• 한국가시화정보학회:학술대회논문집
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• 한국가시화정보학회 2004년도 추계학술대회 논문집
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• pp.64-67
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• 2004

The present study describes an experimental work to reduce supersonic jet noise using a control wire device that is placed into the supersonic jet stream. The jet pressure ratio is varied to obtain the supersonic jets which are operated in a wide range of over-expanded to moderately under-expanded conditions. The wire device is composed of long cylinders with a very small diameter. X-type wire device is applied to control the supersonic jet noise, and its location is varied to investigate the effect of the control wire device on supersonic jet noise. A high-quality Schlieren optical system is used to visualize the flow field of supersonic jet with and without the control wire device. Acoustic measurement is performed to obtain the overall sound pressure level and noise spectra. The results obtained show that the present wire device destroys the shock-cell structures, reduces the shock strength, and consequently leading to a substantial suppression of supersonic jet noise.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2005년도 ICCAS
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• pp.1662-1667
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• 2005

In this paper, analysis, design, control and prototype construction of a wearable wire-driven haptic interface called HapticPen is discussed. This device can be considered as a wire driven parallel mechanism which three wires are attached to a pen-tip. Wire tensions are provided utilizing three DC servo motors which are attached to a solid frame on the user's body. This device is designed as input as well as output device for a wearable PC. User can write letters or figures on a virtual plate in space. Pen-tip trajectory in space is calculated using motor encoders and force feedback resulting from contact between pen and virtual plate is provided for constraining the pen-tip motion onto the virtual plane that can be easily setup by arbitrary non-collinear three points in space. In this paper kinematic model, workspace analysis, application analysis, control and prototype construction of this device are presented. Preliminary experiments on handwriting in space show feasibility of the proposed device in wearable environments.

• 한국철도학회:학술대회논문집
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• 한국철도학회 2006년도 추계학술대회 논문집
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• pp.587-592
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• 2006

This paper presents expansion and contraction in accordance with temperature change of contact wire and messenger wire. The tensioning device is designed and installed to pull the contact wire and messenger wire straight at all times. Pulling a contract wire straight ensures that smooth contract is maintained between the contact wire and pantograph of an electric train, and this makes it possible to ensure a stable supply of electricity to the train. Normally, tensioning devices are installed at two positions over a distance of 1.0[km] to 1.6[km] per line. In installing the tensioning device, therefore, it is necessary to study the stroke(the range of the extension/contraction rate of the tensioning device compatible with that of the contact wire and messenger wire due to change in temperature). This paper introduces and discusses this topic.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.950-955
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• 2005

This paper describes an intelligent filler wire feeding device which can control 3- dimensional seam tracking and the filler wire speed by measuring the gap position and the joint gap width in laser welding. By means of visual sensor controlled filling the missing material into the joint gap and 3 dimensional seam tracking, lineup errors from manufacturing tolerances and the repeatability of lineup jigs and weld robot can be balanced and at an even seam quality which avoids weld defects. In this paper, we assessed weld quality in 2mm sheets of A16061 which had various gap width by using the intelligent filler wire feeding device.

• 한국정밀공학회지
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• 제23권7호
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• pp.59-66
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• 2006

In laser welding, automatic seam tracking is important to adjust the laser head position in real time as it moves along the seam. Also if the joint gap is occurred, filling the missing material into the joint gap is necessary to prevent welding defects and bad welding quality. In general, the joint gap width is not constant along the seam due to a variety of reason. So it is essential to control the filler wire speed into the joint gap to acquire good welding quality. This paper describes an intelligent filler wire feeding device which can control 3-dimensional seam tracking and the filler wire speed by measuring the gap position and the joint gap width in laser welding. We call this device as Smart Micro Control system(SMC). To achieve this objective, we assessed weld quality in 2mm sheets of A16061 which had various gap width by using the developed device. From the experimental results, It was found the possibility that the developed device could be used in welding various 3-dimensional structures.

