• Title/Summary/Keyword: WML

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Implementation and Design of XML-Based Management System for Instructional Software (교육용 소프트웨어를 위한 XML 기반 관리 시스템 설계 및 구현)

  • Lee, Yun-Bae;Lee, Nu-Ri
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.12 no.7
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    • pp.1329-1337
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    • 2008
  • The project of Education information is promoted to maximize the efficiency of Teaching-Learning at schools. So Ministry of Education & Human Resources Development develops and spreads the Computer Assisted Instruction(CAI) and outstanding Educational Software to help learners who can utilize this software and make learning environment to form their own recognition. As the number of this software is increased, the necessity of management of Educational Software is required. This study divides Educational Software into three kinds, teaching-learning software, business management software, and system management software, and suggests how to use these softwares effectively according to this division. After the users log into the system through joining members, they are divided into manager module, teachers module, and students module. The manager manages all software like registration, revision, reference of date and so on. The teacher accesses properly. The student accesses teaching-learning software and prepares and reviews his lessons at any time.

A Study on the Mechanical and Physical Properties of Sawdustboard combined with Plastic Chip (플라스틱칩 결체(結締) 톱밥보드의 기계적(機械的) 및 물리적(物理的) 성질(性質)에 관(關)한 연구(硏究))

  • Lee, Phil-Woo;Suh, Jin-Suk
    • Journal of the Korean Wood Science and Technology
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    • v.15 no.3
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    • pp.44-55
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    • 1987
  • In order to study the effect of sawdustboard combined with plastic chips, 0.5mm($T_1$), 1mm($T_2$), 1.4mm($T_3$) thick nylon fiber. polypropylene rope fiber(RP), and 0.23mm thick moth-proof polypropylene net fiber(NP) were cut into 0.5, 1, 2cm long plastic chips. Thereafter, sawdustboard combined with plastic chips prepared as the above and plastic non-combined sawdustboard(control) were manufactured into 3 types of one-, two-, and three layer with 5 or 10% combination level. By the discussions and results at this study, the significant conclusions of mechanical and physical properties were summarized as follows: 1. The MORs were shown in the order of 3 layer> 2 layer> 1 layer among plastic non-combined boards, and $T_3$ < $T_2$ < $T_1$ < RP (NP(5%) < NP(l0%) among plastic combined boards. In 2cm long plastic chip in 1 layer board, the highest strength through all the composition was recognized. 1 layer board showing the lower strength with 0.5cm plastic chip rendered to the bending strength improvement by 2 or 3 layer board composition. On the other hand, 2 or 3 layer combined with 1, 2cm long polypropylene net fiber chips incurred MOR's conspicuous decrease requiring optimum plastic chip combined level and consideration to combined type. 2. MOE in plastic non-combined 3 layer board exhibited sandwich construction effect by higher resin content application to surface layer in the order of 3layer>1layer>2layer with the highest stiffness of the board combined with polypropylene chip, while nylon chip-combined board had little difference from plastic non-combined board. In relevant to length and layer effect, 3 layer board combined with the 0.5cm long polypropylene net fiber chip in 5% and 10% combined level presented 34-43% and 44-76% stiffness increase against plastic non-combined board(control), respectively. Moreover, in 1 layer board, 30% stiffness increase with 10% against 5% combined level in the 1 and 2cm long polypropylene net fiber chip was obtained. 3. Stress at proportional limit(Spl) showing the fiber relationship (r: 0.81-0.97) between MOR presented in the order of 1 layer<2 layer<3 layer in plastic non-combined board. Correspondingly, combined effect by layer and plastic chip length was similar to MOR's. 4. Differently from previous properties(MOR, MOE, Spl). work to maximum load(Wml) of 2 layer board approached to that of 3 layer board. Conforming the above phenomenon. 2 layer combined with 0.5cm long polypropylene net fiber chip kept the greater work than 1 layer. The polypropylene combined board superior to nylon -and plastic non - combined board seemed to have greater anti - failing capacity. 5. Internal bond strength(IB), in contrast to MOR's tendency. showed in the order of T1

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Effect of fire - retardant treatment and redrying on the mechanical properties of radiata pine (내화처리(耐火處理) 및 재건조(再乾操)가 라디에타소나무의 역학적(力學的) 성질(性質)에 미치는 영향(影響))

  • Chung, Doo-Jin;Jo, Jae-Sung;Yun, Ki-Eon;Kim, Jae-Jin;Kim, Gyu-Hyeok
    • Journal of the Korean Wood Science and Technology
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    • v.27 no.1
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    • pp.37-49
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    • 1999
  • The effect of fire-retardant treatment and redrying on the mechanical properties of radiata pine sapwood were evaluated. Small, clear specimens were treated with three different fire-retardant(FR) chemicals, borax-boric acid(BRX), minalith(MIN), and pyresote(PYR), with target retentions of 30 and 60kg/$m^3$, and then redried at maximum dry-bulb temperature of $25^{\circ}C$, $60^{\circ}C$, $80^{\circ}C$ or $110^{\circ}C$. Each specimen, including untreated and water-treated controls, was tested in static bending and in compression parallel to grain. The extent of strength reduction was dependent on the type of FR chemicals, retention, and redrying temperature, and a highly significant interaction existed between FR treatment and redrying temperature. Modulus of rupture(MOR) and work to maximum load(WML) were significantly decreased by FR treatment and redrying. None of three FR chemicals adversely affect modulus of elasticity (MOE) and maximum crushing strength(MCS). MOE of BRX treatment and MCS of both BRX and PYR treatment increased significantly compared to untreated controls. No significant differences existed between retention levels except for MOE and MCS of some combinations of FR chemicals and redrying temperatures. Although MOE and MCS was not significantly affected by any of the redrying temperatures, these properties were generally decreased with the increase in redrying temperature. The significant reduction in MOR and WML was observed in BRX treatment when dried at temperatures of $60^{\circ}C$ and above, and in MIN and PYR treatment when dried at temperatures of $80^{\circ}C$ and above. Consequently, BRX-treated radiata pine should not be redried at temperatures >$60^{\circ}C$, and MIN- and PYR-treated radiata pine should not be redried at temperatures > $80^{\circ}C$ where bending strength and energy-related properties are important design considerations.

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