A Study on the Optimal Conditions of Hole Machining of Microplate by Application of Response Surface Methodology in Wire-Pulse Electrochemical Machining (와이어 펄스전해가공에서 반응표면분석법을 응용한 미세박판의 홀 가공 최적 조건에 관한 연구)
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- Journal of the Korean Society of Manufacturing Process Engineers
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- v.16 no.5
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- pp.141-149
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- 2017