• Transactions of the Korean Society of Mechanical Engineers
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• v.16 no.7
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• pp.1255-1265
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• 1992

Under uniform heat flow, the thermal stress intensity factors for the interfacial crack on a rigid cusp-type inclusion are determined by Hilbert problem expressed with complex variable. The thermal stress intensity factors are expressed in terms of the periodic function of heat flow angle. When the tip of the interfacial crack meets that of the cusp crack, the thermal stress intensity factors have singularities. The thermal stress intensity factors at the interfacial crack tip located in the distance from the cusp crack tip vary with the location of the interfacial crack tip. From the results of the analysis, the complex potential functions and the thermal stress intensity factors for the cusp-type inclusion without the interfacial crack are derived under the cusp surface boundary conditions insulated or fixed to zero relative temperature.

• Transactions of the Korean Society of Mechanical Engineers
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• v.14 no.1
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• pp.103-111
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• 1990

This paper presents a methodology for predicting stable crack growth and instability of a cracked body under monotonically increasing load. It is based on a model that incremental crack extensions and load increments after fracture initiation occur by turns in sequence and the criterion that the crack grows by an incremebt .delta.a when the opening displacement at the current crack tip increases by a critical value V$_{c}$. It is shown that the value I$_{c}$ = V$_{c}$/ .delta. a is a material constant characterizing ductile crack growth resistance. Along with the fracture initiation toughness value, the constant is used for the calculation of the loads against crack extensions by adding up each increment. The specimen failure is defined to occur when the necessary load increment for crack extension is zero or when the limit load in the current ligament is reached. The predicted failure loads are in good agreement with the avaliable experimental failure loads for the compact and center-cracked tension specimens of 7075-T651, 2024-T351 aluminum alloys and 304 stainless steel.steel.

• Transactions of the Korean Society of Automotive Engineers
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• v.4 no.2
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• pp.69-79
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• 1996

Dynamic stress intensity factors are derives when the crack is propagating with constant velocity under longitudinal shear stress in orthotropic disk plate. General stress fields of crack tip propagating with constant velocity and least square method are used to obtain the dynamic stress intensity factor. The dynamic stress intensity factors of GLV/GTV=1(=isotropic material or transversely isotropic material) which is obtained in out study nearly coincides with Chiang's results when mode Ⅲ stress is applied to boundary of isotropic disk. The D.S.I.F. of mode Ⅲ stress is greater when α(=angle of crack propagation direction with fiber direction) is 90° than that when α is 0°. In case of a/D(a:crack length, D:disk diameter)<0. 58, the faster crack propagation velocity, the less D.S.I.F. but when crack propagation velocity arrive on ghear stress wave velocity, the D.S.I.F. but when crack propagation velocity arrive on shear stress wave velocity, the D.S.I.F. unexpectedly increases and decreases to zero.

• Transactions of the Korean Society of Mechanical Engineers
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• v.19 no.7
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• pp.1630-1641
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• 1995

The dynamic stress intensity factors (DSIF ; $K_{I}$$^{dyn}$) were studied in some polymeric materials using caustics method with a high speed camera system. Also crack tip propagation speed was measured by dynamic crack propagation velocity measuring device. To calculate DSIF a finite element analysis program-INha Stress Analysis Moving CRack(INSAMCR) was utilized. Dynamic fracture characteristics were investigated to verify a relationship between DSIF and crack tip propagation speed and acceleration in PMMA, Homalite-100 and Polycarbonate. The relationship between dynamic stress intensity factor and crack tip velocity revealed typical shapes. Measured crack tip acceleration data envelope converges to the zero level with increasing DSIF. Equivalently crack tip velocities show a wide spread range at low values of DSIF, but become a constant with a higher DSIF. $1.2MPa{\sqrt{m}}$, $1.4MPa{\sqrt{m}}$ and $1.3 MPa{\sqrt{m}}$ were obtained as $K_{I}$$^{dyn}$ values to arrest the dynamic crack for PMMA, Homalite-100 and Polycarbonate, respectively. INSAMCR was run to verify experimental results in PMMA and shows good agreementment.

