• 제목/요약/키워드: adhesive energy

검색결과 294건 처리시간 0.025초

전자제품 제조용 친환경 점착제의 합성과 물성에 대한 연구 (A Study on the Synthesis and Properties of Environmental Friendly Pressure Sensitive Adhesive for Manufacturing Electronic Products)

  • 조을룡;오지환;김지현;정현정
    • 반도체디스플레이기술학회지
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    • 제15권1호
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    • pp.12-16
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    • 2016
  • Toluene-free pressure sensitive adhesives were synthesized by using butyl acrylate (BA), 2-hydroxy ethyl acrylate, methyl methacrylate, acrylic acid (AA) as monomers and ethyl acetate as a solvent. The polymerization recipes were designed by changing 1, 3, 5 part per hundreds monomer (phm) of AA content on the basis of 100 BA parts. Two crosslinking agents, ethyl glycol diglycidyl ether (EDGE) and isophorone diisocyanate (IPDI) were added to the synthesized polymers to increase adhesion due to crosslinking. In the measurement of properties, holding power, peel strength, and initial tackiness increased with AA content due to crosslinking between carboxyl group in AA and epoxy group in EDGE and isocyanate group in IPDI. In the comparison of two crosslinking agents, EDGE showed better in the three properties than IPDI by better reaction of epoxy group of EDGE to carboxyl group of AA.

Self-Piercing Rivet과 Hybrid Joining을 이용한 자동차용 선도장 칼라강판과 용융아연도금강판의 접합부 기계적 성질 평가 (A Study on Tensile Shear Characteristics of Dissimilar Joining Between Pre-coated Automotive Metal Sheets and Galvanized Steels with the Self-Piercing Rivet and Hybrid Joining)

  • 배진희;김재원;최일동;남대근;김준기;박영도
    • Journal of Welding and Joining
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    • 제34권1호
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    • pp.59-67
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    • 2016
  • The automotive manufactures increase their use of lightweight materials to improve fuel economy and energy usage has a significant influence on the choice of developing materials. To meet this requirements manufacturers are replacing individual body parts with lightweight metals, for these the process treating and painting surfaces is changing. The pre-coated steels are newly developed to avoid the conventional complex and non-environmental painting process in the body-in-white car manufacturing. The development of new joining techniques is critically needed for pre-coated steel sheets, which are electrically non-conductive materials. In the present study, dissimilar combination of pre-coated steel and galvanized steel sheets were joined by the self-piercing rivet, adhesive bonding and hybrid joining techniques. The tensile shear test and free falling high speed crash test were conducted to evaluate the mechanical properties of the joints. The highest tensile peak load with large deformation was observed for the hybrid joining process which has attained 48% higher than the self-piercing rivet. Moreover, the hybrid and adhesive joints were observed better strain energy compared to self-piercing rivet. The fractography analyses were revealed that the mixed mode of cohesive and interfacial fracture for both the hybrid and adhesive bonding joints.

Characterization of a Hybrid Cu Paste as an Isotropic Conductive Adhesive

  • Eom, Yong-Sung;Choi, Kwang-Seong;Moon, Seok-Hwan;Park, Jun-Hee;Lee, Jong-Hyun;Moon, Jong-Tae
    • ETRI Journal
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    • 제33권6호
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    • pp.864-870
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    • 2011
  • As an isotropic conductive adhesive, that is, a hybrid Cu paste composed of Cu powder, solder powder, and a fluxing resin system, has been quantitatively characterized. The mechanism of an electrical connection based on a novel concept of electrical conduction is experimentally characterized using an analysis of a differential scanning calorimeter and scanning electron microscope energy-dispersive X-ray spectroscopy. The oxide on the metal surface is sufficiently removed with an increase in temperature, and intermetallic compounds between the Cu and melted solder are simultaneously generated, leading to an electrical connection. The reliability of the hybrid Cu paste is experimentally identified and compared with existing Ag paste. As an example of a practical application, the hybrid Cu paste is used for LED packaging, and its electrical and thermal performances are compared with the commercialized Ag paste. In the present research, it is proved that, except the optical function, the electrical and thermal performances are similar to pre-existing Ag paste. The hybrid Cu paste could be used as an isotropic conductive adhesive due to its low production cost.

A6451 알루미늄 및 용융아연도금강판의 클린칭 접합특성 및 접합기술의 차체 부품 적용 연구 (A Study on Clinching Characteristics for A6451 Aluminum and Galvanized Steels and the Application of Clinching Technology to Automotive Parts)

  • 권의표;박현경
    • 한국기계기술학회지
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    • 제20권6호
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    • pp.886-893
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    • 2018
  • In this study, clinching characteristics of aluminum and galvanized steels were investigated for the application of clinching as a joining technique to aluminum wheelhouse assembly. A6451 aluminium alloy and galvanized steel sheets were joined by hybrid joining(clinching + adhesive bonding). Tensile-shear load and fracture mode of hybrid joints were investigated. Maximum tensile-shear load of hybrid joints was about six times higher than that of clinched joints without adhesive. Energy absorption values of hybrid joints were higher than those of clinched joints without adhesive as well as resistance spot welded steel joints. Developed aluminum wheelhouse assembly showed higher static stiffness than the existing steel parts. Aluminum wheelhouse inner panel unit was 44% lighter than the steel unit, and the final assembled aluminum wheelhouse was 14.6% lighter than the existing steel parts.

