• Journal of the Korean Electrochemical Society
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• v.14 no.2
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• pp.71-76
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• 2011

Fe-tetramethoxyphenylporphyrin on carbon black (Fe-TMPP/C) is examined and compared with carbon (C) and Pt-coated carbon (Pt/C) for oxygen reduction reaction in a two chambered microbial fuel cell (MFC). The Fe-TMPP/C is prepared by heat treatment and characterized using SEM, TEM, and XPS. The electrochemical properties of catalysts are characterized by voltammerty and single cell measurements. It is found that the power generation in the MFC with Fe-TMPP/C as the cathode is higher than that with Pt/C. The maximum power of the Fe-TMPP/C is 0.12 mW compared with 0.10 mW (Pt/C) and 0.02 mW (C). This high output with the Fe-TMPP/C indicates that MFCs are promising in further practical applications with low cost macrocycles catalysts.

• Transactions of the Korean Society of Automotive Engineers
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• v.9 no.6
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• pp.103-111
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• 2001

During cold-start period, the reduction of exhaust emissions is a challenging task. To decrease harmful gaseous substances such as HC, it is necessary to realize a fast catalyst warm-up. In this study, the performance of dual pipe exhaust system have been carried out through different test mode. From measurement of gas temperature and HC concentration, the following conclusions were derived ; 1) Compared with single pipe, dual pipe exhaust system remarkably increase temperature of exhaust gas going through M.C.C(Main Catalytic Converter). 2) W.C.C.(Warm-up Catalytic Converter) also decreases HC emission. To reduce HC emission, it is helpful to use W.C.C. as well as dual pipe exhaust system. 3) Using finite element method, it is shown that inner parts have much higher distribution of temperature than outer parts.

• Korean Journal of Microbiology
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• v.36 no.2
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• pp.119-124
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• 2000

Thirty three strains of bacteria were isolated from the wastewater and soil contaminated a chemical softener, nrganopolysiloxane. Of these, five strains which showed higher activities for removal this chemical were finally selected for further study. By five strains the 2,500 mgll chemical softener was removed 65.2-67.9% at $37^{\circ}C$ for 5 days by shaking. The pH optimum for growth of W3721, S3712, and S3723 strain were at around pH 7.0-7.5, and W2811, and W2823 strain were at pH 6.5-7.0, respectively. The temperature optimum for growth of W3712 strain was at $37^{\circ}C$ and the other four strains were at TEX>$30^{\circ}C$. The optimal pH and temperature for removal by W3712 strain was initial pH 7.0 and $37^{\circ}C$ respechvely. The W3712 strain was identified and named as Corynebacterium pseudodiphtheriticum W3712 based on its morphological and physiological characteristics.

• Proceedings of the Korea Institute of Fire Science and Engineering Conference
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• 2010.04a
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• pp.408-412
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• 2010

내화수림대 조성을 위하여 난대수종 중 내화성 수종을 선발하고자 콘칼로미터를 이용하여 5수종(감탕나무, 구실잣밤나무, 동백나무, 붉가시나무, 후박나무)을 대상으로 수피, 가지, 생엽 등 부위별 연소특성을 분석하였다. 난대수종의 평균 열방출율(HRR)은 감탕나무($167.66kW/m^2$)>구실잣밤나무($142.80kW/m^2$)>동백나무($116.78kW/m^2$)>후박나무($95.48kW/m^2$)>붉가시나무($79.80kW/m^2$) 순으로 나타났다. 따라서, 붉가시나무가 산불 발생시 다른 수종에 비해서 화재강도가 낮은 것으로 사료된다. 수종별 부위(생엽, 가지, 수피)의 착화특성을 분석한 결과, 생엽에서 최초자연발화온도는 동백나무, 감탕나무($697^{\circ}C$)>후박나무($672^{\circ}C$)>구실잣밤나무($663^{\circ}C$)>붉가시나무($658^{\circ}C$) 순으로 나타났으며, 가지에서는 구실잣나무($671^{\circ}C$)>후박나무($669^{\circ}C$)>감탕나무($661^{\circ}C$)>붉가시나무($657^{\circ}C$)>동백나무($591^{\circ}C$) 순으로 나타났으며, 수피에서 동백나무($839^{\circ}C$)>후박나무($804^{\circ}C$)>동백나무($784^{\circ}C$)>붉가시나무($780^{\circ}C$)>감탕나무($749^{\circ}C$) 순으로 나타났다. 수종별 부위에 있어서 최초자연발화온도가 다른 것은 수종에 따라 조직과 세포간극 형태에 따라 수분함량의 차이가 착화특성을 다르게 나타내는 것으로 사료된다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.156-157
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• 2008

