• Title/Summary/Keyword: WLP

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Fabrication of the Wafer Level Packaged LED Integrated Temperature Sensor and Configuration of The Compensation System for The LED's Optical Properties (온도센서가 집적된 WLP LED의 제작과 이를 통한 광 특성 보상 시스템의 구현)

  • Kang, In-Ku;Kim, Jin-Kwan;Lee, Hee-Chul
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.49 no.7
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    • pp.1-9
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    • 2012
  • In this paper, resistance temperature detector (RTD) integrated into the LED package is proposed in order to solve the temperature dependence of LED's optical properties. To measure the package temperature in real time, the RTD type temperature sensor having excellent accuracy and linearity between temperature change and resistance change was adopted. A stable metallic film is required for long term reliability and stability of the RTD type temperature sensor. Therefore, deposition and annealing condition for the film were determined. Based on the determined condition, the RTD type temperature sensor with the sensitivity of about $1.560{\Omega}/^{\circ}C$ was fabricated inside the LED package. In order to configurate the LED package system keeping the constant brightness regardless of the temperature, additional conversion circuit and control circuit boards were fabricated and added to the fabricated LED package. The proposed system was designed to compensate the light intensity caused by temperature change using the variable duty rate of driving current. As a result, the duty rate of PWM signal which is the output signal of the configurated system was changed with the temperature change, and the duty rate was similarly varied with the target duty rate. Consequently, it was focused the fabricated RTD can be used for compensating the optical properties of LED and the LED package which exhibits constant brightness regardless of the temperature change.