• 제목/요약/키워드: Wafer Bump Inspection

검색결과 1건 처리시간 0.016초

반도체 Bump 검사를 위한 백색광 주사 간섭계의 고속화 (A High-Speed White-Light Scanning Interferometer for Bump Inspection of Semiconductor Manufacture)

  • 고국원;심재환;김민영
    • 한국정밀공학회지
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    • 제30권7호
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    • pp.702-708
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    • 2013
  • The white-light scanning interferometer (WSI) is an effective optical measurement system for high-precision industries (e.g., flat-panel display and electronics packaging manufacturers) and semiconductor manufacturing industries. Its major disadvantages include a slow image-capturing speed for interferogram acquisition and a high computational cost for peak-detection on the acquired interferogram. Here, a WSI system is proposed for the semiconductor inspection process. The new imaging acquisition technique uses an 'on-the-fly' imaging system. During the vertical scanning motion of the WSI, interference fringe images are sequentially acquired at a series of pre-defined lens positions, without conventional stepwise motions. To reduce the calculation time, a parallel computing method is used to link multiple personal computers (PCs). Experiments were performed to evaluate the proposed high-speed WSI system.