• Transactions of the Korean Society of Mechanical Engineers A
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• v.24 no.8 s.179
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• pp.1968-1799
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• 2000

A warpage analysis program has been developed for fiber-reinforced injection molded parts. The warpage is predicted from the residual stress and anisotropic thermo-mechanical properties coupled with fiber orientation in the integrated injection molding simulation. A simple elastic model is used for the calculation of thermally and pressure-induced residual stresses which are employed as the initial conditions in the structural analysis. To improve the reliability of warpage analysis, a new triangular flat shell element superimposing well-known efficient plate bending and membrane element is presented. The numerical examples address the necessity to use anisotropic models for fiber-reinforced materials and show that predicted warpage is in good agreement with experimentally measured one.

• Proceedings of the KSME Conference
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• 2000.04a
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• pp.745-750
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• 2000

A warpage analysis program has been developed for fiber-reinforced injection molded parts. The warpage is Predicted from the residual stress and anisotropic thermo-mechanical properties coupled with fiber orientation in the integrated injection molding simulation. A simple elastic model is used for the calculation of thermally and pressure-induced residual stresses which are employed as the initial conditions in the structural analysis. To improve the reliability of warpage analysis, a new triangular flat shell element superimposing well-known efficient plate bending and membrane element is presented. The numerical examples address the neccesity to use anisotropic models for fiber-reinforced materials and show that predicted warpage is in good agreement with experimentally measured one.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.735-736
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• 2011

• Journal of the Semiconductor & Display Technology
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• v.17 no.4
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• pp.42-45
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• 2018

As The semiconductor decrease from 10 nanometer to 7 nanometer, It is suggested that "More than Moore" is needed to follow Moore's Law, which has been a guide for the semiconductor industry. Fan-Out Wafer Level Package(FOWLP) is considered as the key to "More than Moore" to lead the next generation in semiconductors, and the reasons are as follows. the fan-out WLP does not require a substrate, unlike conventional wire bonding and flip-chip bonding packages. As a result, the thickness of the package reduces, and the interconnection becomes shorter. It is easy to increase the number of I / Os and apply it to the multi-layered 3D package. However, FOWLP has many issues that need to be resolved in order for mass production to become feasible. One of the most critical problem is the warpage problem in a process. Due to the nature of the FOWLP structure, the RDL is wired to multiple layers. The warpage problem arises when a new RDL layer is created. It occurs because the solder ball reflow process is exposed to high temperatures for long periods of time, which may cause cracks inside the package. For this reason, we have studied warpage in the FOWLP structure using commercial simulation software through the implementation of the reflow process. Simulation was performed to reproduce the experiment of products of molding compound company. Young's modulus and poisson's ratio were found to be influenced by the order of influence of the factors affecting the distortion. We confirmed that the lower young's modulus and poisson's ratio, the lower warpage.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.8 no.3
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• pp.90-97
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• 2009

In the study, a design methodology for robust minimization of a warpage in injection-molded part is presented. Taguchi's parameter design method is integrated with a computer simulation tool for injection molding to search for best design with robustness against the process variability by noises. The proposed methodology is based on a two-stage process: (1) reducing a warpage in the part by optimizing the part geometry including the layout and size of ribs, and (2) additionally minimizing the warpage by optimizing process conditions. An example is used to illustrate the usefulness of the design methodology.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.41-45
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• 2018

We have simulated the process induced warpage for panel level package using finite element method. Silicon chips of $5{\times}5mm^2$ were redistributed on $122.4{\times}93.6mm^2$ size panel and the total number of redistributed chips was 221. The warpage at each process step, for example, (1) EMC molding, (2) attachment of detach core, (3) heating, (4) removal of a carrier, and (5) cooling was simulated using ANSYS and the effects of detach core and carrier materials on the warpage were investigated. The warpage behaved complexly depending on the materials for the detach core and carrier. However, glass carrier showed the lower warpage than FR4 carrier regardless of detach core material, and the minimum warpage was observed when the glass was used for the detach core and carrier at the same time.

• Journal of the Semiconductor & Display Technology
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• v.22 no.4
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• pp.124-130
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• 2023

Recently, fan out wafer level packaging, which enables high integration, miniaturization, and low cost, is being rapidly applied in the semiconductor industry. In particular, FOWLP is attracting attention in the mobile and Internet of Things fields, and is recognized as a core technology that will lead to technological advancements such as 5G, self-driving cars, and artificial intelligence in the future. However, as chip density and package size within the package increase, FOWLP warpage is emerging as a major problem. These problems have a direct impact on the reliability and electrical performance of semiconductor products, and in particular, cause defects such as vacuum leakage in the manufacturing process or lack of focus in the photolithography process, so technical demands for solving them are increasing. In this paper, warpage simulation according to the thickness of FOWLP material was performed using finite element analysis. The thickness range was based on the history of similar packages, and as a factor causing warpage, the curing temperature of the materials undergoing the curing process was applied and the difference in deformation due to the difference in thermal expansion coefficient between materials was used. At this time, the stacking order was reflected to reproduce warpage behavior similar to reality. After performing finite element analysis, the influence of each variable on causing warpage was defined, and based on this, it was confirmed that warpage was controlled as intended through design modifications.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.1223-1224
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• 2013

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.755-756
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• 2011

• Journal of Korean Society for Quality Management
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• v.29 no.3
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• pp.86-96
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• 2001

The objective of this research is to develop a robust design methodology for plastic injection molded parts wherein warpage will be minimized by a complex method which is a kind of a simple direct search method. The design space considered for optimization is divided Into two sub-design space : mold and process conditions. Warpage is quantified using the Moldflow injection molding simulation software. The design methodology was applied to an actual part of a fax machine, the Guide-ASF model, through two different design policies. The significance of this study is the synthesis of a computer simulation of injection molding process and optimization technique to determine the optimal robust design solution.