• Journal of the Korean Society of Safety
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• v.9 no.3
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• pp.22-27
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• 1994

For the $\beta$=1 specimen with constant thickness, Crack growth rate is smoothly increasing in the a-N curve. On the other hand for $\beta$=2 specimen with various thickness, the inflection point is observed in crack growth rate near the thickness interface. da/dN before the inflection point is increased, and da/dN after the point is decreased, compared to the $\beta$=1 specimen. da/dN near the thickness interface is approached zero. The descending point was observed earlier as $\beta$ increased. Considering the relation between da/dN and λ, the crack propagation rates for the case of $\beta$ =1 incrased almost linearly, however, the crack propagation rates for $\beta$=2,3 decreased more rapidly near the thickness interface. Additionally, the decreased point in da/dN for $\beta$=3 is farther from the thickness interface than the case for $\beta$ =2.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.9
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• pp.1753-1763
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• 2002

Stress and displacement fields for a propagating crack in a functionally gradient material (FGM) which has shear modulus as $\mu$=$\mu$$\_$0/(1＋ζX) are derived. The equations of motion in FGM which is nonhomogeneous material are different from those of homogeneous material. The stress intensity factors in stress fields have influence on odd terms of γ$\^$n/2-1/(n=1,3,5,...,) but stress at crack tip only retains term of γ$\^$-1/2/, where the γ is a radius of cylindrical coordinates centered at crack tip. When the FGM constant ζ is zero or γ→0, the fields for FGM are almost same as the those for isotropic material.

• Structural Engineering and Mechanics
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• v.86 no.1
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• pp.139-156
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• 2023

The reinforced concrete lining in the hydraulic pressure tunnel tends to crack during the water-filling process. The lining will be detached from the surrounding rock due to the inner water exosmosis along concrete cracks. From the previous research achievements, the cohesive element is widely adopted to simulate the concrete crack but rarely adopted to simulate the lining-rock interface. In this study, the zero-thickness cohesive element with hydro-mechanical coupling property is not only employed to simulate the traditional concrete crack, but also innovatively introduced to simulate the lining-rock interface. Combined with the indirect-coupled method, the hydro-mechanical coupling algorithm of the reinforced concrete lining in hydraulic pressure tunnels is proposed and implemented in the finite element code ABAQUS. The calculated results reveal the cracking mechanism of the reinforced concrete lining, and match well with the observed engineering phenomenon.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.25 no.6
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• pp.949-958
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• 2001

A semi-infinite interfacial crack propagated with constant velocity in two bonded anisotropic strips under out-of-plane clamped displacements is analyzed. Using Fourier integral transform the problem is formulated and the Wiener-Hopf equation is derived. By solving this equation the asymptotic stress and displacement fields near the crack tip are obtained, where the results get more general expressions applicable not only to isotropic/orthotropic materials but also to the extent of the anisotropic material having one plane of elastic symmetry for the interfacial crack. The dynamic stress intensity factor is obtained as a closed form, which is decreased as the velocity of crack propagation increases. The critical velocity where the stress intensity factor comes to zero is obtained, which agrees with the lower value between the critical values of parallel crack merged in the material 1 and 2 adjacent to the interface. Using the near tip fields of stresses and displacements, the dynamic energy release rate is also obtained as a form of the stress intensiy factor.

• Journal of the Semiconductor & Display Technology
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• v.21 no.1
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• pp.39-43
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• 2022

In this paper, a study was conducted on encapsulation technology for high mechanical stability of flexible displays. First, unlike conventional encapsulation barrier that exclude cracks as much as possible for low water vapor transmission rate (WVTR), mechanical properties were improved by using a defect suppression mechanism introduced with crack arresters. The zero-stress encapsulation barrier optimizes the residual stress of the thin film based to improve the internal mechanical stability. The zero-stress encapsulation barrier was applied to the organic light emitting diodes (OLEDs) to confirm its characteristics and lifetime. Due to improved internal mechanical stability, it has a longer lifetime more than 35% compared to conventional encapsulation technologies. As the zero-stress encapsulation barrier proposed in this study does not require additional deposition process, it is not difficult to apply it. Based on various advantages, it is expected to play an important role in flexible displays.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.10
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• pp.1500-1508
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• 2004

Stress and displacement fields for a crack propagating along interface between isotropic material and functionally gradient one with linear property gradation along X direction are developed. The stress and displacement fields are obtained from the complex function of steady plane motion for isotropic and functionally gradient material (FGM). The stresses and displacement in isotropic material of bimaterial are not influenced by nonhomogeneity, however, the fields in FCM are influenced by nonhomogeneity in the terms of higher order, n$\geq$3. When the nonhomogeneous parameter in FGM is zero, or in area close to crack tip, the fields are identical to those of isotropic-isotropic bimaterial. Using these stress components, the effects of nonhomogeneity on stresses are discussed.