• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2002년도 International Meeting on Information Display
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• pp.275-278
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• 2002

Conductive adhesives are commonly used for the interconnections of fine pitch, small packages like mobile applications. Since conductive particles connect mechanically with contact pads to give somewhat higher contact resistance, a metallurgical interconnection, which provides both fine pitch and low resistance, was studied using silver ball and indium which can be made at low temperatures. The connection resistance of the In-Ag metallurgical interconnection was lower than that of the Ni/Au-Ag mechanical interconnection and the former showed little dependency on the bonding load in contrast to the latter.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 추계 기술심포지움 초록집
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• pp.9-10
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• 2004

• Journal of Welding and Joining
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• 제31권6호
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• pp.77-83
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• 2013

3D packaging technology using TSV (Through Silicon Via)has been studied in the recent years to achieve higher performance, lower power consumption and smaller package size because electrical line is shorter electrical resistivity than any other packaging technology. To stack TSV chips vertically, reliable and robust bonding technology is required because mechanical stress and thermal stress cause fracture during the bonding process. Cu pillar/solder ${\mu}$-bump bonding process is usually to interconnect TSV chips vertically although it has weak shape to mechanical stress and thermal stress. In this study, we suggest Insert-Bump (ISB) bonding process newly to stack TSV chips. Through experiments, we tried to find optimal bonding conditions such as bonding temperature and bonding pressure. After ISB bonding, we observed microstructure of bump joint by SEM and then evaluated properties of bump joint by die shear test.

• 한국IT서비스학회지
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• 제11권2호
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• pp.275-289
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• 2012

Although the specification of packaging box is one of the most important process to be considered before deciding cost in terms of production and logistics, there are no efficient services in our country at this time as such the making decision only through the empirical knowledge. In this research, we have developed the packaging specification design system based on the web online packaging IT service. The developed system was advanced from the existing-inefficient process of deciding the specification of packaging box, and which can decide the specification of packaging box considering the efficiency of logistics through use of IT based tool. Therefore, this study shows applied cases of normalized packaging process through the obtained packaging design simulation program. The packaging specification design system can provide the simulation and user interface. Those could calculate the specification of packaging box(packaging box size, packaging box quantity, packaging box pattern, packaging compressive strength, packaging cost etc.) considering the efficiency of logistics.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 3rd Korea-Japan Advanced Semiconductor Packaging Technology Seminar
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• pp.207-235
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• 2001

• 한국포장학회지
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• 제15권3호
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• pp.105-111
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• 2009

In this work, source reduction of poly ethylene terephthalate (PET) packaging are discussed as aspect of sustainability, such as reuse, refill and recycling through the various treatment methods and historical studies for municipal solid waste (MSW) disposal. Since PET has good chemical, physical and mechanical properties, and provides good oxygen and carbon dioxide barrier properties, PET is one of the most widely used thermoplastic polyester in the U.S. and around the world. As the demand for non-renewable PET is increasing, several approaches have been developed to meet economical feasibility and environmental responsibility without degrading material performance. Several companies, such as Coca-Cola Co., Easterform Packaging Co. and Kraft, have tried to develop lightweight PET bottle, and some of lightweight PET bottles are already commercialized. Reuse and refilling for PET container is well developed in Europe, such as Denmark, German and Netherland by supportive legislation and policies. Recycling process is the best way to economically reduce PET waste. In consequence, advanced technique and further development must be provided due to increasing PET packaging waste.

• 마이크로전자및패키징학회지
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• 제22권1호
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• pp.35-41
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• 2015

In this study, in order to improve the reliability of ACF interconnections, solder ACF joints were investigated interms of solder joint morphology and solder wetting areas, and evaluated the electrical properties of Flex-on-Board (FOB) interconncections. Solder ACF joints with the ultrasonic bonding method showed excellent solder wetting by broken solder oxide layers on solder surfaces compared with solder joints with remaining solder oxide layer bonded by the conventional thermo-compression (TC) bonding method. When higher target temperature was used, Sn58Bi solder joints showed concave shape due to lower degree of cure of resin at solder MP by higher heating rate. ACFs with epoxy resins and SAC305 solders showed lower degree of resin cure at solder MP due to the slow curing rate resulting in concave shaped solder joints. In terms of solder wetting area, solder ACFs with $25-32{\mu}m$ diameters and 30-40 wt% showed highest wetted solder areas. Solder ACF joints with the concave shape and the highest wetting area showed lower contact resistances and higher reliability in PCT results than conventional ACF joints. These results indicate that solder morphologies and wetting areas of solder ACF joints can be controlled by adjustment of bonding conditions and material properties of solder and polymer resin to improve reliability of ACF joints.

• 마이크로전자및패키징학회지
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• 제26권4호
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• pp.15-22
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• 2019

Metallic nanowires (MNWs) have recently been considered as one of the most promising candidates for flexible electrodes of advanced electronics including wearable devices, electronic skins, and soft robotics, since they have high aspect ratio in physical shape, low percolation threshold, high ductility and optical transparency. Herein, we review the latest findings related to the MNWs and discuss the properties and potentials of this material that can be used in implementation of various advanced electronic devices.

• 마이크로전자및패키징학회지
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• 제31권2호
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• pp.16-22
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• 2024

Artificial Intelligence(AI) 기술이 발전함에 따라 데이터 센터 분야 등에서 고사양 반도체에 대한 수요가 증가하고 있다. 이러한 추세에 맞춰 반도체 성능을 향상하기 위해 회로의 미세화 및 I/O의 고밀도화가 요구되고 있으며 이를 충족할 수 있는 기술로 차세대 packaging인 2.5dimension(D) packaging이 주목받고 있다. 2.5D packaging에 활용되는 요소 기술로는 microbump, interposer 및bridge die가 있다. 이러한 기술을 적용하면 기존 방식 대비 더 많은 수의 I/O 구현이 가능하여 동시에 다량의 정보를 송수신할 수 있으며, 전기 신호를 전달하는 배선 길이를 단축하여 전력 소모량을 감소시킬 수 있다. 본 논문에서는 molding 공정 및 R DL공정을 융합하여 제작한 Molded Bridge die on Substrate(MBoS) 공정 기술을 제안한다. 제안된 MBoS 기술은 적용이 쉽고 활용 분야가 넓어 차세대 패키징 기술의 대중화에 기여할 것으로 예상된다.

• 한국포장학회지
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• 제13권2호
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• pp.43-50
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• 2007

The production, distribution, and consumption of Korean medicinal herbs have increased every year because of an increase of health considerations. But there are no sufficient standardization procedures in packaging and distribution systems related to these herb products. The standardization of packaging material and dimension could be a good addition for establishing proper quality control methods for Korean medicinal herbs. Medicinal herbs deteriorate under physical, chemical and biological hazards such as oxidation, textural change under high moisture content, color change by light, sanitation problems by insect invasion and contamination. Packaging standardization with proper functional packaging materials is critical to ensure the qualities of medicinal herbs. Also, storage and distribution efficiencies can be improved by achieving packaging dimension standardization. This review summarizes recent research trends related to quality evaluation methods and major quality deterioration factors of Korean medicinal herbs. This paper also offers reviews on some of problems and challenges in current packaging and distribution systems of medicinal herb industries and briefly suggests advanced quality control methods through packaging standardization.