• Korean Journal of Human Ecology
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• v.24 no.3
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• pp.423-436
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• 2015

Namdaemun Market is located in the heart of history and has the volume and the budget for nearly half of the total Namdaemun. But it has been undergoing the crisis of stagnation without reviving the merit of only the 'jewelry' wholesale industrial cluster in the nation. The purposes of this study were that analyzed the status and design of jewelry in Namdaemun and identified the characteristics of successful domestic jewelery brands and then the revitalized the way of the Namdaemun jewelry industry. Problems being currently facing the Namdaemun jewelry shopping are most likely caused by products' design did not respond to changes quickly, while China's jewelry products are in leaps of the quality and the affordable jewelry market in Korea has lost the large number of the customers by china's cheap jewelry products. The most feature of successful domestic jewelry companies, Red Eye, Naughty Cat and Jackie Moon. put the most effort to unique design development and then constantly develope new designs to meet the diverse needs of consumers. It is a conclusion that the Namdaemun jewelry market need to produced under the name of brand not by the traditional whole sale market style. Development unique jewelry brand requires a high-end commercial strategy of the logo, packaging and interior. The high-end quality require for the advanced designs as well as the study of new materials needed for the advanced materials.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.20 no.11
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• pp.3538-3548
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• 1996

In this study, as a part of basic study for developing the simulation program for the assemssment of reliability of electronic EMC packaging which covers from EMC mixing step to thermal analysis, comparison between a measured and predicted values of material properties of EMC and finitde element analysis of thermal stress are performed. For the experimental testing specimens of fifty, sixty hive and eighty percent filler($13\mu m$, spherical silica) weight fraction are fabricated using tranfer molding. Coefficient of thermal expansion, elastic modulus and thermla conductivity are measured using these specimens and then these measured values are compared with the predicted values by various equations ( such as dilute suspension method. self consistent method, generalized self consistent method, Hashin-Shtrikman's bounds. Shapery's bounds, Nielsen's method and others). Measured values are distributed within the upper and lower bounds of equations. Measured elastic modulus and coefficient of thermal expansion approaches closely the perdicted values with self consisten mehtod and upper bound of Shaperys equation respectively. However small differences of thermal conductivity between the different filler volume fraction are obserbed. FEM analysis indicates that firstly stress is concentrated at the corner section of EMC and secondly EMC with eighty percent filler weight fraction shows less thermal stress when package is cooling down and relatively high thermal stress when package is heating up.

• Journal of Digital Convergence
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• v.18 no.9
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• pp.343-349
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• 2020

This study is cases study of sustainable eco-friendly cosmetics packages. The importance of eco-friendly packages has been increasing as environmental issues have recently emerged around the world. Domestic cosmetics industry are releasing sustainable package designs with these changes, but they are limited. In this study, sustainable package criteria were divided and analyzed based on each of the five prior studies of domestic and foreign cases. Studies have confirmed that there is no diversity in the materials and designs of sustainable packages in Korea compared with other countries. Also, it could be seen that there was the lack of consumer-led eco-friendly campaigns. Starting point of research, it is expected that this study may help continue to study better sustainable cosmetics packages in the future.

• Macromolecular Research
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• v.12 no.1
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• pp.78-84
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• 2004

Advanced epoxy molding compounds (EMCs) should be considered to alleviate the thermal stress problems caused by low thermal conductivity and high elastic modulus of an EMC and by the mismatch of the coefficient of thermal expansion (CTE) between an EMC and the Si-wafer. Though A1N has some advantages, such as high thermal conductivity and mechanical strength, an A1N-filled EMC could not be applied to commercial products because of its low fluidity and high modules. To solve this problem, we used 2-$\mu\textrm{m}$ fused silica, which has low porosity and spherical shape, as a small size filler in the binary mixture of fillers. When the composition of the silica in the binary filler system reached 0.3, the fluidity of EMC was improved more than twofold and the mechanical strength was improved 1.5 times, relative to the 23-$\mu\textrm{m}$ A1N-filled EMC. In addition, the values of the elastic modules and the dielectric constant were reduced to 90％, although the thermal conductivity of EMC was reduced from 4.3 to 2.5 W/m-K, when compared with the 23-$\mu\textrm{m}$ A1N-filled EMC. Thus, the A1N/silica (7/3)-filled EMC effectively meets the requirements of an advanced electronic packaging material for commercial products, such as high thermal conductivity (more than 2 W/m-K), high fluidity, low elastic modules, low dielectric constant, and low CTE.