• 한국재료학회지
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• 제14권6호
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• pp.399-401
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• 2004

InGaAs/GaAs quantum wire structures were grown by low pressure metalorganic chemical vapor deposition by using selective area epitaxy.$ In_{ 0.2}$$Ga_{0.8}$ As/GaAs quantum wire structures were grown on a $SiO_2$ masked GaAs substrate. Quantum wire structures with sharp tips and smooth side walls were grown. We have grown InGaAs/GaAs quantum wire structures using variously opened width of the $SiO _2$ mask. Even though the opening widths of $SiO_2$ masked GaAs substrate were different, similar shapes of triangular structures were grown. Using various kinds of differently opened $SiO_2$ masked area, it would be possible to grow quantum wire structures with various thicknesses. The quantum wire structures are formed near the pinnacle of the triangular structure. Therefore, the fabrication of the uniquely designed integrated optical devices which include light emitting sources of multiple wavelength is possible.

• 제어로봇시스템학회논문지
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• 제8권5호
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• pp.407-412
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• 2002

A measurement device for gas concentration and flow rate using hot wire is developed for the utilization in industrial applications. The device has two cells of measuring and reference, and a bridge circuit is installed to detect electric current through the hot wire in the cells. An amplification of the signal and conversion to digital output are conducted for the on-line measurement with a personal computer. The flow rate of air and carbon dioxide gas is separately measured for the performance examination of the device. Also, the concentration of air-carbon dioxide and carbon dioxide-argon mixtures is determined for the same evaluation. The outcome of the performance test indicates that the accuracy and stability of the device is satisfactory for the purpose of industrial applications.

• 한국초전도ㆍ저온공학회논문지
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• 제25권2호
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• pp.14-18
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• 2023

Superconducting layers deposited on the metal substrate using the pulsed laser deposition process (PLD) play a crucial role in exploring new applications of superconducting wires and enhancing the performance of superconducting devices. In order to improve the superconducting property and increase the throughput of superconducting wire fabricated by pulsed laser deposition, high temperature heating device is needed that provides high temperature stability and strong durability in high oxygen partial pressure environments while minimizing performance degradation caused by surface contamination. In this study, new heating device have been developed for PLD process that deposit and growth the superconducting material continuously on substrate using reel-to-reel transportation apparatus. New heating device is designed and fabricated using iron-chromium-aluminum wire and alumina tube as a heating element and sheath materials, respectively. Heating temperature of the heater was reached over 850 ℃ under 700 mTorr of oxygen partial pressure and is kept for 5 hours. The experimental results confirm the effectiveness of the developed heating device system in maintaining a stable and consistent temperature in PLD. These research findings make significant contributions to the exploration of new applications for superconducting materials and the enhancement of superconducting device performance.

• 한국초전도ㆍ저온공학회논문지
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• 제8권3호
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• pp.54-58
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• 2006

In this paper, authors developed a real-time simulation algorithm for the power device application of HTS(High Temperature Superconducting) wire by using Real Time Digital Simulator(RTDS). At present, in order to extend the power capacity of some area where has a serious problem of power quality. especially metropolitan complex city, there are so many problems such as right of way for power line routes. space for downtown substations. and the environmental protection, etc. HTS technology can be useful to overcome this problem. Recently, according to the advanced HTS technology, the power application is being researched well. Simulation is required for safety before installation of HTS power cable, a fabrication model used at the power system simulation. This paper describes a real time digital simulation method for the application of HTS wire to power device. For the simulation analysis, test sample of HTS wire was actually manufactured. And the transient phenomenon of the HTS wire was analysed in the simulated utility power grid. This simulation method is the world first trial in order to obtain much better information for installation of HTS power device into a utility network.

• 전자공학회논문지A
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• 제33A권2호
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• pp.148-162
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• 1996

Bonding wires for high frequency device packaging have dominant parasitic inductances which limit the performance of semiconductor lasers. In this paper, the inductance sof bonding wires are claculated by the method of moments with incorporation of ohmic loss, and the wideband modulation characteristics are analyzed for ddifferent wire lengths and structures. We observed the modulation bandwidth for 1mm-length bonding wire lengths and structures. We observed the modulation bandwidth for 1mm-length bonding wire is 7 GHz wider than that for 2mm-length bonding wire. We also observed th estatic inductance calculation results in dispersive deviation of the parasitic inductance and the modulation characteristics from the wideband moment methods calculations. The angled bonding wire has much less parasitic inductance and improves the modulation bandwidth more than 6 GHz. This calculation resutls an be widely used for designing and packaging of high-speed semiconductor device.