• 한국표면공학회지
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• 제28권4호
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• pp.207-218
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• 1995

Tungsten(W) metal has excellent properties in heat-resistance, corrison-resistance and impact-resistance but W-Metal is hard to sinter because higher than $2,000^{\circ}C$ is required to sinter W-powder. Con-sequently, a deposit technique of Nikel Phosphorus(NiP) on W-powber by the liquid reduction precipitation method was performed. Sintering temperature of the resulting W-NiP composite was lowered around to $1,000^{\circ}C$, and the mechanical properties of the sintered body was studied. The most suitable conditions for NiP thin film deposit on W-Powder by the liquid reduction precipitation method, which are composition, concentration, pH and temperature of the liquid reduction solution, were considered. The activated sintering was carried out in a reducing condition furnace. Components and properties of the sintered body were investigated by the density and the hardness measurements, X- ray diffraction analysis, and microscopic photographs of the surface. Quantity of NiP thin film on W-powder could be varied by the change of the liquid reduction solution composition. The sintering temperature of W-NiP composite powder is lowered to $950^{\circ}C$ from $2,000^{\circ}C$ and the hardness is increased (ca. 720 Hv). Large shrinkage could be observed since density was increased from 5.5 to 11.0 g/$cm^2$ which 86.2% of theoretical density. W metal and $Ni_3P$ crystal were detected through X-ray diffraction on the sintered body. Perfectly activated sintering was observed by microscopic photographs.

• 한국초전도저온공학회:학술대회논문집
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• 한국초전도저온공학회 2003년도 추계학술대회 논문집
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• pp.139-141
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• 2003

Multiple CeO$_2$/YSZ/Y$_2$O$_3$buffer layers, and subsequent YBCO films were deposited on the biaxially textured pure Ni and Ni ＋ 3at％W substrates using pulsed laser deposition. The deposition conditions of buffer layers on Ni and NiW were studied and compared. Good biaxial textures of buffer layers have been obtained on both substrates. The Jc's of YBCO films on these metal substrates were greater than 1$\times$10$^{6}$ A/$\textrm{cm}^2$ at 77K, 0T.

• 한국대기환경학회지
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• 제3권1호
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• pp.1-12
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• 1987

A series of supported sulfided Ni-W/$\gamma-Al_2O_3$ and Co-W/$\gamma-Al_2O_3$ catalysts with different nickel and cobalt contents were studied in the hydrodenitrogenation of pyridine dissolved in n-heptane. The ranges of experimental conditions were at the temperatures between 453 and 753 K, and the pressures between 30 and 50 Bar. The catalytic activities with different nickel and cobalt contents were shown to be maximum at Ni/Ni+W = 0.2 - 0.3, Co/Co+W = 0.3 - 0.4. Pyridine conversion increased with pressure and temperature and the step of piperidine formation was found to be irreversible. The reaction orders in Ni-W/$\gamma-Al_2O_3$ and Co-W/$\gamma-Al_2O_3$ catalysts were the first with respect to pyridine and reaction rate constants decreased with increase of initial pyridine concentration and their activation energies were 12.98 and 9.23 kcal/mol, respectively.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1988년도 춘계학술대회 논문집
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• pp.43-45
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• 1988

Four W/Cu system(60wt%W-40wt%Cu, -0.lwt%Ni, -0.5wt%Ni, -0.lwt%C) and four WC/Cu system(60wt%WC-40wt%Cu, -0.lwt%Ni, -0.5wt%Ni, 0.lwt%C) electrical contacts were prepared by a press-sinter-infiltration process to compare with their properties. Hardness and electrical conductivity are proportional to the refractory metal(W or WC) properties and showed the effect of additives. Arc erosion trend of switch test is changed by current level. High currant test at 1kA showed a different crack formation pattern and erosion mode between W/Cu system and WC/Cu system contacts.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2016년도 추계학술대회 논문집
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• pp.166.1-166.1
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• 2016

철(Fe)을 주체로 하는 경질피막의 하나로 전극에 의한 W를 함유한 피막의 제조가 알려져 있다. W는 단독으로 수용액으로부터 석출시킬 수 없고 Fe, Ni 등의 철(Fe)족 금속이온을 함유한 수용액에서 유도 공석한 합금피막을 얻을 수 있다. 합금도금 피막은 비정질 구조를 형성하기 쉽고 내산성, 내마모성이 뛰어나고 고융점 금속(W)을 함유한 피막이기 때문에 내열재료로 이용할 수 있다. 본고에서는 Fe-Ni-W 합금도금의 피막 특성에 미치는 아스코르빈산염 농도의 영향에 주목하여 얻은 피막의 조성, 결정구조, 경도, 내마모성과 열처리 영향을 기술하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 춘계학술대회 논문집 유기절연재료 방전 플라즈마연구회
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• pp.11-14
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• 2003