• Korean Journal of Materials Research
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• v.22 no.7
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• pp.335-341
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• 2012

Recently, the demand for the miniaturization of printed circuit boards has been increasing, as electronic devices have been sharply downsized. Conventional multi-layered PCBs are limited in terms their use with higher packaging densities. Therefore, a build-up process has been adopted as a new multi-layered PCB manufacturing process. In this process, via-holes are used to connect each conductive layer. After the connection of the interlayers created by electro copper plating, the via-holes are filled with a conductive paste. In this study, a desmear treatment, electroless plating and electroplating were carried out to investigate the optimum processing conditions for Cu via filling on a PCB. The desmear treatment involved swelling, etching, reduction, and an acid dip. A seed layer was formed on the via surface by electroless Cu plating. For Cu via filling, the electroplating of Cu from an acid sulfate bath containing typical additives such as PEG(polyethylene glycol), chloride ions, bis-(3-sodiumsulfopropyl disulfide) (SPS), and Janus Green B(JGB) was carried out. The desmear treatment clearly removes laser drilling residue and improves the surface roughness, which is necessary to ensure good adhesion of the Cu. A homogeneous and thick Cu seed layer was deposited on the samples after the desmear treatment. The 2,2'-Dipyridyl additive significantly improves the seed layer quality. SPS, PEG, and JGB additives are necessary to ensure defect-free bottom-up super filling.

• Journal of the Korean Society of Food Science and Nutrition
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• v.36 no.5
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• pp.609-615
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• 2007

This study was conducted to develop the method for the safe supply of Sujeonggwa (cinnamon flavored persimmon punch) in severe environments such as space, desert or deep sea, by the combined treatment of gamma irradiation with other food technologies. Commercially prepared Sujeonggwa powder could be sterilized at 4.5 kGy or above doses. However, sensory characteristics of gamma-irradiated Sujeonggwa decreased depending upon the dose. The combined treatment of vacuum packaging with the addition of vitamin C and cinnamic aldehyde in Sujeonggwa powder could minimize the change of sensory qualities induced by ionizing irradiation.

• Korean Journal of Food Science and Technology
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• v.17 no.6
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• pp.474-481
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• 1985

Radurization effects on fried fish meat paste with Co-60 gamma irradiation at 0-5 kGy and physicochemical aspects of the stored samples at low ($3{\pm}1^{\circ}C$, LT) and room ($10-20^{\circ}C$, RT) temperatures were investigated. The initial microbial loads of the samples were $2.2{\times}10^3/g$ in total bacterial count, $2.8{\times}10^2/g$ in yeasts & molds, and $1.0{\times}10^2/g$ in coliform group, respectively. An irradiation dose of more than 3 kGy was shown to be effective for the radurization of stored samples and there is no apparent difference between air and vacuum packaging groups. The chemical components related to the quality underwent similar changes in the nonirradiated and irradiated groups; however, as the storage time was prolonged the quality of nonirradiated samples rapidly deteriorated. Textural parameters of the samples were little affected by the applied doses, and sensory evaluations showed that 3 kGy irradiation was the optimum dose level to extend the shelf-life of fried fish meat paste up to 2 times at RT and 3 to 4 times at LT, respectively compared with the nonirradiated control.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.113-117
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• 2016

