• 마이크로전자및패키징학회지
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• 제24권4호
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• pp.9-17
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• 2017

In these days, MEMS (micro-electro-mechanical system) devices become the crucial sensor components in mobile devices, automobiles and several electronic consumer products. For MEMS devices, the packaging determines the performance, reliability, long-term stability and the total cost of the MEMS devices. Therefore, the packaging technology becomes a key issue for successful commercialization of MEMS devices. As the IoT and wearable devices are emerged as a future technology, the importance of the MEMS sensor keeps increasing. However, MEMS devices should meet several requirements such as ultra-miniaturization, low-power, low-cost as well as high performances and reliability. To meet those requirements, several innovative technologies are under development such as integration of MEMS and IC chip, TSV(through-silicon-via) technology and CMOS compatible MEMS fabrication. It is clear that MEMS packaging will be key technology in future MEMS. In this paper, we reviewed the recent development trends of the MEMS packaging. In particular, we discussed and reviewed the recent technology trends of the MEMS bonding technology, such as low temperature bonding, eutectic bonding and thermo-compression bonding.

• 디지털콘텐츠학회 논문지
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• 제19권9호
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• pp.1803-1810
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• 2018

사물인터넷 기술을 활용하는 연구가 활발하게 진행되고 있다. 사물인터넷을 활용하는 스마트 웨어러블 기기의 상황인식 기능을 향상시키기 위하여 센서부의 이벤트 데이터에 대한 잡음 제거방안을 제안하였다. 본 연구에서는 저역필터를 이용함으로써 비정상적으로 측정된 값에 대한 감쇠를 유도하고 센서의 이벤트 데이터를 이용한 상황 인지에서 유익을 얻을 수 있었다. 스마트 폰과 스마트워치에 기본 내장되어 있는 3축 가속도 센서가 감지하여 보고한 이벤트 데이터를 활용하여 검증한 결과 비정상적으로 과도하게 측정되어 입수된 잡음 값에 대한 값에 대한 감쇠처리를 실행할 수 있었다. 이와 같이 잡음이 제거된 값의 패턴을 분석함으로서 실시간 상황인식에 필요한 다양한 패턴 자료를 얻을 수 있었다.

• Journal of Korean Neurosurgical Society
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• 제62권5호
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• pp.561-566
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• 2019

Objective : Functional outcomes have traditionally been evaluated and compared using subjective surveys, such as visual analog scores (VAS), the Oswestry disability index (ODI), and Short Form-36 (SF-36), to assess symptoms and quality of life. However, these surveys are limited by their subjective natures and inherent bias caused by differences in patient perceptions of symptoms. The Fitbit $Charge^{(R)}$ (Fitbit Inc., San Francisco, CA, USA) provides accurate and objective measures of physical activity. The use of this device in patients after laminectomy would provide objective physical measures that define ambulatory function, activity level, and degree of recovery. Therefore, the present study was conducted to identify relationships between the number of steps taken by patients per day and VAS pain scores, prognoses, and postoperative functional outcomes. Methods : We prospectively investigated 22 consecutive patients that underwent laminectomy for spinal stenosis or a herniated lumbar disc between June 2015 and April 2016 by the same surgeon. When patients were admitted for surgery and first visited after surgery, preoperative and postoperative functional scores were recorded using VAS scores, ODI scores, and SF-36. The VAS scores and physical activities were recorded daily from postoperative day (POD) 1 to POD 7. The relationship between daily VAS scores and daily physical activities were investigated by simple correlation analysis and the relationship between mean number of steps taken and ODI scores after surgery was subjected to simple regression analysis. In addition, Wilcoxon's signed-rank test was used to investigate the significance of pre-to-postoperative differences in VAS, ODI, and SF-36 scores. Results : Pre-to-postoperative VAS (p<0.001), ODI (p<0.001), SF-36 mental composite scores (p=0.009), and SF-36 physical composite scores (p<0.001) scores were found to be significantly different. Numbers of steps taken from POD 1 to POD 7 were negatively correlated with daily VAS scores (r=-0.981, p<0.001). In addition, the mean number of steps from POD 3 to POD 7 and the decrease in ODI conducted one month after surgery were statistically significant (p=0.029). Conclusion : Wearable devices are not only being used increasingly by consumers as lifestyle devices, but are also progressively being used in the medical area. This is the first study to demonstrate the usefulness of a wearable device for checking patient physical activity and predicting pain and prognosis after laminectomy. Based on our experience, the wearable device used to provide measures of physical activity in the present study has the potential to provide objective information on pain severity and prognosis.

