• Journal of Adhesion and Interface
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• v.6 no.4
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• pp.12-17
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• 2005

Natural fiber/phenolic biocomposites with chopped henequen fibers treated at various levels of electron beam irradiation (EBI) were made by means of a matched-die compression molding method. The interfacial property was explored in terms of interfacial shear strength measured by a single fiber microbonding test. The thermal properties were studied in terms of storage modulus, tan ${\delta}$, thermal expansion and thermal stability measured by dynamic mechanical analysis, thermomechanical analysis and thermogravimetric analysis, respectively. The result showed that the interfacial and thermal properties depend on the treatment level of EBI done to the henequen fiber surfaces. The present result also demonstrates that 10 kGy EBI is most preferable to physically modify the henequen fiber surfaces and then to improve the interfacial property of the biocomposite, supporting earlier results studied with henequen/poly (butylene succinate) and henequen/unsaturated polyester biocomposites.

• Journal of Adhesion and Interface
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• v.12 no.3
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• pp.94-98
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• 2011

Ballistic property of Heracron/phenol composites was evaluated as a function of polyurethane (PU) type and their loadings. First, prepregs of phenol and polyurethane were prepared by spray coating on Heracron fabric and then they were utilized to prepare composite by varying their ratio. Next, they were consolidated at $150^{\circ}C$ for 25 min at $150kg/cm^2$ pressure and then ballistic property was measured with 1.1 g FSP (22 cal). V50 was evaluated interms of polyurethane type and ratio of phenol/PU prepreg.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07a
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• pp.78-81
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• 2004

In this paper, the effect of adhesion properties of semiconductive-insulating interface layer of silicone rubber on electrical properties was investigated. Surface structure and adhesion of semiconductive silicon rubber by surface asperity was obtained from SEM and T-peel test. In addition, ac breakdown test was carried out for elucidating the change of electrical property by roughness treatment. From the results, Adhesive strength of semiconductive-insulation interface was increased with surface asperity. Dielectric breakdown strength by surface asperity decreased than initial Specimen, but increased from Sand Paper #1200. According to the adhesional strength data unevenness and void formed on the silicone rubber interface expand the surface area and result in improvement of adhesion. Before treatment Sand Paper #1200, dielectric breakdown strength was decreased by unevenness and void which are causing to have electric field mitigation small. After the treatment, the effect of adhesion increased dielectric breakdown strength. It is found that ac dielectric breakdown strength was increased with improving the adhesion between the semiconductive and insulating interface.

• Journal of Adhesion and Interface
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• v.4 no.4
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• pp.7-14
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• 2003

"Tack" is defined as "the property that enables an adhesive to form a bond with the surface of another material upon brief contact under light pressure". The tack depends on a number of experimental parameters. We can control various experimental factors (contact force, dwell time, pretest speed) using probe tack tester. We are here concerned with pretest speed of experimental factors using SIS-based hotmelt PSA and water-borne acrylic PSA.

• Journal of the Korean institute of surface engineering
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• v.42 no.1
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• pp.21-25
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• 2009

Using an evaporation system, $SiO_2$ was deposited as a buffer layer between a PET substrate and a ITO layer and then ITO/$SiO_2$/PET layers were annealed for 1.5 hours at the temperature of $180^{\circ}C$. Adhesion and electro-optical properties of ITO films were studied with thickness variance of a $SiO_2$ buffer layer. As a result of introduction of the $SiO_2$ buffer layer, sheet resistance and resistivity increased and a ITO film with optimum sheet resistance ($529.3{\Omega}/square$) for an upper ITO film of resistive type touch panel could be obtained when $SiO_2$ of $50{\AA}$ was deposited. And it was found that ITO films with $SiO_2$ buffer layer have higher transmittance of $88{\sim}90%$ at 550 nm wavelength than ITO films with no buffer layers and the transmittance was enhanced as $SiO_2$ thickness increased from $50{\AA}$ to $100{\AA}$. Adhesion property of ITO films with $SiO_2$ buffer layers became better than ITO films with no buffer layers and this property was independent of $SiO_2$ thickness variance ($50{\sim}100{\AA}$). By depositing a $SiO_2$ buffer layer of $50{\AA}$ on the PET substrate and sputtering a ITO thin film on the layer, a ITO film with enhanced adhesion, electro-optical properties could be obtained.