Chitosan-induced biomodification on demineralized dentin to improve the adhesive interface

  • Isabella Rodrigues Ziotti;Vitoria Leite Paschoini;Silmara Aparecida Milori Corona;Aline Evangelista Souza-Gabriel
    • Restorative Dentistry and Endodontics
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    • 제47권3호
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    • pp.28.1-28.12
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    • 2022
  • Objectives: Metalloproteinase-inhibiting agents, such as chitosan, can prevent collagen degradation in demineralized dental substrates, thereby improving the adhesive interface. This study evaluated the bond strength (BS) and chemical and morphological characterization of the adhesive interface after applying chitosan solution to demineralized dentin. Materials and Methods: The 80 third molars were selected. Forty teeth underwent caries induction using the pH cycling method. The teeth were divided according to the treatment: distilled water (control) and 2.5% chitosan solution. The surfaces were restored using adhesive and composite resins. Half of the specimens in each group were aged, and the other half underwent immediate analyses. The teeth were sectioned and underwent the microtensile bond strength test (µTBS), and chemical and morphological analyses using energy-dispersive spectroscopy and scanning electron microscopy, respectively. Data analysis was performed using 3-way analysis of variance. Results: For µTBS, sound dentin was superior to demineralized dentin (p < 0.001), chitosan-treated specimens had higher bond strength than the untreated ones (p < 0.001), and those that underwent immediate analysis had higher values than the aged specimens (p = 0.019). No significant differences were observed in the chemical or morphological compositions. Conclusions: Chitosan treatment improved bond strength both immediately and after aging, even in demineralized dentin.

CFRP/금속간 접합력 강화를 위한 접합공정 연구 (A Study on Bonding Process for Improvement of Adhesion Properties Between CFRP-Metal Dual Materials)

  • 권동준;박성민;박종만;권일준
    • Composites Research
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    • 제30권6호
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    • pp.416-421
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    • 2017
  • CFRP와 금속간의 접합공정이 개선된 구조용 접착제가 제조되었다. 구조용 접착제에 대한 경화시간, 기지재료의 표면상태 그리고 접착제의 양에 따른 최적의 접합공정 조건을 랩쉐어 실험을 통하여 파악하였다. 적합한 접합조건을 확인하기 위해 이종재료간의 접합 파단면 상태를 반사현미경을 이용하여 평가하였다. 이종재료간 접합력 향상을 위해 접착제의 개선뿐만 아니라 CFRP의 표면처리 또한 중요하였다. 구조용 접착제의 경우 180도 조건에 20분의 경화온도 조건이 최적이였으며, CFRP의 표면 처리에 따라 접합특성이 향상됨을 확인하였다. 이종재료 간 접합을 위해 구조용 접착제의 양은 $1.5{\times}10^{-3}g/mm^2$ 조건일 때 최적이었다. 접합공정의 개선 및 최적화를 통해 기존의 접착력 대비 10% 이상의 물성 강화를 나타냄을 확인하였다.

착생에 따른 담쟁이덩굴 흡착근의 부착 특성 (Characteristics of Adhesive Disks in Parthenocissus tricuspidata during Attachment)

  • 이명희;김인선
    • Applied Microscopy
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    • 제41권2호
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    • pp.139-145
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    • 2011
  • 담쟁이덩굴(Parthenocissus tricuspidata)은 줄기에 형성된 흡착근으로 접촉 물체표면에 부착하여 식물체를 여러 방향으로 자라게 한다. 이들 흡착근은 접촉면에 일단 착생하면 잘 떨어지지 않는 부착 특성을 지닌다. 본 연구에서는 적벽돌 벽면에 담쟁이덩굴 부착 시 수반되는 흡착근과 벽면 간의 구조적 변화와 함유하는 성분 간의 연관성에 초점을 두어 주사전자현미경과 에너지 분산 X-선 분광분석법으로 비교 연구하였다. 담쟁이덩굴의 흡착근은 적벽돌 표면에 강력 착생하여 벽면을 피복하며 거의 모든 방향으로 생장한다. 이들이 벽 표면에 접촉하는 경우, 흡착근 배축면 내부조직에서 분비하는 점액성 물질에 의해 흡착근-접촉면 간에 상호작용이 일어난다. 접촉면 상에 있는 거친 표면이나 간극 또는 미세한 틈 사이로 침적된 분비물질들에 의해 흡착근과 접촉면은 빈틈없이 밀착된다. 강력 착생한 흡착근조직 내 세포들은 이미 사멸되고, 접촉면에 분비된 물질과 뒤엉키며 수축되어 벽면에서 잘 분리되지 않는 강력한 착생구조체로 변형된다. 접촉면에 착생하였던 흡착근을 분리하여 하피 표면부위에 함유된 원소를 분석한 결과, 이들 흡착근조직의 표면부위에서 적벽돌을 구성하는 주요 성분들이 거의 검출되었다. 이는 착생 전 후 흡착근- 접촉면 사이에서 진행된 물리적인 밀착 및 부착이 구조적 변형과 성분간의 상호작용을 초래하는 것으로 밝혀졌다.

