• 한국산학기술학회논문지
• /
• 제16권8호
• /
• pp.5541-5549
• /
• 2015

본 논문은 반도체 웨이퍼 공정 배기가스 수분제어장치에 적용하기 위하여 인덕션 히터를 사용해서 안전하고 효율적인 전력을 사용하는 히터에 대한 설계방법을 제안한다. 수분을 제거하기 위해서 질소 가스의 흡열 반응을 발생하는 필라멘트 히터를 이용하여 배기가스 제거 시스템이 만들어진다. 이론적인 최적화와 전기적인 구현을 통해서 인덕션 이론은 반도체 웨이퍼 공정 배기가스 시스템을 위한 인덕션 히터 설계과정에 적용되어진다. 제안한 인덕션 히터 설계는 에너지 측면에서 비효율적이고 신뢰성이 떨어지며 안전하지 못한 현재의 설계문제에 대한 해결책을 제시한다. 인덕션 히터의 강인성과 미세조정 설계기법이 질소 히터의 사양내에서 에너지 소모를 최적화한다. 최적화는 배기 파이프의 공진주파수에 의해서 특성화된 ZVS(Zero Voltage Switching)를 기초로 이루어진다. 시스템에서 끼어진 고장 안전(fail-safe) 에너지 리미터는 MOSFET의 궤환 제어를 통하여 전압 레귤레이터를 사용하고 N2 히터 유닛의 사양이내에서 작동하기 위한 성능을 만족하도록 한다. 수치 해석과 설계의 우수성을 위한 기존의 필라멘트 히터와 미세조정한 인덕션 히터 설계의 사양과 성능비교는 제안한 인덕션 히터 설계방법이 우수함을 보여준다.

• 한국수자원학회논문집
• /
• 제50권1호
• /
• pp.55-64
• /
• 2017

본 연구에서는 ULTIMATE 기법을 이용하여 밀도류 층적분 모형의 해석을 위한 수치모형을 제시하였다. 개발된 모형을 경사부와 평탄부로 이루어진 실내 실험에 적용하여 경사부에 유입된 부유사 밀도류의 전파 특성에 대해 분석하였다. ULTIMATE 기법의 범용제한자로 인하여 밀도류의 선단부가 수치진동 없이 비교적 급한 형태로 전파되는 것을 모의하였다. 그리고 사류로 전파되고 수로 끝에서부터 상류로 변화되는 밀도류의 내부 도수 발생 과정을 재현하였다. 이러한 내부 도수는 ULTIMATE 제한자를 사용하면 Courant 수가 1 미만일 때 안정적으로 모의되는 것을 확인하였다. 또한 밀도류의 전파 속도에 영향을 주는 인자에 대하여 분석하였다. 입자의 크기는 $9{\mu}m$ 이하일 때 밀도류의 전파 속도에 큰 영향을 주지 않는 반면, 부력 흐름률은 확연한 영향을 주는 것을 확인하였다. 마지막으로 부유사 밀도류에 의한 하상변동에 대해 검토하였다. 수치모형으로 부유사 밀도류의 전파에 의한 하상변동을 정량적으로 적절히 모의하였으며, 도수로 인한 부유사 연행의 차이와 이로 인한 하상의 불연속적인 형태를 관찰할 수 있었다.

• Progress in Superconductivity
• /
• 제7권1호
• /
• pp.97-101
• /
• 2005

Bi-22l2 tubes for fault current limiter (FCL) were fabricated by centrifugal melting process. $SrSO_4$ ($10\;wt.\;\%$) was added to Bi-2212 powder to lower the melting point of Bi-22l2 and to improve the mechanical properties. The BSCCO powder was completely melted at $1300\;^{\circ}C$ using the RF furnace and then poured into rotating steel mold. The steel mold, preheated at $450\;{\circ}C{\sim}550^{\circ}C$ for 2 hour was rotated at $1020{\sim}2520\;RPM$. The solidified BSCCO tube was cooled down to room temperature in the furnace for 48 hours and separated from the mold between Bi-2212 and the mold. $ZrO_2$ solution was used to separate it easily from the mold and Ag tape was attached in the mold inner wall of the mold to analysis electrical property. Bi-22l2 tube was often cracked when the cooling rate was high. BSCCO tubes with $70{\Phi}{\times}100\;mm,\;50{\Phi}{\times}100\;mm$ and $30{\Phi}{\times}150\;mm$ size were fabricated by centrifugal melting process. The $J_{c}s$ of tubes with $50{\Phi}{\times}100\;mm{\times}4.0\;t$ and $50{\Phi}{\times}100\;mm{\times}4.l\;t$ were 178 and $74.2\;A/cm^2$ at 77K, respectively. The processing condition for Bi-2212 tube fabrication was investigated using XRD and SEM analyses.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
• /
• pp.100-101
• /
• 2012

