• Proceedings of the Optical Society of Korea Conference
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• 2005.07a
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• pp.24-25
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• 2005

• Proceedings of the Optical Society of Korea Conference
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• 2004.02a
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• pp.28-29
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• 2004

• Proceedings of the Optical Society of Korea Conference
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• 2006.02a
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• pp.209-210
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• 2006

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.11a
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• pp.577-578
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• 2010

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.7 no.3
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• pp.81-86
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• 2008

I present a 3-D profiler specially devised for the profile measurement of specular surfaces that requires precision shape accuracy up to a few nanometer. A profile is reconstructed from the curvature of a test part of the surface at several locations along a line. The local curvature data are acquired with White-light Scanning Interferometry. Test measurement proves that the proposed profiler is well suited for the specular surface inspection like precision mirror.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.204-207
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• 2005

We discuss two possibilities of using femtosecond pulse lasers as a new interferometric light source fer enhanced precision surface profile metrology. First, a train of ultra-fast laser pulses yields repeated low temporal coherence, which allows performing unequal-path scanning interferometry that is not feasible with white light. Second, high spatial coherence of femtosecond pulse lasers enables to test large size optics in non-symmetric configurations with relatively small size reference surfaces. These two advantages are verified experimentally using Fizeau and Twyman-Green type scanning interferometers.

• Korean Journal of Optics and Photonics
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• v.11 no.5
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• pp.317-322
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• 2000

We present a compensation method of the phase change upon reflection in the scannll1g whIte light interferometry. which pracl1cally allows precIse 3-D profIle mappmg for compo~Ite target surfaces comprising of multipledissinular matenals. The compensation method estimates the vanatlon 01 pbase change with the spectral distribution of the light source through first-order approximation, and then diIectly compensates the measurement errors by perIormmg two-wavelength white light intetferomctric measurements. Experimental results prove that the proposed self-compensatIOn mcthod is capable of reducing the measmement error in step height gauging within $\pm2nm$..

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.565-568
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• 2005

We describe a new scheme of dispersive white-light interferometer that is capable of measuring the thickness profile of thin-film layers, for which not only the top surface height profile but also the film thickness of the target surface should be measured at the same time. The interferometer is found useful particularly for in-situ inspection of micro-engineered surfaces such as liquid crystal displays, which requires for high-speed implementation of 3-D surface metrology.

• Journal of Institute of Control, Robotics and Systems
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• v.14 no.6
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• pp.519-522
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• 2008

As industry of a semiconductor and LCD industry have been rapidly growing, precision technologies of machining such as etching and 3D measurement are required. Stylus has been important measuring method in traditional manufacturing process. However, its disadvantages are low measuring speed and damage possibility at contacting point. To overcome mentioned disadvantage, non-contacting measurement method is needed such as PMP(Phase Measuring Profilometry), WSI(white scanning interferometer) and Confocal Profilometry. Among above 3 well-known methods, WSI started to be applied to FPD(flat panel display) manufacturing process. Even though it overcomes 21t ambiguity of PMP method and can measure objects which has specular surface, the measuring speed and vibration coming from manufacturing machine are one of main issue to apply full automatic total inspection. In this study, We develop high speed WSI system and algorithm to reduce unknown noise. The developing WSI and algorithm are implemented to measure 3D surface of wafer. Experimental results revealed that the proposed system and algorithm are able to measure 3D surface profile of wafer with a good precision and high speed.

• Journal of Korea Multimedia Society
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• v.21 no.8
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• pp.864-875
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• 2018

In this paper, we propose a measurement method for height of white light scanning interferometer using deep learning. In order to measure the fine surface shape, a three-dimensional surface shape measurement technique is required. A typical example is a white light scanning interferometer. In order to calculate the surface shape from the measurement image of the white light scanning interferometer, the height of each pixel must be calculated. In this paper, we propose a neural network for height calculation and use virtual data generation method to train this neural network. The accuracy was measured by inputting 57 actual data to the neural network which had completed the learning. We propose two new functions for accuracy measurement. We have analyzed the cases where there are many errors among the accuracy calculation values, and it is confirmed that there are many errors when there is no interference fringe or outside the learned range. We confirmed that the proposed neural network works correctly in most cases. We expect better results if we improve the way we generate learning data.