• Composites Research
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• v.35 no.2
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• pp.80-85
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• 2022

This work presents an experiment study to evaluate the nanoparticle adhesion and surface hydrophobicity characteristics of Teflon-polyurethane top coat depending on the number of multi-wall carbon nanotube (MWCNT) coatings, which is a carbon-based hydrophobic particle. In order to measure the adhesion between the nanoparticles and the top coat, adhesion pull-off test was performed with different MWCNT oxidation times. Static contact angle and roughness measurements were carried out to characterize the surface hydrophobic behavior. Through the roughness evaluation, it was confirmed that the carbon nanotubes were wetted in the Teflon-polyurethane top coat, and the degree carbon nanotube wetting was confirmed through a USB-microscope. As a result, it was found that the larger the degree of wetting, the better the adhesion. From the experimental results, as the hydrophobicity of Teflon-polyurethane increased, the adhesive propertydecreased with the number of coatings. It was possible to improve the adhesive force and determine the number of coatings of carbon nanotubes with optimized hydrophobicity.

• Korean Journal of Materials Research
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• v.19 no.5
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• pp.288-292
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• 2009

This article shows various factors that influence the thermal-cycling reliability of semiconductor devices utilizing the lead-on-chip (LOC) die attach technique. This work details how the modification of LOC package design as well as the back-grinding and dicing process of semiconductor wafers affect passivation reliability. This work shows that the design of an adhesion tape rather than a plastic package body can play a more important role in determining the passivation reliability. This is due to the fact that the thermal-expansion coefficient of the tape is larger than that of the plastic package body. Present tests also indicate that the ceramic fillers embedded in the plastic package body for mechanical strengthening are not helpful for the improvement of the passivation reliability. Even though the fillers can reduce the thermal-expansion of the plastic package body, microscopic examinations show that they can cause direct damage to the passivation layer. Furthermore, experimental results also illustrate that sawing-induced chipping resulting from the separation of a semiconductor wafer into individual devices might develop into passivation cracks during thermal-cycling. Thus, the proper design of the adhesion tape and the prevention of the sawing-induced chipping should be considered to enhance the passivation reliability in the semiconductor devices using the LOC die attach technique.

• The Journal of Korean Physical Therapy
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• v.11 no.2
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• pp.11-20
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• 1999

We can sec the case of hand injury patient in the industry field. Hand injury has more particularity than other injury cases. Because it is densely a lot of muscle, tendon, bone, vessels, and in progressing speedily to fibrosis, adhesion, stiffness than other joints. If it has baud injury, it is important to the physical therapy in early stage after operation. Otherwise, it is difficult to recover the function. Hand malfunction intimately has to do with the return to work and the grade of disability. There are many different hand injury cases but, we want to investigate several cases. : fracture. joint injury, tendon injury, and want to looking for treatment tine and method about these. So, we'll understand hand injury of industry disaster. and acknowledge of the importance of physical therapy in the early stage through these.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.35-40
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• 2000

Teflon-like fluorocarbon thin film was deposited on various substrates by vapor deposition using PFDA (perfluorodecanoic acid). The fluorocarbon films were characterized by static/dynamic contact angle analysis, VASE (Variable-angle Spectroscopic Ellipsometry) and AFM/LFM (Atomic/Lateral Force Microscopy). Based on Lewis Acid/Base theory, the surface energy ($S_{E}$) of the films was calculated by the static contact angle measurement. The work of adhesion (WA) between de-ionized water and substrates was calculated by using the static contact data. The fluorocarbon films showed very similar values of the surface energy and work of adhesion to Teflon. All films showed larger hysteresis than that of Teflon. The roughness and relative friction force of films were measured by AFM and LFM. Even though the small reduction of surface roughness was found on film on $SiO_2$surface, the large reduction of relative friction farce was observed on all films. Especially the relative friction force on TEOS was decreased a quarter after film deposition. LFM images showed the formation of "strand-like"spheres on films that might be the reason far the large contact angle hysteresis.

• Applied Chemistry for Engineering
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• v.2 no.2
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• pp.175-184
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• 1991

Ultraviolet curable coatings are often used to protect the surface of polymer materials exposed to the ultraviolet radiation. However, the adhesion of epoxy acrylate on poly(vinyl chloride) and the UV curable coating on polystyren are poor. The objective of this work was to improve the adhesion of coating according to various formulations of the reactive diluents and finishing methods using the photografting of multifunctional acrylate and the surface activation on polymer surface impregnated a phtoinitiator. The addition of Tripropylene glycole diacrlate in the formulation of coating results in the improvement of adhesion of coating due to the flexibility. But the increase of the crosslinking density which results from the oxidation of surface during the exposure of UV radiation caused the loss of adhesion of coating exept the photografting method. In the trimethylolpropane triacrylate the improvement of adhesion are considerable due to the chemical bond between multifundtional acrylate and surface. From this work we expect to achieve the varity and functionality in the formulation of coating according to the photografting and surface activating of polymer.