The plasma damage free and room temperature processedthin film deposition technology is essential for realization of various next generation organic microelectronic devices such as flexible AMOLED display, flexible OLED lighting, and organic photovoltaic cells because characteristics of fragile organic materials in the plasma process and low glass transition temperatures (Tg) of polymer substrate. In case of directly deposition of metal oxide thin films (including transparent conductive oxide (TCO) and amorphous oxide semiconductor (AOS)) on the organic layers, plasma damages against to the organic materials is fatal. This damage is believed to be originated mainly from high energy energetic particles during the sputtering process such as negative oxygen ions, reflected neutrals by reflection of plasma background gas at the target surface, sputtered atoms, bulk plasma ions, and secondary electrons. To solve this problem, we developed the NBAS (Neutral Beam Assisted Sputtering) process as a plasma damage free and room temperature processed sputtering technology. As a result, electro-optical properties of NBAS processed ITO thin film showed resistivity of $4.0{\times}10^{-4}{\Omega}{\cdot}m$ and high transmittance (>90% at 550 nm) with nano- crystalline structure at room temperature process. Furthermore, in the experiment result of directly deposition of TCO top anode on the inverted structure OLED cell, it is verified that NBAS TCO deposition process does not damages to the underlying organic layers. In case of deposition of transparent conductive oxide (TCO) thin film on the plastic polymer substrate, the room temperature processed sputtering coating of high quality TCO thin film is required. During the sputtering process with higher density plasma, the energetic particles contribute self supplying of activation & crystallization energy without any additional heating and post-annealing and forminga high quality TCO thin film. However, negative oxygen ions which generated from sputteringtarget surface by electron attachment are accelerated to high energy by induced cathode self-bias. Thus the high energy negative oxygen ions can lead to critical physical bombardment damages to forming oxide thin film and this effect does not recover in room temperature process without post thermal annealing. To salve the inherent limitation of plasma sputtering, we have been developed the Magnetic Field Shielded Sputtering (MFSS) process as the high quality oxide thin film deposition process at room temperature. The MFSS process is effectively eliminate or suppress the negative oxygen ions bombardment damage by the plasma limiter which composed permanent magnet array. As a result, electro-optical properties of MFSS processed ITO thin film (resistivity $3.9{\times}10^{-4}{\Omega}{\cdot}cm$, transmittance 95% at 550 nm) have approachedthose of a high temperature DC magnetron sputtering (DMS) ITO thin film were. Also, AOS (a-IGZO) TFTs fabricated by MFSS process without higher temperature post annealing showed very comparable electrical performance with those by DMS process with $400^{\circ}C$ post annealing. They are important to note that the bombardment of a negative oxygen ion which is accelerated by dc self-bias during rf sputtering could degrade the electrical performance of ITO electrodes and a-IGZO TFTs. Finally, we found that reduction of damage from the high energy negative oxygen ions bombardment drives improvement of crystalline structure in the ITO thin film and suppression of the sub-gab states in a-IGZO semiconductor thin film. For realization of organic flexible electronic devices based on plastic substrates, gas barrier coatings are required to prevent the permeation of water and oxygen because organic materials are highly susceptible to water and oxygen. In particular, high efficiency flexible AMOLEDs needs an extremely low water vapor transition rate (WVTR) of $1{\times}10^{-6}gm^{-2}day^{-1}$. The key factor in high quality inorganic gas barrier formation for achieving the very low WVTR required (under ${\sim}10^{-6}gm^{-2}day^{-1}$) is the suppression of nano-sized defect sites and gas diffusion pathways among the grain boundaries. For formation of high quality single inorganic gas barrier layer, we developed high density nano-structured Al2O3 single gas barrier layer usinga NBAS process. The NBAS process can continuously change crystalline structures from an amorphous phase to a nano- crystalline phase with various grain sizes in a single inorganic thin film. As a result, the water vapor transmission rates (WVTR) of the NBAS processed $Al_2O_3$ gas barrier film have improved order of magnitude compared with that of conventional $Al_2O_3$ layers made by the RF magnetron sputteringprocess under the same sputtering conditions; the WVTR of the NBAS processed $Al_2O_3$ gas barrier film was about $5{\times}10^{-6}g/m^2/day$ by just single layer.