• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.05a
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• pp.359-362
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• 2003

The bending phenomenon has been known to be occurred by the different of velocity at the die exit. The difference of velocity at the die exit section can be obtained by the different velocity of billets through the multi-hole container and by the cohesion of billet inside the porthole die chamber. The bending phenomenon can be controlled by the different hole diameter. The experiments using aluminium material for the curved tube product had been done. The results of the experiment show that the curved tube product can be formed by the extru-bending process without the defects such as the distortion of section and the thickness change of the wall of tube and the folding and wrinkling. It is known that the welding and extruding of each billet has done simultaneously although the curved tube is extruded with four billets.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2001.05a
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• pp.59-62
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• 2001

Welded blank hydroforming technology is applied to an automotive subframe which has been manufactured by stamping and welding processes. Blank shape and die system is suggested on the basis of finite element analyses. Various defects, especially wrinkling problems in the area of sudden section change, are investigated, analyzed and tried out. The blank shape and the die system are modified to get the sound welded blank hydroformed subframe.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1997.10a
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• pp.65-71
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• 1997

Computer simulations and test trials are carried out to get the optimal conditions about the stamping die design of the tailor laser welded automotive door inner. Firstly, the stamping process including gravity deflection, bead calibration, binder wrap, forming and spring back, are analyzed by the computer simulation. The results of simulation shows good correspondance with those of test trial under the same conditions. The variables of parametric study which will be investigated in the simulation and test trials, are determined form the results of the first run. The formability under the various conditions is evaluated, which are the initial postion of blank, blank holding force, corner radius and the shape of drawbead. Finally, well controled sound product without fracture, wrinkling and excessive weldline movement is obtained.

• Proceedings of the KWS Conference
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• 2007.11a
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• pp.223-226
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• 2007

본 연구에서는 Ag anisotropic conductive adhesive(ACA)의 종류, 경화 조건 및 안테나 패턴의 재질에 따른 flip chip bonding된 RFID die의 접합부 신뢰성이 조사되었다. 접합강도 측정에 의하여 접합강도가 최적화되는 공정 시간을 결정할 수 있었으며, 그러한 최적의 공정조건에서는 paste-type Ag ink로 인쇄된 안테나 상에서의 RFID die의 접합강도가 Cu 재질 안테나에 비해 상대적으로 높게 측정됨을 알 수 있었다. RFID tag의 인식거리 측정 시험을 통하여 적절한 경화 조건이 적용된다면 안테나의 재질이 인식거리 변화에 가장 주요한 영향을 미치는 인자임을 알 수 있었다. 아울러 Cu 안테나 패턴은 RFID die의 접합 과정에서 곡률을 가지며 휘어지면서 인식거리와 관련된 long-tem reliability를 악화시킬 수 있음을 관찰할 수 있었다.

• Journal of Welding and Joining
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• v.34 no.1
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• pp.21-25
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• 2016

The automotive vehicle is made through the following processes such as press shop, welding shop, paint shop, and general assembly. Among them, the most important process to determine the quality of the car body is the welding process. Generally, more than 400 pressed panels are welded to make BIW (Body In White) by using the RSW (Resistance Spot Welding) and GMAW (Gas Metal Arc Welding). Recently, as the needs of light-weight material due to the $CO_2$ emission issue and fuel efficiency, new joining technologies for aluminum, CFRP (Carbon Fiber Reinforced Plastic) and etc. are needed. Aluminum parts are assembled by the spot welding, clinching, and SPR (Self Piercing Rivet) and friction stir welding process. Structural adhesive boning is another main joining method for light-weight materials. For example, one piece aluminum shock absorber housing part is made by die casting process and is assembled with conventional steel part by SPR and adhesive bond. Another way to reduce the amount of the car body weight is to use AHSS (Advanced High Strength Steel) panel including hot stamping boron alloyed steel. As the new materials are introduced to car body joining, productivity and quality have become more critical. Productivity improvement technology and adaptive welding control are essential technology for the future manufacturing environment.