센서 패키지용 고분자 접착제의 열화 거동 분석 (Kinetic Analyses on Thermal Degradation of Epoxy Based Adhesive for Packaging Application)

  • 김영국;이윤선
    • 마이크로전자및패키징학회지
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    • 제24권1호
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    • pp.67-73
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    • 2017
  • 열중량 분석(Thermogravimetry)을 이용하여 열화시간 경과에 따른 접착 소재의 열에 대한 열화 특성을 분석하였다. 실험에는 여섯 가지의 온도 승온률에서 측정된 데이터를 이용하여 열화에 따른 동적 반응을 분석하였다. 이 데이터를 바탕으로 아레니우스 방정식을 이용하여 활성 에너지와 비례 상수 등 모델에 필요한 계수를 계산하였다. 또한 열화거동을 예측하는 방정식으로는 무게 감소에 따른 간단한 n차 방정식을 이용하였다. 구해진 예측 모델은 실험 데이터와 비교하여 검증하였다. 계산 결과 각 승온률에 따라 활성화 에너지의 크기가 다름에 따라 평균값을 사용하여 계산한 결과는 낮은 승온률인 경우에는 잘 예측하였지만 높은 승온률인 경우에는 측정값과 차이를 보였다. 이와 같은 문제를 해결하기 위해 지수함수 급수를 이용한 새로운 모델링 방법이 처음 시도되었으며 예측된 결과는 승온률에 관계없이 실험 데이터와 잘 일치하였다.

아크릴산 단량체와 아지리딘 경화제 함량에 따른 점착제의 점착물성 변화 (Adhesive Property Changes Associated with the Content of Acrylic Acid Monomer and Aziridine Crosslinking Agent)

  • 최환석;황효연;정선경;이승구;이기윤
    • 폴리머
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    • 제36권1호
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    • pp.29-33
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    • 2012
  • 관능성 단량체로서 acrylic acid(AA)를 사용하였고, 기본 단량체로서는 2-ethylhexyl acrylate(2-EHA)를 사용하여 용액중합의 방법으로 점착제를 합성하였다. 점착제의 점착물성 중에 AA와 경화제 함량에 따른 점착제의 표면에너지와 물성변화 연구를 조사하였다. 합성된 점착제의 구조는 FTIR을 통하여 확인하였고 점도와 분자량은 Brookfield 점도계와 GPC를 사용하여 각각 측정하였다. 분자량과 점도는 AA가 6 wt%까지는 함량증가에 따라 증가하였으며 6 wt% 이상에서는 감소하였다. 이러한 경향은 표면에너지 역시 AA 함량증가에 따라 COOH 그룹에 의한 극성 강화로 표면에너지는 증가하였다. 반면, 점착력은 분자량과 반비례 관계를 보였으며 AA 함량과 경화제 함량 증가에 따라 감소하는 경향을 나타내었다.

Negative PR의 기밀 특성 (Hermetic Characteristics of Negative PR)

  • 최의정;선용빈
    • 반도체디스플레이기술학회지
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    • 제5권2호
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    • pp.33-36
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    • 2006
  • Many issues arose to use the Pb-free solder as adhesive materials in MEMS ICs and packaging. Then this study for easy and simple sealing method using adhesive materials was carried out to maintain hermetic characteristic in MEMS Package. In this study, Hermetic characteristic using negative PR (XP SU-8 3050 NO-2) as adhesive at the interface of Si test coupon/glass substrate and Si test coupon/LTCC substrate was examined. For experiment, the dispenser pressure was 4 MPa and the $200\;{\mu}m{\Phi}$ syringe nozzle was used. 3.0 mm/sec as speed of dispensing and 0.13 mm as the gap between Si test coupon and nozzle was selected to machine condition. 1 min at $65^{\circ}C$ and 15 min at $95^{\circ}C$ as Soft bake, $200\;mj/cm^2$ expose in 365 nm wavelength as UV expose, 1 min at $65^{\circ}C$ and 6 min at $95^{\circ}C$ as Post expose bake, 60 min at $150^{\circ}C$ as hard bake were selected to activation condition of negative PR. Hermetic sealing was achieved at the Si test coupon/ glass substrate and Si test coupon/LTCC substrate. The leak rate of Si test coupon/glass substrate was $5.9{\times}10^{-8}mbar-l/sec$, and there was no effect by adhesive method. The leak rate of Si test coupon/LTCC substrate was $4.9{\times}10^{-8}mbar-l/sec$, and there was no effect by dispensing cycle. Better leak rate value could be achieved to use modified substrate which prevent PR flow, to increase UV expose energy and to use system that controls gap automatically with vision.

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