• 한국기계가공학회지
• /
• 제18권9호
• /
• pp.72-80
• /
• 2019

In this task, the tool dynamometer design and manufacture, and the Ansys S/W structural analysis program for tool attachment that satisfies the cutting force measurement requirements of the tool dynamometer system are used to determine the cutting force generated by metal cutting using 3-axis static structural analysis and the LabVIEW system. The cutting power in a cutting process using a milling tool for processing metals provides useful information for understanding the processing, optimization, tool status monitoring, and tool design. Thus, various methods of measuring cutting power have been proposed. The device consists of a strain-gauge-based sensor fitted to a new design force sensing element, which is then placed in a force reduction. The force-sensing element is designed as a symmetrical cross beam with four arms of a rectangular parallel line. Furthermore, data duplication is eliminated by the appropriate setting the strain gauge attachment position and the construction of a suitable Wheatstone full-bridge circuit. This device is intended for use with rotating spindles such as milling tools. Verification and machining tests were performed to determine the static and dynamic characteristics of the tool dynamometer. The verification tests were performed by analyzing the difference between strain data measured by weight and that derived by theoretical calculations. Processing test was performed by attaching a tool dynamometer to the MCT to analyze data generated by the measuring equipment during machining. To maintain high productivity and precision, the system monitors and suppresses process disturbances such as chatter vibration, imbalances, overload, collision, forced vibration due to tool failure, and excessive tool wear; additionally, a tool dynamometer with a high signal-to-noise ratio is provided.

• 대한기계학회논문집
• /
• 제8권2호
• /
• pp.154-161
• /
• 1984

본 연구에서는 고정밀 아날로그-디지탈 변환기와 마이크로 프로세서(micropr- ocessor) Intel 8085를 사용하여 비정상 아날로그(analog)신호를 왜곡이 없이 디지탈 량으로 직접 변환하여 자료처리하였다. 또한 비정상 열선법은 열선에 전류를 가하여 열선이 열원이며 동시에 온도계의 두 가지 역할을 하므로, 전기전도성이 있는 액체는 적합하지 못한 단점이 있다. 이를 해결하기 위하여 열선에 얇은 절록피복층을 입혀 전기전도성 액체의 열전도율을 측정할 수 있는 가능성에 대한 연구를 시도하였다.

• 대한기계학회논문집B
• /
• 제29권5호
• /
• pp.633-642
• /
• 2005

Nucleate pool boiling experiments for R11 under a constant wall temperature condition were carried out. A microscale heater array was used for the heating and the measurement of high temporal and spatial resolution by the Wheatstone bridge circuit. Very sensitive heat flow rate data were obtained by the control for the surface condition with high time resolution. The measured heat flow rate shows a discernable peak at the initial growth stage and reaches an almost constant value. In the thermal growth region, bubble shows a growth proportional to $t^{\frac{1}{5}}$. The bubble growth behavior is analyzed with a dimensionless parameter to compare with the previous results in the same scale. As the wall superheat increases, the departure diameter and the departure time increase, and the waiting time decreases. But the asymptotic growth rate is not affected by the wall superheat change. The effect of the wall superheat is resolved into the suggested growth equation. Dimensionless parameters of time and bubble radius characterize the thermal growth behavior well, irrespective of wall condition. The comparison between the result of this study and the previous results shows a good agreement at the thermal growth region. The quantitative analysis for the heat transfer mechanism is conducted with the measured heat flow rate behavior and the bubble growth behavior. The required heat flow rate for the volume change of the observed bubble is about twice as much as the instantaneous heat flow rate supplied from the wall.

• 한국산학기술학회논문지
• /
• 제18권4호
• /
• pp.578-583
• /
• 2017

본 논문은 최근에 모바일 기기에 적용되고 있는 차세대 터치 기술로서 압력터치 센서를 이용한 3D 터치패드 기술에 관한 것이다. 3D터치 기술은 터치 위치 및 터치 압력을 동시에 검출할 수 있고 멀티터치 기능이 있어야 한다. 본 논문의 목적은 스트레인 게이지를 이용하여 압력터치 센서를 제작하고 2점을 동시에 터치 가능한 압력터치 패드 제작이다. 하드웨어 부분은 터치 인식 센서에 금속 박막형 스트레인 게이지를 이용하였고 각 스트레인 게이지 센서마다 휘스톤 브리지 회로로 미세한 터치 신호를 검출하였다. 또한, 터치 신호 증폭기를 사용하여 터치 신호를 증폭하고 마이크로프로세서를 통해 디지털 데이터로 변환하여 화면에 디스플레이하는 터치 인식 시스템을 만들었다. 소프트웨어 부분은 2점 동시터치가 가능하고 터치 압력에 따라 구별 가능한 터치 인식 알고리즘을 C언어로 제작하였다. 터치 강도와 터치 위치가 다른 두 개의 터치 신호를 동시에 검출하여 화면에 나타내는 실험을 성공적으로 수행하였다. 본 연구를 통해 스트레인 게이지를 이용한 터치 인식 방법으로 3D 터치패드의 응용 가능성을 확인하였다.