• Textile Coloration and Finishing
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• v.22 no.4
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• pp.300-305
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• 2010

Poly(ethylene terephthalate)(PET) tire cord has relatively lower adhesion properties caused by limited reacting sites. In order to improve the adhesion force between PET tire cord and rubber, an additional process to activate surface of PET has been employed. Atmospheric plasma was used to substitute the chemical finishing process of PET tire cord as a green dipping process. Contact angle was measured to confirm surface change of PET after plasma treatment. The treated PET tire cords with/without resorcinol-formaldehyde-latex(RFL) and unvulcanized rubber were vulcanized in a testing mold at $160^{\circ}C$. After atmospheric plasma treatment of PET tire cord, adhesion force was somewhat increased under some conditions.

• Journal of environmental and Sanitary engineering
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• v.14 no.4
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• pp.1-8
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• 1999

This study was aimed ultimately to develop an adsorption process treating heavy metal wastewater by utilizing activated carbon using flyash. The affecting factors in adsorption process on heavy metal by flyash adhesion-activated carbon are s follows. Factors such as pH, and quality of activated carbon, and reaction time made batch adsorption isotherm described adsorption capacity was made use of the investigation to evaluate adsorptive possibility of heavy metal.As the results of this study, H ion has influence on adsorption of heavy metal if pH is low. As reaction time is transformed, factors such as optimum reaction time is taken into consideration an adsorptive process of heavy metal because an adsorption and a reduction process occur. Adsorption isotherm of adhesion-activated carbon was generally obeyed to Freundlich formular than Langmuir formular and Freundlich constant, l/n were obtained in the range of 0.1~0.5.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.27 no.9
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• pp.1517-1523
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• 2003

Deep X-ray lithography (DXRL), a fabrication method for the production of microstructures with a high aspect ratio, plays an important role in the subsequent electroplanting process. However, secondary radiation is generated during X-ray exposure and damages the resist adhesion to the metal layer. To solve adhesion problems, we modified the conventional DXRL process, changing the sequence of polymer adhesion in DXRL process. With optimized X-ray exposure and development conditions based on a calculated and modified X-ray power spectrum, we fabricated various polymer microstructures and achieved a maximum aspect ratio of 40.

• Composites Research
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• v.30 no.6
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• pp.416-421
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• 2017

The structural adhesive have been manufactured for improvement of bonding process between CFRP and metal. The optimal condition for bonding process were investigated by evaluating the lap shear strength with amount of adhesive and curing time and the surface treatment of the CFRP. To confirm proper adhesion conditions, the fracture sections between CFRP and metal was observed using reflection microscope. Not only the improvement of the adhesion condition was important, but surface treatment on CFRP was also important. The optimal curing temperature was at $180^{\circ}C$ for 20 minutes. The improvement for adhesive property was confirmed After surface treatment on CFRP. The optimal amount of structural adhesive for bonding between CFRP and metal was $1.5{\times}10^{-3}g/mm^2$. Through the optimization of bonding process, the improvement of mechanical property over 10% is confirmed in comparison with existing adhesive.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.8
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• pp.1698-1708
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• 2002

The main topic covered in this paper is that of the impact process, that is, where two bodies come into contact and rebound or stick together. This paper presents how to determine the rebound velocities of a microparticle that approaches a surface with arbitrary initial velocities and relate the impact process to the physical properties of the materials and to the adhesion force. Actual adhesion forces demonstrate a significant amount of energy dissipation in the form of hysteresis, and act generally in a normal to the contact surfaces. Microparticles must also contend with forces tangent to the contact surfaces, namely Coulomb dry friction. The developed model has an algebraic form based on the principle of impulse and momentum and hypothesis of energy dissipation. Finally, several analyses are carried out in order to estimate impact parameters and the developed analytical model is validated using experimental results.