Sintered Cu-W has been used for the electrode of GIS for interrupting the abnormal current. In this study the effect of Ni addition in Cu-W electrode was investigated. Cu-W electrodes used contains 0.1~0.2wt% Ni and were conducted the experiments which was attacked by DC arc test (70V-70A) for 300 times periodically. As the contents of Ni in Cu-W electrode increase, the hardness and electrical conductivity were decreased. The weight change ($\Delta$mg) of electrode after DC arc test increased with increasing Ni contents and test times. The hardness and electrical conductivity of electrode after DC arc test were decreased compared with non-arc affected electrode, which was owing to the defects near surface of electrode and degradation by arc heat. It was considered that Cu in the Cu-W electrode was scattered to all directions by arc heat, therefore, the electrodes were damaged and deformed in the surface and cross-section of electrode. It is difficult to estimate directly the characteristics of Cu-W electrode for GIS related with high voltage and current from the results of DC arc test conducted in this study. However, the results of the effect of Ni addition in Cu-W electrode could be applied for the research of electrode for GIS.

• 한국초전도ㆍ저온공학회논문지
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• 제7권2호
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• pp.7-10
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• 2005

The magnetic properties of a series of both annealed (biaxially textured) and as-rolled (non-textured) Ni-xW alloy tapes with compositions x = 0,1,3, and 5 at.$\%$, were studied. Characterization methods included XRD analyses to investigate the biaxial cube texturing of the annealed Ni-W alloy tapes and studies of the magnetization M for both annealed and as-rolled Ni-W alloy tapes. Both the isothermal mass magnetizations M(H) of a series of samples at different fixed temperatures and M(T) in fixed field, employing a PPMS-9 (Quantum Design), were measured. The Ni-W alloys have shown much reduced ferromagnetism as W-content x increases. Both the saturation magnetization Msat and Curie temperature Tc decrease linearly with W-content x, and both Msat and Tc go to zero at critical concentration of Xc - 9.50 at. $\%$ W.

• 한국분말재료학회지
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• 제6권1호
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• pp.36-41
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• 1999

The present work has attempted to investigate the dependence of Cu infiltration kinetics on in-situ structure modification of W powder skeleton in W-Cu system. In-situ structure modification of W skeleton by addition of 0.3wt%Ni-P eutectic alloy was designed to proceed during heat-up of the W compact for Cu infiltration process. It was found that the Ni-P added W skeleton underwent remarkable stucture change only during heating-up. its structure was composed of large necks of W particles above 0.5 in the ratio of neck to particle size and smooth pore channels. The infiltration experiment showed that the infiltration kinetics for the W-Ni-P followed well the linear relationship of h vs. $t^{1/2}$ the rate constant K of which was in good agreement with the theoretical value. On the other hand, in case of the pure W skeleton a lower K value by 20% than the theoretical one was obatined. Such discrepancy is discussed in terms of skeleton structure induced infiltration mechanics.

• Journal of Welding and Joining
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• 제13권4호
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• pp.147-154
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• 1995

In order to study the bonding mechanism of Ni/B/Ni transient liquid phase bonding system, width of liquid layers were calculated, where in this system melting point of insert material(B) is higher than bonding temperature and melting point of base metal(Ni). Caclulated values were compared with experimental ones which were measured by bonding Ni/B/Ni system at 1433-1474K under vacuum atmosphere. As results, the width of initial liquid layer of Ni/B/Ni system was calculated as $W_{IL}$ = $W_{o}$[1 + {2.100..rho.$_{S/}$ ( $X_{3}$ + $X_{4}$)..rho.$_{Ni}$ }-.rho.$_{S/}$.rho. Ni/], and it was nearly same with experimental values. Maximum width of liquid layer, width of liquid layer during isothermal solidification and isothermal solidification time were calculated also.o.o.o.

• 대한금속재료학회지
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• 제46권11호
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• pp.725-729
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• 2008

Deposition characteristics of electroless plated Ni-W-P films were investigated for various complexing agents. Used complexing agents are sodium citrate, sodium gluconate and sodium malonate. In this study, the existing mixed potential theory could explain the overall mechanism of Ni-W-P electroless plating for all complexing agents. The deposition rate could be also expected by the theory. The deposited Ni-W-P films were evaluated in term of surface hardness and corrosion resistance. Microhardness of the deposit increased about 1,000 Hv after heat treatment for one hour at $400^{\circ}C$, because it was above the crystallization temperature of $Ni_3P$. The deposited Ni-W-P films can exhibit excellent corrosion resistance in using sodium malonate as a complexing agent, the other hand the using sodium gluconate was the worst corrosion resistance. The worst corrosion resistance was due to a large number of nano-sized pin-holes or small pores. The plating current at the mixed potential increases when the using sodium malonate as a complexing agent, it was explained by the cross section.