• Composites Research
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• v.30 no.6
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• pp.416-421
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• 2017

The structural adhesive have been manufactured for improvement of bonding process between CFRP and metal. The optimal condition for bonding process were investigated by evaluating the lap shear strength with amount of adhesive and curing time and the surface treatment of the CFRP. To confirm proper adhesion conditions, the fracture sections between CFRP and metal was observed using reflection microscope. Not only the improvement of the adhesion condition was important, but surface treatment on CFRP was also important. The optimal curing temperature was at $180^{\circ}C$ for 20 minutes. The improvement for adhesive property was confirmed After surface treatment on CFRP. The optimal amount of structural adhesive for bonding between CFRP and metal was $1.5{\times}10^{-3}g/mm^2$. Through the optimization of bonding process, the improvement of mechanical property over 10% is confirmed in comparison with existing adhesive.

• Journal of Adhesion and Interface
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• v.23 no.3
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• pp.59-69
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• 2022

In composite materials, the adhesion and interfacial properties were the most important factors to obtain high performance of mechanical properties. This review paper had been focused on the micromechanical evaluation methods for the interfacial property historically. The interfacial property of fiber-reinforced composites (FRC) could be evaluated using only a single fiber and matrix via various micromechanical testing methods. Self-sensing due to the fracture behavior of FRC could be determined and discussed more critically and clearly using electro-micromechanical evaluation. In this paper, the research trends for micro-mechanical evaluation of composites was summarized, and their practical applications would be suggested in the future.

• Journal of the Korean Wood Science and Technology
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• v.32 no.5
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• pp.59-65
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• 2004

The present study aims to optimise the process parameters of fish glue and adhesion property through room temperature in terms of curing time and opened assembly time for attaining best adhesion strength to wood (Yellow birch, B. alleghaniensis). The uncured and cured fish glue have been characterised by TGA, DSC, FT-JR. It is observed that with increasing curing time up to 48 H, tensile lap shear strength of adhesive joint of fish glue to wood increases and decreases after 48 H. At 15 min. opened assembly time, lap shear strength increases up to 4833 kgf/cm² and decreases after 15 min.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.251-251
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• 2016

For several decades, industrial processes consume a huge amount of raw water for various objects that consequently results in the generation of large amounts of wastewater. Wastewaters are consisting of complex mixture of different inorganic and organic compounds and some of them can be toxic, hazardous and hard to degrade. These effluents are mainly treated by conventional technologies such are aerobic and anaerobic treatment and chemical coagulation. But, these processes are not suitable for eliminating all hazardous chemical compounds form wastewater and generate a large amount of toxic sludge. Therefore, other processes have been studied and applied together with these techniques to enhance purification results. These include photocatalysis, absorption, advanced oxidation processes, and ozonation, but also have their own drawbacks. In recent years, electrochemical techniques have received attention as wastewater treatment process that could be show higher purification results. Among them, boron doped diamond (BDD) attract attention as electrochemical electrode due to good chemical and electrochemical stability, long lifetime and wide potential window that necessary properties for anode electrode. So, there are many researches about high quality BDD on Nb, Ta, W and Si substrates, but, their application in effluents treatment is not suitable due to high cost of metal and low conductivity of Si. To solve these problems, Ti has been candidate as substrate in consideration of cost and property. But there are adhesion issues that must be overcome to apply Ti as BDD substrate. Al, Cu, Ti and Nb thin films were deposited on Ti substrate to improve adhesion between substrate and BDD thin film. In this paper, BDD films were deposited by hot filament chemical vapor deposition (HF-CVD) method. Prior to deposition, cleaning processes were conducted in acetone, ethanol, and isopropyl alcohol (IPA) using sonification machine for 7 min, respectively. And metal layer with the thickness of 200 nm were deposited by DC magnetron sputtering (DCMS). To analyze microstructure X-ray diffraction (XRD, Bruker gads) and field emission scanning electron microscopy (FE-SEM, Hitachi) were used. It is confirmed that metal layer was effective to adhesion property and improved electrode property. Electrochemical measurements were carried out in a three electrode electrochemical cell containing a 0.5 % H2SO4 in deionized water. As a result, it is confirmed that metal inter layer heavily effect on BDD property by improving adhesion property due to suppressing formation of titanium carbide.

• Journal of the Korean institute of surface engineering
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• v.28 no.5
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• pp.267-275
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• 1995

Electron beam can provide convenient way to heat the substrate during Hollow Cathode Discharge (HCD) ion plating of Ti(C, N)films. Densification of columnar structrue is enhanced by longer duration of electron beam heating(EBH). While strong(111) texture is identified always to be formed, the amount of (200) oriented grains which coherently interfaced with carbide particles of the substrate increased with heating(EBH). In turns, these crystallogaphical change lead to the increase of micro hardness and adhesion of coating. Adhesion of Ti(C, N) films increased more dramatically in case of ASP30 substrate of which carbide particles dispersed more finely than M42. Therefore, it could be concluded that both the density of film and interfacial structure can affect the adhesion property. Overheating of substrate could be resulted in low adhesion resistance due to high residual stress developed in the film.