• 한국정밀공학회지
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• 제7권2호
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• pp.113-123
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• 1990

To study deleterious effects of contaminants contained in lubricating systems, the effects of fine alumina particle concentration and size on the critical failure load, friction and wear characteristic were examined on boundary lubrication condition using the four ball machine. The following conclusions are deduced: The abrasive is found to cause a transition from mild wear to severe wear at less severe conditions than with clean oil. In mild wear region the friction and wear increase with particle size and concentration, but in severe wear region do not exhibit any definite trend. In relation to film thinckness there is a threshold of particle size beyond which the failure load no longer decreases with particle size.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회A
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• pp.1880-1884
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• 2008

Cleaning is required following CMP (chemical mechanical planarization) to remove particles. The minimization of particle residue is required with each successive technology generation, and the cleaning of wafers becomes more complicated. In copper damascene process for interconnection structure, it utilizes 2-steop CMP consists of Cu CMP and barrier CMP. Such a 2-steps CMP process leaves a lot of abrasive particles on the wafer surface, cleaning is required to remove abrasive particles. In this study, the buffing is performed various conditions as a cleaning process. The buffing process combined mechanical cleaning by friction between a wafer and a buffing pad and chemical cleaning by buffing solution consists of tetramethyl ammonium hydroxide (TMAH)/benzotriazole(BTA).

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2012년도 춘계학술대회 논문집
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• pp.123-124
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• 2012

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2008년도 춘계학술대회 논문집
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• pp.439-440
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• 2008

• Tribology and Lubricants
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• 제27권1호
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• pp.7-12
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• 2011

Interest in advanced machining process such as AJM(abrasive jet machining) and CMP(chemical-mechanical polishing) using micro/nano-sized abrasives has been on the increasing demand due to wide use of super alloys, composites, semiconductor and ceramics, which are difficult to or cannot be processed by traditional machining methods. In this paper, the effects of pressure, wafer moving velocity and fluid viscosity were investigated by 2-dimensional finite element analysis method considering slurry fluid flow. From the investigation, it could be found that the simulation results quite corresponded well to the Preston's equation that describes pressure/velocity dependency on material removal. The result also revealed that the stress and corresponding material removal induced by the collision of particle may decrease under relatively high wafer moving speed due to the slurry flow resistance. In addition, the increase in slurry fluid viscosity causes the reduction of material removal rate. It should be noted that the viscosity effect can vary with the shape of abrasive particle.

• 한국정밀공학회지
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• 제30권12호
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• pp.1253-1258
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• 2013

Ceramic particles as polishing abrasives are often used in a magnetic abrasive polishing process because they have strong wear resistance. Non-ferromagnetic ceramic abrasives should be mixed with ferromagnetic iron particles for controlling the mixture within a magnetic brush during the polishing process. This study describes the application of the ceramic particles for the magnetic abrasive polishing. The distribution of the magnetic abrasives attached on a tool varies with magnetic flux density and tool rotational speed. From the correlation between abrasive adhesion ratio in the tool and surface roughness produced on a workpiece, practical polishing conditions can be determined. A step-over for polishing a large sized workpiece is able to be selected by a S curve, and an ultrasonic vibration assisted MAP produces a better surface roughness and increases a polishing efficiency.

• 한국윤활학회:학술대회논문집
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• 한국윤활학회 2000년도 제32회 추계학술대회 정기총회
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• pp.332-340
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• 2000

Friction properties of automotive brake pads containing different types of abrasivess were investigated. Five different abrasives, including o-quartz, magnesia, magnetite, alumina, zircon, were employed in this investigation and size effects of the abrasives on friction characteristics were also studied using 1, 50, 140$\mu\textrm{m}$ size zircon. Experimental results showed that the hardness and size of these abrasive particles were strongly related to friction behaviors and wear mechanisms. Harder and smaller abrasives showed higher friction coefficient and more wear. The surfaces of friction materials with different sizes of abrasives showed that two different modes of abrasion (two-body and three-body abrasion) appeared during sliding. Considering the above results, abrasive materials were thought to destroy transfer film and the extent of the destruction depends on the types and sizes of abrasive particles. A mechanism of the wear mode transition (two-body to three body abrasive motion) was suggested considering the binding energy and friction energy in terms of abrasive particle size.

• 수산해양기술연구
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• 제49권4호
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• pp.492-499
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• 2013

The characteristics of abrasive wear of the rubber matrix composites filled with nano sized silica particles were investigated at ambient temperature by pin-on-disc friction test. The range of volume fraction of silica particles tested are between 11% to 25%. The cumulative wear volume and friction coefficient of these materials on particle volume fraction were determined experimentally. The major failure mechanisms were lapping layers, deformation of matrix, ploughing, deboding of particles and microcracking by scanning electric microscopy photograph of the tested surface. The cumulative wear volume showed a tendency to increase nonlinear with increase of sliding distance. As increasing the silica particles of these composites indicated higher friction coefficient.

• Tribology and Lubricants
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• 제39권2호
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• pp.72-75
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• 2023

Silicon carbide (SiC) is used as a substrate material for power semiconductors; however, SiC chemical mechanical polishing (CMP) requires considerable time owing to its chemical stability and high hardness. Therefore, researchers are attempting to increase the material removal rate (MRR) of SiC CMP using various methods. Mixed-abrasive CMP (MAS CMP) is one method of increasing the material removal efficiency of CMP by mixing two or more particles. The aim of this research is to study the mathematical modeling of the MRR of MAS CMP of SiC with SiO₂ and TiO₂ particles. With a total particle concentration of 32 wt, using 80-nm SiO₂ particles and 25-nm TiO₂ particles maximizes the MRR at 8 wt of the TiO₂ particle concentration. In the case of 5 nm TiO₂ particles, the MRR tends to increase with an increase in TiO₂ concentration. In the case of particle size 10-25 nm TiO₂, as the particle concentration increases, the MRR increases to a certain level and then decreases again. TiO₂ particles of 25 nm or more continuously decreased MRR as the particle concentration increased. In the model proposed in this study, the MRR of MAS CMP of SiC increases linearly with changes in pressure and relative speed, which shows the same result as the Preston's equation. These results can contribute to the future design of MAS; however, the model needs to be verified and improved in future experiments.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2003년도 추계학술대회
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• pp.313-317
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• 2003

Micro-Channel ultra-precision polishing is a new technology used in magnetic field-assisted relishing. In this paper, an electromagnet or the i18 of test system was designed and manufactured. A size of magnetic abrasive is used on 25~75${\mu}{\textrm}{m}$ and for the polish a micro-channel upper part. A surface of channel which is not even is manufactured using magnetic abrasive finishing at upper surface of micro-channel. As a result, the surface roughness rose by 80％ after upper surface of micro- channel was polished up 8 minutes by polishing.