• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Membrane Journal
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• v.25 no.3
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• pp.287-294
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• 2015

Photovoltaic (PV) modules are environmentally friendly energy-conversion devices to generate electricity via the photovoltaic effect of semiconductors on solar energy. One of key elements in PV modules is "Backsheet," a multi-layered film to protect the devices from a variety of chemicals including water vapor. A representative Backsheet is composed of polyvinyl fluoride (PVF) and poly(ethylene terephthalate) (PET). PVF is relatively expensive, while showing excellent resistance to chemical attacks. Thus, it is necessary to develop alternatives which can lower its high production cost and guarantee lifetime applicable to practical PV modules at the same time. In this study, PET films with certain levels of crystallinity were utilized instead of PVF. Since it is well known that PET is suffering from trans-esterification and hydrolysis under a wide pH range, it is needed to understand decomposition behavior of the PET films under PV operation conditions. To evaluate their chemical decomposition behavior within a short period of times, accelerated decomposition test protocol is developed. Moreover, electrochemical long-term performances of the PV module employing the PET-based Backsheet are investigated to prove the efficacy of the proposed concept.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.10
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• pp.424-429
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• 2018

In this study, an expansion joint that is susceptible to waterhammer was tested for its vibration durability. The operation data for the hydraulic actuator was the expansion length of the expansion joint when the waterhammer occurred. In the case of the vibration durability test, the internal temperature status of the expansion joint was assumed to be a stress factor and a lifespan prediction model was assumed to follow the Arrhenius model. A test was carried out by increasing the internal temperature status at $30^{\circ}C$, $50^{\circ}C$, and $65^{\circ}C$. By a linear transformation of the lifespan data for each temperature, a constant value and activation energy coefficient was induced for the Arrhenius equation and verified by comparing the value of a lifetime prediction model with the experimental value at $85^{\circ}C$. The failure modes of the ongoing or finished test were leakage, bellows separation, and internal deformation. In the future, a composite lifespan prediction model, including two more stress factors, will be developed.

• Journal of KIISE:Software and Applications
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• v.28 no.9
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• pp.669-680
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• 2001

Genetic Algorithms are optimization algorithm that mimics biological evolution to solve optimization problems. Genetic algorithms provide an alternative to traditional optimization techniques by using directed random searches to locate optimal solutions in complex fitness landscapes. Hybrid genetic algorithm that is combined with local search called learning can sustain the balance between exploration and exploitation. The genetic traits that each individual in the population learns through evolution are transferred back to the next generation, and when this learning is combined with genetic algorithm we can expect the improvement of the search speed. This paper proposes a genetic algorithm based Cellular Learning with accelerated learning capability for function optimization. Proposed Cellular Learning strategy is based on periodic and convergent behaviors in cellular automata, and on the theory of transmitting to offspring the knowledge and experience that organisms acquire in their lifetime. We compared the search efficiency of Cellular Learning strategy with those of Lamarckian and Baldwin Effect in hybrid genetic algorithm. We showed that the local improvement by cellular learning could enhance the global performance higher by evaluating their performance through the experiment of various test bed functions and also showed that proposed learning strategy could find out the better global optima than conventional method.

• Polymer(Korea)
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• v.37 no.1
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• pp.5-14
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• 2013

In this paper the effect of UV (ultraviolet) exposure on HDPE (high density polyethylene)-smooth and f-PP (flexible polypropylene) geomembranes is evaluated under UVB-313 (ultraviolet wavelength 290-315 nm) exposure. Tensile property, melt flow index (MFI), oxidation induction time (OIT), both standard-OIT and high pressure-OIT and Fourier transform infrared spectroscopy/attenuated total reflectance (FTIR/ATR) results are discussed. Although tensile properties of the exposed geomembrane samples remained unchanged, the depletion of antioxidants was found higher for f-PP than for HDPE geomembrane. Arrhenius model by extrapolation was used on the data to predict the antioxidant lifetime to a typical site temperature of $20^{\circ}C$. There was no significant difference between the MFI value of the virgin and UV exposed HDPE geomembrane samples but a decrease in MFI was found in f-PP geomembrane that signifies that crosslinking has occurred. From FTIR spectra, the small peak (near $1750\;cm^{-1}$) observed in the spectrum of UV exposed sample corresponds to a carbonyl (C=O) linkage, which suggests that oxidation has occurred in the polymer structure, and another new band for f-PP between 3100 and $3500\;cm^{-1}$ is attributed to a hydroxyl bond and/or hydroperoxide bond.

• Journal of Adhesion and Interface
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• v.20 no.1
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• pp.9-14
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• 2019

The change of three different reagents for electrical conductive paint using aircraft coating with elapsing time of exposure to different condition was investigated. Three different reagents were poured into the vial bottles, stored in air condition and room temperature and observed with elapsing days. In addition, adhesion property of paint was tried using cross cut tape test after storage of $N_2$ atmosphere. The weight of each different reagent was measured along with elapsing time. To confirm the change of chemical component with exposure of air atmosphere, FT-IR was performed. The weight of part A and Part B decreased slightly whereas the weight of part C decreased rapidly and the precipitation was remained. The part B was cured after exposure of $N_2$ atmosphere and the 2250 cm-1 from FT-IR peak decreased slowly at the same time. It was considered that the water contained in air accelerated the reaction of -NCO functional groups and it caused the curing whereas $N_2$ atmosphere not contained water and it resulted in the retardancy of curing.