels. The amount of ${\alpha}'$-martensite during cold working and aging was examined by ferrite scope and X-ray diffraction (XRD). During aging at $450^{\circ}C$ for 1hr, tensile strength dramatically increased by 150MPa. Deformed metastable austenitic steels containing the "body-centered" ${\alpha}'$-martensite are strengthened by the diffusion of interstitial solute atoms during aging at low temperature.

• Transactions on Electrical and Electronic Materials
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• 제10권4호
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• pp.125-130
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• 2009

The clamping voltage characteristics and accelerated aging behavior of CoCrTb-doped Zn/Pr-based varistors were investigated for different sintering temperatures. The best clamping voltage characteristics were obtained for the varistors sintered at $1330^{\circ}C$, with a clamping voltage ratio (K) of 1.63 at a surge current of 5 A and 1.75 at a surge current of 10 A. The varistors sintered at $1330^{\circ}C$ exhibited the highest stability, with -0.1% in $%{\Delta}E_{1\;mA}$, -0.2% in $%{\Delta}{\alpha}$, and +15.5% in $%{\Delta}J_L$ for E-J characteristics under a stress state of 0.90 $E_{1\;mA/120^{\circ}C$ /24 h. Furthermore, it exhibited $%{\Delta}{\varepsilon}_{APP}$' of -0.7% and $%{\Delta}tan{\delta}$ of +5.7% for dielectric characteristics under the same stress state.

• International Journal of Automotive Technology
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• 제1권2호
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• pp.71-77
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• 2000

High temperature materials in service are subjected to mechanical damage due to operating load and metallurgical damage due to operating temperature. Therefore, when designing or assessing life of high temperature components, both factors must be considered. In this paper, the effect of tensile hold time on high temperature fatigue crack growth and long term prior thermal aging heat treatment on creep rupture behavior were investigated using STS 316L and STS 316 austenitic stainless steels, which are widely used for high temperature components like in automotive exhaust and piping systems. In high temperature fatigue crack growth tests using STS 316L, as tensile hold time increased, crack growth rate decreased in relatively short tensile hold time region. In long term aged specimens, cavity type microcracks have been observed at the interface of grain boundary and coarsened carbide.

• 열처리공학회지
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• 제11권1호
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• pp.10-16
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• 1998

The softening behavior of squeeze cast Mg-Li-Al and Mg-Li-Al-Zr alloys have been investigated. The highest hardness values of Mg-Li-Al and Mg-Li-Al-Zr alloys were obtained after solution treatment at $400^{\circ}C$ for 1 hour. The hardness value, however, decreased as the aging temperature and time increased. Microstructural and calorometric analyses showed that quenched-microstructure changed from primary (${\alpha}$ and ${\beta}$)+secondary ${\alpha}$ to primary(${\alpha}$ and ${\beta}$)+secondary ${\alpha}+{\theta}$ after aging. The softening during aging was due to the coarsening of ${\theta}$ precipitates.

• 한국전기전자재료학회논문지
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• 제20권12호
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• pp.1105-1111
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• 2007

Because forest fire can give a serious damage to overhead conductors, the thorough understanding about aging behavior of burned conductor is very important in maintaining the transmission line safely. Therefore, a systematic investigation was carried out by heating method. As the heating temperature increases, drastic change of tensile strength of Al wire due to the softening of Al wire occurred. When Al wire is exposed to the flame(about $800\;^{\circ}C$) during only 13 seconds, the remained tensile strength of Al wire showed under 90 %. The detailed results will be given in the text.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.534-535
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• 2007

Because forest fire can give a serious damage to overhead conductors, the thorough understanding about aging behavior of burned conductor is very important in maintaining the transmission line safely. Therefore, a systematic investigation was carried out by heating method. As the heating temperature increases, drastic change of tensile strength of Al wire due to the softening of Al wire occurred. When Al wire is exposed to the flame(about $800^{\circ}C$) during only 13 seconds, the remained tensile strength of Al wire showed under 90%. The detailed results will be given in the text.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2007년 추계학술발표대회 개요집
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• pp.235-237
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• 2007

In this paper, fabrication of Sn-3.0Ag-0.5Cu solder bumping having accurate composition and behavior of intermetallic compounds(IMCs) growth at interface between Sn-Ag-Cu bumps and Cu substrate were studied. The ternary alloy of the Sn-3.0Ag-0.5Cu solder was made by two binary(Sn-Cu, Sn-Ag) electroplating on Cu pad. For the manufacturing of the micro-bumps, photo-lithography and reflow process were carried out. After reflow process, the micro-bumps were aged at $150^{\circ}C$ during 1 hr to 500 hrs to observe behavior of IMCs growth at interface. As a different of Cu contents(0.5 or 2wt%) at Sn-Cu layer, behavior of IMCs was estimated. The interface were observed by FE-SEM and TEM for estimating of their each IMCs volume ratio and crystallographic-structure, respectively. From the results, it was found that the thickness of $Cu_3Sn$ layer formed at Sn-2.0Cu was thinner than the thickness of that layer be formed Sn-0.5Cu. After aging treatment $Cu_3Sn$ was formed at Sn-0.5Cu layer far thinner.