• Composites Research
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• v.25 no.6
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• pp.205-210
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• 2012

The single carbon fiber tensile test was performed with electrical resistance measurement. Tensile property of single carbon fiber which accompanied by the relationship between the electric resistance and the strain was investigated. Since the collected data showed a linear relationship between them, the coefficient of fiber slip ratio (FSR) was obtained by computation. The fragmentation specimen (FS) was tested under tensile loading, and the single carbon fiber broke first due to the stress transferring form matrix to reinforcing fiber. The stress distribution of carbon fiber could be observed via the electrical resistance change. Slipping between carbon fiber and matrix was predicted based on the fragmentation test results, and the FSR was used to evaluate interfacial adhesion comparatively. The large FSR indicated poor interfacial bonding. Work of adhesion between carbon fiber and matrix was measured to verify the FSR method, and two results exhibited a consistent conclusion.

• Journal of Adhesion and Interface
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• v.12 no.3
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• pp.88-93
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• 2011

Optimal dispersion and fabrication conditions of carbon nanotube (CNT) embedded in phenolic resin were determined by electrical resistance measurement; and interfacial property was investigated between plasma treated carbon fiber and CNT-phenolic composites by electro-micromechanical techniques. Wettability of carbon fiber was improved significantly after plasma treatment. Surface energies of carbon fiber and CNT-phenolic nanocomposites were measured using Wilhelmy plate technique. Since surface activation of carbon fiber, the advancing contact angle decreased from $65^{\circ}$ to $28^{\circ}$ after plasma treatment. It was consistent with static contact angle results of carbon fiber. Work of adhesion between plasma treated carbon fiber and CNT-phenolic nanocomposites was higher than that without modification. The interfacial shear strength (IFSS) and apparent modulus also increased with plasma treatment of carbon fiber.

• Journal of Adhesion and Interface
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• v.23 no.4
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• pp.122-129
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• 2022

In this study, the hydrophilicity of the metal fiber is improved by introducing an oxygen-containing functional group to the fiber surface after treatment of the metal fiber using the oxygen plasma treatment time as an experimental variable. For the surface modification of metal fibers, changes in surface properties before and after plasma treatment were observed using SEM and x-ray photoelectron spectroscopy (XPS). In order to observe the effect of the plasma treatment time on the surface of the metal fiber, the change in contact angle of the metal fiber with respect to a polar solvent and a non-polar solvent was measured. After calculating the change in surface free energy using the measured contact angle, the contact angle and the surface free energy for metal fibers before and after oxygen plasma treatment were compared, and the correlation with the adhesion work was also considered. The microdroplet specimens were prepared to investigate the effect of surface changes of these metal fibers on the improvement of shear strength at the interface when combined with other materials and the interfacial shear strength was measured, and the correlation with the adhesion work was also identified. Therefore, the oxygen plasma treatment of the metal fiber results in an increase in the physical surface area on the fiber surface and a change in contact angle and surface energy according to the introduction of the oxygen-containing functional group on the surface. This surface hydrophilization resulted in improving the interfacial shear strength with the polymer resin.

• Korean Journal of Materials Research
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• v.30 no.3
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• pp.105-110
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• 2020

Cu/PET composite films are widely used in a variety of wearable electronics. Lifetime of the electronics is determined by adhesion between the Cu film and the PET substrate. The formation of an anisotropic nanostructure on the PET surface by surface modification can enhance Cu/PET interfacial adhesion. The shape and size of the anisotropic nanostructures of the PET surface can be controlled by varying the surface modification conditions. In this work, the effect of Cu/PET interface nanostructures on the failure mechanism of a Cu/PET flexible composite film is studied. From observation of the morphologies of the anisotropic nanostructures on plasma-treated PET surfaces, and cross-sections and surfaces of the fractured specimens, the Cu/PET interface area and nanostructure width are analyzed and the failure mechanism of the Cu/PET film is investigated. It is found that the failure mechanism of the Cu/PET flexible composite film depends on the shape and size of the plasmatreated PET surface nanostructures. Cu/PET interface nanostructures with maximal peel strength exhibit multiple craze-crack propagation behavior, while smaller or larger interface nanostructures exhibit single-path craze-crack propagation behavior.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.2
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• pp.153-157
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• 2006

In this work, the effects of plasma treatment on surface properties of semiconductive silicone rubber were investigated in terms of X-ray photoelectron spectroscopy (XPS) and contact angles, The adhesion characteristics of semiconductive-insulating interface layer of silicone rubber were studied by measuring the T-peel strengths, The results of the chemical analysis showed that C-H bonds were broken due to plasma discharge and Silica-like bonds(SiOx, x=3${\~}$4) increased, It is thought that semiconductive silicone rubber surfaces treated with plasma discharge led to an increase in oxygen-containing functional groups, resulting in improving the degree of adhesion of the semiconductive-insulating interface layer of silicone rubber. However, the oxygen plama for 20 minute produces a damaged oxidized semiconductive silicone rubber layer, which acts as a weak layer producing a decrease in T-peel strength, These results are probably due to the modifications of surface functional groups or polar component of surface free energy of the semiconductive silicone rubber.