• Korean Journal of Materials Research
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• v.11 no.11
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• pp.923-928
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• 2001

An electrolytic silver plating process has been successfully developed for terminated electrode parts of dielectric ceramic resonator. High adhesion strength and high Qu is obtained and blister occurance is minimized under plating condition with $HNO_3$750 $m\ell/\ell$ and HF $ 250m\ell/\ell$ solution at $25^{\circ}C$ for 20 minutes. Adhesion strength has the highest value, 3.2 kg/mm$^2$ at etching temperature of $25^{\circ}C$. Adhesion strength, Qu and blister occurance are monotonically increased with the thickness of electrodeposition layer. In case of electrodeposition of Ag, Qu value of 380 has obtained higher than in case of electrolytic Cu plating with Qu value of 325. Therefore, terminated electrode parts of dielectric ceramic resonator reducing dielectric loss can be obtained using prensent process.

• Elastomers and Composites
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• v.57 no.2
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• pp.48-54
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• 2022

A polymeric adhesion promoter was synthesized to improve the adhesive strength of the Ni lead frame/epoxy composite. Poly(itaconic acid-co-acrylamide) (IAcAAM) was prepared by copolymerizing itaconic acid and acrylamide. We compared the adhesive strength between the Ni lead frame and epoxy composite according to the molecular weight of IAcAAM. The molecular weight of IAcAAM was controlled using an initiator, which made it possible to use IAcAAM in the epoxy molding compound (EMC) manufacturing process by modulating the melting temperature. The adhesive strength of Ni lead frame/epoxy composite increased with the addition of IAcAAM to the epoxy composite. In addition, as the molecular weight of IAcAAM increased, the adhesive strength of the Ni lead frame/epoxy composite slightly increased. We confirmed that IAcAAM with an appropriate molecular weight can be used in the EMC manufacturing process and increase the adhesive strength of the Ni lead frame/epoxy composite.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.11a
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• pp.232-235
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• 2002

Recently developed liquid silicone rubber (LSR) can be cured by platinum catalyzed additional hydrosilylation mechanism and has the advantage of no byproduct compared to traditional millable peroxide curing silicone rubber. We investigated the characteristics of dielectric breakdown of silicone rubber and adhesion properties between semi-conductive LSR and insulating LSR for high voltage application of pre-molded joint (PMJ). In order to understand the dielectric breakdown characteristics, we used the sheet samples and the paired type rogowski insert electrode system. The breakdown strength and adhesion strength of LSR (E-3) were superior to those of several silicone rubbers. Adhesion strength could be improved by curing at high temperature without post-curing process or enhanced by post-curing process. When LSR (E-3) was cured at $(150^{\circ}C{\times}10min$ semi-conductive )${\times}$ ($175^{\circ}C{\times}10min$ insulation), it showed the high breakdown strength with low standard deviation, and good adhesion strength. In this results, we could apply this process to the fabrication of PMJ without post-curing.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.13 no.1
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• pp.97-103
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• 2000

This paper deals with residual stresses induced at the viscoelastic adhesive layer between the semiconductor chip and the leadframe during adhesion process. The adhesive layer has been assumed to be“thermorheologically simple”. The time-domain boundary element method(BEM) has been employed to investigate the behavior of interface stresses. Numerical results show that very large stress gradients are present at the interface corner and such singularity might lead to local yielding or edge delamination.

• Korean Journal of Materials Research
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• v.20 no.6
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• pp.319-325
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• 2010

3-D IC integration enables the smallest form factor and highest performance due to the shortest and most plentiful interconnects between chips. Direct metal bonding has several advantages over the solder-based bonding, including lower electrical resistivity, better electromigration resistance and more reduced interconnect RC delay, while high process temperature is one of the major bottlenecks of metal direct bonding because it can negatively influence device reliability and manufacturing yield. We performed quantitative analyses of the interfacial properties of Al-Al bonds with varying process parameters, bonding temperature, bonding time, and bonding environment. A 4-point bending method was used to measure the interfacial adhesion energy. The quantitative interfacial adhesion energy measured by a 4-point bending test shows 1.33, 2.25, and $6.44\;J/m^2$ for 400, 450, and $500^{\circ}C$, respectively, in a $N_2$ atmosphere. Increasing the bonding time from 1 to 4 hrs enhanced the interfacial fracture toughness while the effects of forming gas were negligible, which were correlated to the bonding interface analysis results. XPS depth analysis results on the delaminated interfaces showed that the relative area fraction of aluminum oxide to the pure aluminum phase near the bonding surfaces match well the variations of interfacial adhesion energies with bonding process conditions.