• 한국정보전자통신기술학회논문지
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• 제13권3호
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• pp.267-276
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• 2020

제조업 근로자는 근무 환경에서 반복 작업에 의한 근골격계 질환의 위험에 쉽게 노출되어 있다. 이는 신체를 반복적으로 이용하는 직업 특성상의 문제에 기인한다. 하지만 현재 감시 및 예방을 위한 모니터링 시스템이 제공되지 않아 매년 위험에 대한 근로자의 노출도가 증가하고 있다. 본 논문에서는 IMU 센서를 사용한 웨어러블 장치 제작을 통해 실제 작업 환경에서의 이러한 문제를 해결하는 방법에 대해 제시한다. 웨어러블 형태의 장치를 착용 후, 근골격계 움직임에 따른 회전 값을 받아와 데이터 분석을 통해 사용자의 움직임을 판단해낸다. 이때, 바이어스 제거와 누적 오차를 제거해 정교한 데이터 취득하여 이를 동적 임곗값 형식으로 분석하여 사용자의 회전 운동 횟수를 측정해내어 위험도를 판단한다. 본 논문에서 제안한 웨어러블 장치를 이용 팔꿈치 근골격계 질환에 대한 회전 횟수를 측정하는 웹 페이지를 통해 본 방법의 효과를 확인할 수 있었다.

• 한국의류산업학회지
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• 제23권6호
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• pp.860-868
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• 2021

Clothing has a very important role in human life, and it is the most human-friendly platform because humans wear it in almost all the time. In the recent years, smart clothing integrated with various functions is solidifying its position as the core of next-generation Information and Communications Technology(ICT). With this global trend, the smart textiles, textiles embedded with electronic devices that are capable of performing various functions, have been attracting a lot of attention. Therefore, various research activities on the smart textiles are in progress, and the global market outlook for the smart textiles is also showing rapid growth. Among the various smart textile technologies, the textile/fiber-based wearable display has been attracting more attention because it is an essential element for wearers to intuitively control the functions integrated in the smart textiles. This paper provides insightful information and the technological elements of organic light emitting diodes(OLEDs) display, which have been evaluated as the most ideal device for luminescent clothing. Since, OLEDs have many advantages such as light weight, extremely thin thickness and great flexibility, the textile/fiber-based wearable OLEDs can be worn without any inconvenience. In addition, by introducing previous studies on the textile/fiber-based OLED displays, we intend to consider the commercial potential of the textile/fiber-based smart luminescent clothing using the OLED technologies.

• 디지털융복합연구
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• 제20권5호
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• pp.637-642
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• 2022

심전도(ECG, electrocardiogram) 신호를 이용한 본인 인증기술은 기존의 바이오 인증을 대체할 수 있는 본인 인증기술로 주목받고 있다. 디지털 전자키를 인식하는 장치를 차량에 탑재하여 자동차와 무선으로 데이터를 송수신할 수 있게 하고, 스마트폰 등을 활용해 자동차의 차 문을 잠금 또는 해제하거나, 시동을 걸 수 있는 기능을 스마트폰을 통해 차량 제어할 수 있다. 그러나 스마트키는 보안에 취약하여 이를 해결하고 운전자의 편의성을 제공하기 위해 바이오 인증기술을 적용한 스마트키를 연구하였다. 심전도를 이용한 개인인증 알고리즘을 시계 형태의 웨어러블 디바이스에 탑재하여 바이오인증을 하고 개인인증이 완료되면 자동차의 스마트키 기능을 할 수 있었다. 인증율 95%를 달성하였다. 운전자는 스마트키를 소지할 필요가 없고, 분실 및 해킹에 안전하게 보호할 수 있는 대안으로 스마트키를 제안한다. 심전도를 이용한 개인 인증기술을 활용한 스마트키는 개인인증을 통해 다양한 분야에 적용이 가능하고 향후 심전도를 이용한 본인확인 장치 등에 적용할 수 있는 방법을 연구할 계획이다.

