• Journal of the Microelectronics and Packaging Society
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• v.24 no.4
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• pp.59-63
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• 2017

The n-type GaN semiconductor has excellent properties as a photoelectrode, but it has disadvantage that its reliability is deteriorated due to the photocorrosion because the oxygen reaction occurs on the surface. For this reason, there are fundamental attempts to avoid photocorrosion reaction of GaN surfaces by using the p-type GaN as a photoelectrode where hydrogen generation reaction occurs on the surface. However, p-type GaN has a problem of low efficiency because of its high resistivity and low hole mobility. In this study, we try to improve the photocurrent efficiency by activation process for the p-type GaN. The p-type GaN was annealed for 1 min. at $500^{\circ}C$ in $N_2$ atmosphere. Hall effect measurement system was used for the electrical properties and potentiostat (PARSTAT4000) was used to measure the photoelectrochemical (PEC) characteristics. Consequently, the photocurrent density was improved more than 1.5 times by improving the activation process for the p-type GaN. Also, its reliability was maintained for 3 hours.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.2 s.31
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• pp.1-9
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• 2004

We investigated the effect of $BaTiO_3$ powder content on the dielectric constant of epoxy/$BaTiO_3$ composite embedded capacitor films (ECFs). Variations of the dielectric constant of epoxy/$BaTiO_3$ composite ECFs with unimodal $BaTiO_3$ powder content were measured. To explain this result, density of the ECFs was measured, and surface and cross section images of the ECFs were observed. In addition, variations of the dielectric constant of epoxy/$BaTiO_3$ composite ECFs with various bimodal combinations were measured. In the case of unimodal powder, the maximum dielectric constant was about 60 at $60\;vol\%$ S4 powder. And more powder addition lowered the dielectric constant of the ECFs, which was due to voids or pores formation by excess $BaTiO_3$ powder. In the case of bimodal combination, $75vol\%\;BaTiO_3$ powder loading and the dielectric constant of 90 were achieved using $S_5+C_1$ combination, biggest and smallest powder combination.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.77-81
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• 2020

Commercialization of flexible OLED displays, such as rollable and foldable displays, has attracted tremendous interest in next-generation display markets. However, during bending deformation, cracking and delamination of thin films in the flexible display panels are the critical bottleneck for the commercialization. Therefore, measuring mechanical properties of the fragile thin films in the flexible display panels is essential to prevent mechanical failures of the devices. In this study, tensile properties of the metal and ceramic nano-thin films were quantitatively measured by using a direct tensile testing method on the water surface. Elastic modulus, tensile strength, and elongation of the sputtered Mo, MoTi thin films, and PECVD deposited SiN_x thin films were successfully measured. As a result, the tensile properties were varied depending on the deposition conditions and the film thickness. The measured tensile property values can be applied to stress analysis modeling for mechanically robust flexible displays.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.2
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• pp.31-43
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• 2019

In this study, polymer elastic bumps were fabricated for the flexible electronic package flip chip bonding and the viscoelastic and viscoplastic behavior of the polymer elastic bumps according to the temperature and load were analyzed using FEM and experiments. The polymer elastic bump is easy to deform by the bonding load, and it is confirmed that the bump height flatness problem is easily compensated and the stress concentration on thin chip is reduced remarkably. We also develop a spiral cap type and spoke cap type polymer elastic bump of $200{\mu}m$ diameter to complement Au metal cap crack phenomenon caused by excessive deformation of polymer elastic bump. The proposed polymer elastic bumps could reduce stress of metal wiring during bump deformation compared to metal cap bump, which is completely covered with metal wiring because the metal wiring on these bumps is partially patterned and easily deformable pattern. The spoke cap bump shows the lowest stress concentration in the metal wiring while maintaining the low contact resistance because the contact area between bump and pad was wider than that of the spiral cap bump.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.91-97
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• 2022

The wettability and rheological properties of solder paste with the size of the solder powder were evaluated. To formulate the solder paste, three types of solder powder were used: T4 (20~28 ㎛), T5 (15~25 ㎛), and T6 (5~15 ㎛). The viscosities of the T4, T5, and T6 solder pastes at 10 RPM were 155, 263, and 418 Pa·s, respectively. After 7 days, the viscosity of the T4 solder paste slightly increased by 2.6% and that of T5 was increased by 20.6%. The viscosity of the T6 solder paste after 7 days could not be measured due to high viscosity. The viscosity variation with solder particle size also affected on the printability of the solder. In the case of the T4 solder paste, printability, slump, bridging, and soldering properties were excellent. On the other hand, T5 showed slight dewetting and solder ball defects. Especially, T6, which the smallest powder size, showed poor printability and dewetting at the edge of solder.