Recently, hydrogen is regarded as important energy in the future, because it is clean and renewable. The photoelectrochemical (PEC) system, which produce hydrogen using water splitting by solar energy, is one of the most promising energy systems because it has abundant energy sources and good theoretical efficiency. GaN has recently been regarded as suitable photoelectrode that could be used to split water to generate hydrogen without extra bias because its band edge position include water redox potential ($V_{redox}=1.23$ vs. SHE). GaN also shows considerable corrosion resistance in aqueous solutions and it is possible to control its properties, such as structure, band gap, and catalyst characteristics, in order to improve solar energy conversion efficiency. But, even if the band edge position of GaN make PEC reaction facilitate without bias, the overpotential of oxygen evolution reaction could reduce the efficiency of system. One of the ways to decrease overpotential is introduction of co-catalyst on photoelectrode. In this paper, we will investigate the effect of manganese dioxide ($MnO_2$) as a co-catalyst. $MnO_2$ particles were dispersed on GaN photoelectrode by spincoater and analyzed properties of the PEC system using potentiostat (PARSTAT4000). After coating $MnO_2$, the flat-band potential ($V_{fb}$) and the onset voltage ($V_{onset}$) were moved negatively by 0.195 V and 0.116 V, respectively. The photocurrent density increased on $MnO_2$ coated sample and time dependence was also improved. These results showed $MnO_2$ has an effect as a co-catalyst and it would enhance the efficiency of overall PEC system.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.2
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• pp.39-44
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• 2020

Recently, numerous researches are being conducted in flexible substrate to apply to wearable devices. Particularly, Conductive substrate researches that can implement the wearable devices on clothing are massive. In this study, we formed fiber substrate spraying CNT and Pd mixed solution on it and plated metal layer with electroless plating. Used SEM equipment and EDS analysis to analysis structure of the plated fiber substrate and discovered Ni layer was created. For check electrical properties, mapping was performed to check surface resistance and distribution of resistance of electroless plated fiber substrate with 4-point probe. It was confirmed that conductivity was improved as the duration of electroless plating was increased, and it was found that distribution of resistance by surface location was uniform. Changes in resistance due to mechanical stress were measured through tensile, bending, and twisting tests. As a result, it was confirmed that resistance change of flexible substrate gradually disappeared as plating time increased. Using UTM (Universal testing machine), it was analyzed mechanical properties of the electroless plated substrate with respect to changes in plating time were improved. In the case of conductive fiber substrate in which electroless plating was performed for 2 hours, tensile strength was increased by 16 MPa than fiber substrate. Based on these results, we found that Ni-CNT-Fabric flexible substrate is adequate for clothing-intergrated conductive substrate and we positively expect that this experiment shows flexible substrate can adapt to and develop not only a wearable device technology but also other fields needing flexibility such as battery, catalyst and solar cell.

• Journal of Sensor Science and Technology
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• v.16 no.1
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• pp.62-67
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• 2007

This paper presents a novel MEMS condenser microphone with rigid backplate to enhance acoustic characteristics. The MEMS condenser microphone consists of membrane and backplate chips which are bonded together by gold-tin (Au/Sn) eutectic solder bonding. The membrane chip has 2.5 mm${\times}$2.5 mm, $0.5{\mu}m$ thick low stress silicon nitride membrane, 2 mm${\times}$2 mm Au/Ni/Cr membrane electrode, and $3{\mu}m$ thick Au/Sn layer. The backplate chip has 2 mm${\times}$2 mm, $150{\mu}m$ thick single crystal silicon rigid backplate, 1.8 mm${\times}$1.8 mm backplate electrode, and air gap, which is fabricated by bulk micromachining and silicon deep reactive ion etching. Slots and $50-60{\mu}m$ radius circular acoustic holes to reduce air damping are also formed in the backplate chip. The fabricated microphone sensitivity is $39.8{\mu}V/Pa$ (-88 dB re. 1 V/Pa) at 1 kHz and 28 V polarization voltage. The microphone shows flat frequency response within 1 dB between 20 Hz and 5 kHz.