• Journal of Welding and Joining
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• v.33 no.3
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• pp.54-61
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• 2015

In this study, effect of laser power on hardness and microstructure of SKD61 Hot Die steel of which surface was melted and hardened with Yb:YAG disk laser was investigated. Beam speed was fixed at 70 mm/sec and distance between them was 0.8 mm about Laser surface melting. The only thing that was changed laser power. Laser powers were 2.0, 2.4 and 2.8 kW. No defect was found under all conditions. As the laser power increased, the penetration depth were deepened and the bead width was also widened. There was no hardness deviation of fusion zone at same laser power and it was higher than that of heat affected zone. In addition, the more laser power increased, the more hardness in fusion zone decreased. Fusion zone was macroscopically dendrite structure. However, core matric in dendrite was lath martensite of 100 nm size. There were $M_{23}C_6$ of 500 nm and the VC and $Mo_2C$ of a nano meters on boundary of dendrite.

• Transactions of Materials Processing
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• v.13 no.4
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• pp.342-349
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• 2004

The form-joining process (or clinching) uses a set of die and punch to impose the plastic deformation-induced geometric constraint on a sheet metal pair. The joining strength from the process ranges 50-70 percent of that of the resistance spot welding. In this paper, a new form-joining process with the aid of an adhesive is proposed in which an epoxy adhesive is applied to a sheet metal pair, and before it cures the pair is clinched to cause the geometric constraint in the form of a protrusion. In order to reduce the forming load and the height of protrusions, a new die and punch set with a very small clearance is devised to reduce the depth of drawing and the forming load. Taguchi method is employed to find the optimal values of design parameters. To implement each case of the orthogonal array, the finite element method is used. The experiments show that in the tensile-shear test, the bonding strength of the new form-joining process with an epoxy adhesive is approximately the same as that of the resistance spot welding; and in comparison with the other two form-joining processes with an epoxy adhesive, the height of protrusions is reduced by more than 65 percent and the forming load by 50 percent.

• Journal of Welding and Joining
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• v.32 no.3
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• pp.11-18
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• 2014

TSV(through silicon via) filling technology is making a hole in Si wafer and electrically connecting technique between front and back of Si die by filling with conductive metal. This technology allows that a three-dimensionally connected Si die can make without a large number of wire-bonding. These TSV technologies require various engineering skills such as forming a via hole, forming a functional thin film, filling a conductive metal, polishing a wafer, chip stacking and TSV reliability analysis. This paper addresses the TSV filling using Cu electrodeposition. The impact of plating conditions with additives and current density on electrodeposition will be considered. There are additives such as accelerator, inhibitor, leveler, etc. suitably controlling the amount of the additive is important. Also, in order to fill conductive material in whole TSV hole, current wave forms such as PR(pulse reverse), PPR(periodic pulse reverse) are used. This study about semiconductor packaging will be able to contribute to the commercialization of 3D TSV technology.

• Journal of Welding and Joining
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• v.31 no.6
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• pp.77-83
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• 2013

3D packaging technology using TSV (Through Silicon Via)has been studied in the recent years to achieve higher performance, lower power consumption and smaller package size because electrical line is shorter electrical resistivity than any other packaging technology. To stack TSV chips vertically, reliable and robust bonding technology is required because mechanical stress and thermal stress cause fracture during the bonding process. Cu pillar/solder ${\mu}$-bump bonding process is usually to interconnect TSV chips vertically although it has weak shape to mechanical stress and thermal stress. In this study, we suggest Insert-Bump (ISB) bonding process newly to stack TSV chips. Through experiments, we tried to find optimal bonding conditions such as bonding temperature and bonding pressure. After ISB bonding, we observed microstructure of bump joint by SEM and then evaluated properties of bump joint by die shear test.

• Journal of Welding and Joining
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• v.27 no.5
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• pp.81-87
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• 2009

Recently, extruded aluminium-alloy panels have been used in the car bodies for the purpose of the light-weight of railway vehicles and FSW(Friction Stir Welding), which is superior to the arc weldings, has been applied in the railway vehicles. This paper presents the optimum design of the FSW process on A6005 extruded alloy for railway vehicles to improve its mechanical properties. Rotational speed, welding speed and tilting angle of the tool tip were chosen as design parameters. Three objective functions were determined; maximizing the tensile strength, minimizing the hardness and maximizing the difference between the normalized tensile strength and hardness. The tensile tests and the hardness tests for fifteen FSW experiments were carried out according to the central composite design table. Recursive model functions on three characteristic values, such as the tensile strength, the hardness difference(${\Delta}Hv$) and the difference of normalized tensile strength and ${\Delta}Hv$, were estimated according to the classical response surface analysis methodology. The reliability of each recursive function was verified by F-test using the analysis of variance table. Sensitivity analysis on each characteristic value was done. Finally, the optimum values of three design parameters were found using Sequential Quadratic Programming algorithm.