• Journal of the Microelectronics and Packaging Society
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• v.31 no.2
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• pp.23-27
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• 2024

In this study, the time-dependent warpage behavior caused by the viscoelastic properties of prepreg in a printed circuit board (PCB) was analyzed by finite element method (FEM). The accurate viscoelastic properties of the prepreg were measured by stress relaxation test, which were then incorporated into constructed warpage analysis model. When the PCB was subjected to repeated thermal cycles, the warpage of the PCB was restored to its initial state when only the elastic properties of the prepreg were considered, but when the viscoelastic properties were also considered, the warpage was not restored and permanent warpage change occurred. The warpage analysis for three different types of prepreg was conducted to compare their mechanical reliability, and the results showed that materials with elastic properties dominating over viscoelastic properties experienced less warpage, resulting in better mechanical reliability.

• Proceedings of the PSK Conference
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• 2003.10b
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• pp.72.1-72.1
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• 2003

The use of auxiliary labels in many advanced countries has shown that patients and caregivers understanding, safety and compliance with proper administration of medication is significantly increased. Although in Korea we give required information orally and written on the packaging when we dispense medication, many international studies have demonstrated a marked increase in full compliance when auxiliary labels were used. The pharmacist must insure that the patients understand how to take correctly in order to get the maximum effect of treatment. (omitted)

• Journal of the Korean Society of Industry Convergence
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• v.24 no.2_1
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• pp.79-89
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• 2021

Poly(lactic acid) (PLA) is considered as one of the most promising bio-based polymers due to its high strength, high modulus, good processability, transparency after processing, and commercial availability. This study aimed to investigate the mechanical, thermal, and migration properties of poly(lactic acid)/zeolite (10 phr) composites prepared with various biocompatible plasticizers, such as triethyl citrate(TEC), tributyl citrate(TBC), and poly(ethylene glycol)(PEG400), through differential scanning calorimetry(DSC), thermo-gravimetric analysis(TGA) and standard tensile testing. The incorporation of PEG400 significantly increased the elongation at break, and DSC results showed that the addition of plasticizers drastically decreased the T_g of PLA/zeolite composites and improved the melt flow and processability. Besides, it was found from TGA results that PLA/zeolites composites plasticized by TEC and TBC were more easily to be thermally degraded than the composites plasticized by PEG400.

• Food Science of Animal Resources
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• v.31 no.2
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• pp.200-206
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• 2011

Off-flavor and lipid oxidation are possible defects of irradiated bulgogi. This study compared the effects of several physicochemical treatments on microbial safety, volatiles, lipid oxidation, and sensory properties of irradiated beef bulgogi. Samples were separately irradiated with 20 kGy after each treatment such as packaging (aerobic and vacuum), antioxidants (vitamin C + ${\alpha}$-tocopherol (0.0 and 1.0%, w/w)), charcoal teabags (0 and 0.5%), or different temperatures (room temperature, -20, and -70$^{\circ}C$). No bacterial growth was observed (p<0.05) after irradiation of more than 20 kGy during storage at $35^{\circ}C$. Volatiles created by irradiating bulgogi were toluene, heptane, and 1,3-bis(1,1-dimethylethyl)benzene. Irradiation offflavor, lipid oxidation, and deterioration of sensory quality induced by irradiation were effectively reduced (p<0.05) by all physico-chemical treatments tested.

• Corrosion Science and Technology
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• v.6 no.2
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• pp.50-55
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• 2007

The smaller size and higher integration of advanced electronic package systems result in severe electrochemical reliability issues in microelectronic packaging due to higher electric field under high temperature and humidity conditions. Under these harsh conditions, electronic components respond to applied voltages by electrochemical ionization of metal and the formation of a filament, which leads to short-circuit failure of an electronic component, which is termed electrochemical migration. This work aims to evaluate electrochemical migration susceptibility of the pure Sn, Sn-3.5Ag, Sn-3.0Ag-0.5Cu solder alloys in $Na_{2}SO_{4}$. The water drop test was performed to understand the failure mechanism in a pad patterned solder alloy. The polarization test and anodic dissolution test were performed, and ionic species and concentration were analyzed. Ag and Cu additions increased the time to failure of Pb-free solder in 0.001 wt% $Na_{2}SO_{4}$ solution at room temperature and the dendrite was mainly composed of Sn regardless of the solders. In the case of SnAg solders, when Ag and Cu added to the solders, Ag and Cu improved the passivation behavior and pitting corrosion resistance and formed inert intermetallic compounds and thus the dissolution of Ag and Cu was suppressed; only Sn was dissolved. If ionic species is mainly Sn ion, dissolution content than cathodic deposition efficiency will affect the composition of the dendrite. Therefore, Ag and Cu additions improve the electrochemical migration resistance of SnAg and SnAgCu solders.