• 정보저장시스템학회논문집
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• 제11권2호
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• pp.36-40
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• 2015

The demand for flexible devices including solar cells, memories and batteries has increased rapidly over the past decades. In most flexible devices, polymer-based materials are used to enable the mechanical deformations such as bending or folding. Shape Memory Polymers (SMPs) is a high molecular compound polymer with flexibility and shape recovery characteristics. In this work, flexible shape memory device was fabricated by simply coating the conducting material, carbon nano-tube (CNT), on a shape memory polymer. Furthermore, durability of the device under various type of mechanical deformations was assessed. It is believed that the result of this work will aid in realization of a stretchable and wearable electronic device for practical applications.

• 진공이야기
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• 제4권2호
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• pp.15-23
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• 2017

This article reviews technical trend in research of stretchable electrodes for wearable devices, bio-integrated devices, and stretchable electronics. Stretchable electronics is new emerging class of electronics following flexible electronics. One of the most difficult challenges in the development of stretchable electronic is to realize high performance stretchable electrodes with a low resistivity and high strain failure and stretchability against severe strain of the substrate. For this reason, there are many reports on the promising stretchable electrodes including CNT, graphene, Ag nanowire, and composite materials. We outline the recent research for stretchable substrate and stretchable electrode materials to realize highly stretchable electrodes.

• 전자통신동향분석
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• 제34권5호
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• pp.48-57
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• 2019

As the super-aged society approaches rapidly, the number of people suffering from post-stroke and other neurological disorders is significantly increasing, where prompt and intensive rehabilitation is essential for such people to resume their physical activities in normal daily lives. To overcome the inherent limitations of manual physical therapy, various types of exoskeleton robots are being employed. However, the need of the hour is softer, thinner, lighter, and even stretchable systems for precisely monitoring the motion of each joint without restricting the patients' movements in rehabilitation tasks. In this paper, we discuss the technological trends and current status of emerging stretchable rehabilitation systems, in which sensors, interconnects, and signal-processing circuits are monolithically integrated within a single stretchable substrate attachable to the skin. Such skin-like stretchable rehabilitation devices are expected to provide much more convenient, user-friendly, and motivating rehabilitation to patients with neurological impairments.

• 마이크로전자및패키징학회지
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• 제31권3호
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• pp.10-17
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• 2024

본 논문은 전자 기기의 소형화와 유연성을 실현하기 위한 플렉시블 패키징 핵심 기술 중 하나인 Chip On Film(COF) 기술에 대해 논의합니다. COF는 Display Driver IC(DDI)를 유연한 폴리이미드(Polyimide) 기판에 직접 부착하여, 고해상도 디스플레이의 경량화와 두께 감소를 가능하게 합니다. COF 기술은 주로 Organic Light Emitting Diode(OLED) 디스플레이와 같은 고성능 디스플레이 패널에서 사용되며, 스마트폰과 웨어러블 기기와 같은 휴대용 전자 장치에서 핵심적인 역할을 합니다. 본 연구에서는 COF의 주요 구성 요소 및 본딩 기술의 발전을 분석합니다. 특히, 열압착(Thermo-Compression Bonding), 초음파 본딩(Thermo-sonic Bonding)과 같은 최신 본딩 기법의 도입으로, 본딩 신뢰성 및 전기적 성능이 크게 향상되었습니다. 이러한 본딩 기술은 미세 피치 구조에서 높은 전기적 연결성을 유지하면서도, COF 패키지의 기계적 안정성을 강화합니다. 또한, COF 본딩 기술의 향후 발전 방향과 그에 따른 도전 과제를 논의하며, 차세대 디스플레이 및 Advanced 패키징 기술로서의 가능성을 조망합니다.