• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.69-72
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• 2020

In this study, the inverted structured electroluminescence (EL) devices were fabricated with double electron transport layers (ETLs). The conduction band minimum (CBM) of TiO₂ NPs is lower than SnO₂ NPs. Therefore, it is expected that inserting TiO₂ NPs between the SnO₂ layer and the emission layer (EML) will reduce the energy barrier and transport electrons smoothly. The quantum dot light emitting diodes (QLEDs) with double ETLs showed the enhanced emission characteristics than those with only SnO₂ layer.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.73-76
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• 2020

Silver nanowires (AgNWs) intrinsically possess high conductivity, ductility, and network structure percolated in a low density, which have led to many advanced applications of transparent and flexible electronics. Most of these applications require patterning of AgNWs, for which photolithographic and printing-based techniques have been widely used. However, several drawbacks such as high cost and complexity of the process disturb its practical application with patterning AgNWs. Herein, we propose a novel method for the patterning of AgNWs by employing UV-curable adhesive tape with a structure of liner/adhesive layer/polyolefin (PO) film and UV irradiation to simplify the process. First, the UV-curable adhesive tape was attached to AgNWs/polyurethane (PU), and then selectively exposed to UV irradiation by using a photomask. Subsequently, the UV-curable adhesive tape was peeled off and consequently AgNWs were patterned on PU substrate. This facile method is expected to be applicable to the fabrication of a variety of low-cost, shape-deformable transparent and wearable devices.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.11-15
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• 2010

In this paper, we focused on the optimization of bonding conditions for the successful thermo-compression bonding of electrodes between the RPCB and FPCB with Sn-Pb solder. The peel strength was proportionally affected by the bonding conditions, such as pressure, temperature, and time. In order to figure out an optimized bonding condition, fracture energies were calculated through F-x (force-displacement) curves in the peel test. The optimum condition for the thermo-compression bonding of electrodes between the RPCB and FPCB was found to be temperature of $225^{\circ}C$ and time of 7 s, and its peel strength was 22 N/cm.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.2
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• pp.19-26
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• 2020

Flexible displays have been evolved into curved, foldable, and rollable as the degree of bending increases. Due to the presence of brittle electrodes (e.g. indium-tin oxide (ITO)) that easily cracked and delaminated under severe bending deformation, lowering mechanical stress of the electrodes has been critical issue. Because of this, mechanical stress of brittle electrode in flexible displays has been analyzed mostly in terms of bending radius. On the other hand, in order to make rollable display, various mechanical components such as roller and spring are needed to roll-up or extend the screen for the rollable display apparatus. By these mechanical components, brittle electrode in the rollable display is subjected to the excessive tensile stress due to the retracting force as well as the bending stress by the roller. In this study, mechanical deformation of rollable OLED display was modeled considering boundary conditions of the apparatus. An analytical modeling based on the classical beam theory was introduced in order to investigate the mechanical behavior of the rollable display. In addition, finite element analysis (FEA) was used to analyze the effect of mechanical components in the apparatus on the brittle electrode. Furthermore, a strategy for improving the mechanical reliability of the rollable display was suggested through controlling the stiffness of adhesives in the display panel.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.3
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• pp.25-29
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• 2009

High temperature high humidity and thermal shock reliability tests were performed for the board level COB(chip-on-board) flip chip packages using self-formulated and commercial NCPs(non-conductive pastes) to ensure the performance of NCP flip chip packages. It was considered that the more smaller fused silica filler in prototype NCPs is more favorable for high temperature high humidity reliability. The failure of NCP interconnection was affected by the expansion of epoxy due to moisture absorption rather than the fatigue due to thermal stress. It was considered that the NCP having more higher adhesive strength seems to be more favorable to increase the thermal shock reliability.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.1
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• pp.67-71
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• 2021

In this study, graphene layer was grown on metal microwire using chemical vapor deposition. The difference of carbon solubility between copper and nickel resulted in the formation of mono-layer and multi-layer graphene were formed on the surfaces of copper and nickel microwires, respectively. During the growth of graphene at high temperature, copper and nickel were recrytallized and the grain size increased. The ampacity of graphene/copper microwire was improved by approximately 27%, 1.91×105 A/㎠, compared to pristine copper microwire. Similar to this behavior, the ampacity of multilayer graphene/nickel microwire was 4.41×104 A/㎠ which is about about 36% improved compared to the pure nickel microwire. The excellent electrical properties of graphene/metal composites are beneficial for supplying the electrical energy to the high-power electronic devices and equipment.

• Laser Solutions
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• v.16 no.2
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• pp.16-18
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• 2013

In this paper, we fabricated breathable films on the use of microwave oven by using UV nanosecond laser micromachining, and the number of micro-grooves on the film is controlled for different oxygen transfer rate(OTR). As different number of micro-groove, the breath films of 100,000cc, 120,000cc, and 150,000cc can be fabricated. The breath film package of 120,000cc is used for the experiment of steaming a sweet potato. At the result, the sweet potato is well-cooked with enough moisture in the package not bursted.

• Journal of Sensor Science and Technology
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• v.24 no.3
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• pp.159-164
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• 2015

Solid state electrochemical and chemo-resistive gas sensors have been used widely but can operate only under high temperature. For reducing the power consumption and optimizing the structure of the substrate of these sensors, we conducted device and circuit simulations using the COMSOL Multiphysics simulator. For assessing the effective types of substrate and heat isolation, we conducted three-dimensional thermal simulations in two separate parts; (a) by changing the shape of the contacting holes and (b) punching additional holes on the substrate. Thus, it was possible to achieve high temperature in the sensor end of the substrate while maintaining low power consumption, and temperature in the circuit.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.423-426
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• 2005

A new chip on glass(COG) technique by making use of a high power diode laser for LCD driver IC packaging of LCD has been developed. A laser joining technology of the connection of IC chip to glass panel has several advantages over conventional method such as hot plate joining: shorter process time, high reliability of joining, and better fur fine pitch joining. The reach time to cure temperature of ACF in laser joining is within 1 second. In this study, results show that the total process time of joining is reduced by halves than that of conventional method. The adhesion strength is mainly 100-250 N/cm. It is confirmed that the COG technology using high power diode laser joining can be applied to advanced LCDs with a fine pitch.

• Journal of Welding and Joining
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• v.30 no.3
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• pp.15-20
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• 2012

Diagnosing and improving adhesion of advanced packaging and thin films is an essential part of the research and development in microelectronics. In this paper, the four-point bend test and the double cantilever beam test among various adhesion measurement methods are reviewed.