반도체 소자 회로의 집적도가 높아짐에 따라 선폭이 감소하였고 고온 공정이 필요하게 되었다. 기존의 반도체 회로 배선 재료인 Al을 사용할 경우 소자의 속도가 느려져서 소자의 신뢰도가 떨어지고 고온공정에서의 문제가 발생되어 이를 해결하기 위한 차세대 배선 물질로 비저항이 낮은 Cu의 사용이 요구되고 있다. 하지만 Cu는 Si와의 확산이 잘 일어나기 때문에 그 사이에서 확산을 막아주는 확산방지막에 대한 필요성이 제기되었고 연구가 활발히 진행되고 있다. 본 논문에서는 Cu와 Si사이의 확산을 방지하기 위한 W-C-N 확산방지막을 물리적 기상 증착법(PVD)중 하나인 RF Magnetron Sputtering 방식을 사용하여 증착하였다. 고온 공정에서의 안정성을 알아보기 위해 $600^{\circ}C$ 부터 $900^{\circ}C$ 까지 $100^{\circ}C$ 단위로 열처리를 하였고 4-point probe 장치를 사용하여 열처리 온도에 따른 비저항 측정을 통해 W-C-N 확산방지막의 특성을 분석하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.1079-1082
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• 2004

CuPc와 ZnPc를 이용하여 이종 접합 구조에서의 광기전 특성을 연구하였다. $CuPc/C_{60}$, $XnPc/C_{60}$의 이종 접합 구조에서 $C_{60}$의 접합 두께 비율을 1:1 (20nm:20nm), 1:2 (20nm:40nm), 1:3 (20nm:60nm)로 가변하여 두께와 물질에 따른 광기전 특성 및 엑시톤 억제층의 효과를 분석하였다. 광원은 500W Xe lamp를 이용하였으며, 광원의 세기는 보정된 radiometer/photometer와 Si-photodiode로 dark, 10, 25, 60, 80 그리고 100mW/$cm^2$로 주사하였다.

• Nuclear Engineering and Technology
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• v.56 no.4
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• pp.1490-1500
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• 2024

Helium-induced defect nucleation and accumulation in polycrystalline W and W0.5 wt%ZrC (W0.5ZrC) were studied in-situ using the transmission electron microscopy (TEM) combined with 40 keV He⁺ irradiation at 800 and 1000℃ at the maximum damage level of 1 dpa. Radiation-induced dislocation loops were not observed in the current study. W0.5ZrC was found to be less susceptible to irradiation damage in terms of helium bubble formation and growth, especially at lower temperature (800 ℃) when vacancies were less mobile. The ZrC particles present in the W matrix pin the forming helium bubbles via interaction between C atom and neighbouring W atom at vacancies. This reduces the capability of helium to trap a vacancy which is required to form the bubble core and, as a consequence, delays, the bubble nucleation. At 1000 ℃, significant bubble growth occurred in both materials and all the present bubbles transitioned from spherical to faceted shape, whereas at 800 ℃, the faceted helium bubble population was dominated in W.

• Journal of the Korean Vacuum Society
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• v.18 no.3
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• pp.203-207
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• 2009

Copper is known as a replacement for aluminum wire which is used for semiconductor. Because specific resistance of Cu ($1.67{\mu}{\Omega}$-cm) is lower than that of Al ($2.66{\mu}{\Omega}$-cm), Cu reduce RC delay time. Although melting point of Cu($1085^{\circ}C$) is higher than melting point of Al, Cu have characteristic to easily react with Silicon(Si) in low temperature, and it isn't good at adhesive strength with Si. For above these reason, research of diffusion barrier to prevent reaction between Cu and Si and to raise adhesive strength is steadily advanced. Our study group have researched on W-C-N (tungsten-carbon-nitrogen) Diffusion barrier for preventing diffusion of Cu through semiconductor. By recent studies, It's reported that W-C-N diffusion barrier can even precent Cu and Si diffusing effectively at high temperature. In this treatise, we vaporized different proportion of N into diffusion barrier to research Cu's Electromigration based on the results and studied surface hardness in the heat process using nano scale indentation system. We gain that diffusion barrier containing nitrogen is more stable for Cu's electromigration and has stronger surface hardness in heat treatment process.

• Journal of the Korean Applied Science and Technology
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• v.40 no.6
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• pp.1268-1277
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• 2023

In this study, to evaluate the possibility of utilizing Chamaecyparis obtusa (Siebold & Zucc.) Endl. (C. obtusa) leaf fractions as anti-inflammatory functional materials, C. obtusa extract extracted with 99% ethanol (CO99EL) was fractionated with hexane (CO99EL-H), chloroform (CO99EL-C), ethyl acetate (CO99EL-E), butanol (CO99EL-B) and distilled water (CO99EL-W). The anti-inflammatory effects of each fraction was performed using lipopolysaccharide (LPS)-induced RAW264.7 mouse macrophages. Cytotoxicity was highest in CO99EL-H and CO99EL-C and lowest in CO99EL-W. Interestingly, LPS-induced iNOS expression and NO production were significantly reduced by CO99EL-H and CO99EL-E, and COX-2 expression was significantly reduced by CO99EL-B and CO99EL-W. In addition, interleukin (IL)-1𝛽, an inflammatory cytokine increased by LPS, was significantly reduced by CO99EL-C, CO99EL-E, CO99EL-B and CO99EL-W, and IL-6 was significantly reduced by CO99EL-B and CO99EL-W. Therefore, the janus kinase (JAK)/signaling transducer and activator of transcription (STAT) signaling pathway activated by LPS was significantly reduced by CO99EL-H and CO99EL-C, and the mitogen-activated protein kinase (MAPK) signaling pathway was slightly reduced by CO99EL-H and CO99EL-C. However, nuclear factor (NF)-𝜅B activity was not reduced by any fractions. Based on the results of this study, it was confirmed that CO99EL fractions have different anti-inflammatory mechanisms depending on the solvent used for fractionation.

• Fire Science and Engineering
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• v.32 no.1
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• pp.46-56
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• 2018

The paper relates to a study on the conduction heat transfer characteristics according to the heating temperature of lightweight panel wall material. Plywoods, marbles, heat resistant glasses, as well as general gypsum board and fire-proof gypsum board, which have been widely used for lightweight panel wall material, were selected as experiment samples, and heating temperatures were set as $100^{\circ}C$, $200^{\circ}C$, $300^{\circ}C$, $400^{\circ}C$, $500^{\circ}C$ and $600^{\circ}C$. Next, each of the heating temperatures were introduced on the bottom part of the wall material for 30 minutes, and analyses were made on the heat transfer characteristics to the backside part on the top part through conduction. As results of the experiment, the maximum backside temperatures were measured up to $190^{\circ}C$ for a general gypsum board, $198^{\circ}C$ for a fire-proof gypsum board, $189^{\circ}C$ for a plywood, $321^{\circ}C$ for a marble, and $418^{\circ}C$ for a heat resistant glass as heating temperatures were introduced maximum of $600^{\circ}C$. In addition, the maximum change rate of conduction heat transfer were measured up to 85 W for a general gypsum board, 95 W for a fire-proof gypsum board, 67 W for a plywood, 1686 W for a marble, and 3196 W for a heat resistant glass as the maximum heating temperatures were introduced up to $600^{\circ}C$. Also, carbonization characteristics of the wallpapers were measured to visually check the danger of conduction heat transfer, and the results showed that smokes were first generated on the attached wallpapers for the heating temperature $600^{\circ}C$, which were 1021 s for a general gypsum board, 978 s for a fire-proof gypsum board, 1395 s for a plywood, 167 s for a marble, and 20 s for a heat resistant glass, and that the first generation of carbonization were 1115 s for a general gypsum board, 1089 s for a fire-proof gypsum board, 1489 s for a plywood, 192 s for a marble, and 36 s for a heat resistant glass.