• 제목/요약/키워드: Voids

검색결과 900건 처리시간 0.029초

Effects of Air Void at the Steel-Concrete Interface on the Corrosion Initiation of Reinforcing Steel in Concrete under Chloride Exposure

  • Nam Jin-Gak;Hartt William H.;Kim Kijoon
    • 콘크리트학회논문집
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    • 제17권5호
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    • pp.829-834
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    • 2005
  • A series of reinforced G109 type specimens was fabricated and pended with a 15 weight percent NaCl solution. Mix design variables included 1) two cement alkalinities (equivalent alkalinities of 0.32 and 1.08), 2) w/c 0.50 and 3) two rebar surface conditions (as-received and wire-brushed). Potential and macro-cell current between top and bottom bars were monitored to determine corrosion initiation time. Once corrosion was initiated, the specimen was ultimately autopsied to perform visual inspection, and the procedure included determination of the number and size of air voids along the top half of the upper steel surface. This size determination was based upon a diameter measurement assuming the air voids to be half spheres or ellipse. The followings were reached based upon the visual inspection of G109 specimens that were autopsied to date. First, voids at the steel-concrete interface facilitated passive film breakdown and onset of localized corrosion. Based upon this, the initiation mechanism probably involved a concentration cell with contiguous concrete coated and bare steel serving as cathodes and anodes, respectively. Second, the corrosion tended to initiate at relatively large voids. Third, specimens with wire-brushed steel had a lower number of voids at the interface for both cement alkalinities, suggesting that air voids preferentially formed on the rough as-received surface compared to the smooth wire brushed one.

직접접합 실리콘/실리콘질화막//실리콘산화막/실리콘 기판쌍의 선형가열에 의한 보이드 결함 제거 (Eliminating Voids in Direct Bonded Si/Si3N4‖SiO2/Si Wafer Pairs Using a Fast Linear Annealing)

  • 정영순;송오성;김득중;주영철
    • 한국재료학회지
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    • 제14권5호
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    • pp.315-321
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    • 2004
  • The void evolution in direct bonding process of $Si/Si_3$$N_4$$SiO_2$/Si silicon wafer pairs has been investigated with an infrared camera. The voids that formed in the premating process grew in the conventional furnace annealing process at a temperature of $600^{\circ}C$. The voids are never shrunken even with the additional annealing process at the higher temperatures. We observed that the voids became smaller and disappeared with sequential scanning by our newly proposed fast linear annealing(FLA). FLA irradiates the focused line-shape halogen light on the surface while wafer moves from one edge to the other. We also propose the void shrinking mechanism in FLA with the finite differential method (FDM). Our results imply that we may eliminate the voids and enhance the yield for the direct bonding of wafer pairs by employing FLA.

PD Occurrence Characteristics according to Voltage and Time in Solid Insulator

  • Park, Sung-Hee;Shin, Dal-Woo;Lim, Kee-Joe;Park, Young-Guk;Kang, Sung-Hwa
    • KIEE International Transactions on Electrophysics and Applications
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    • 제3C권1호
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    • pp.10-14
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    • 2003
  • The occurrence of partial discharge (PD) in solid dielectrics is very harmful because it leads to the deterioration of insulation by electrical, chemical, and thermal reactions as a combined action of the discharged ions bombarding the surface and by the action of chemical compounds that are formed by the discharge. Consequently, if any defects are present in the solid insulation system, performance decreases until the system breaks down. Therefore, removing or suppressing the defect is very important. Voids are a typical defect in the solid insulation system and are very harmful because they deteriorate insulation. As a basic step, studying the properties of PD in voids is important because an accurate knowledge of these properties is required to estimate the deterioration of voids. In this paper, the correlation between the size of voids and internal PD is discussed as a function of the time of the applied voltage and its magnitude. Magnitude, repetition rate, average discharge power, and average discharge current of PD in specimens with large voids were found to be larger than the others in this experiment. The smaller specimens had voids when the magnitude and number of PDs were reduced.

고무 인상채득시 지대치재료와 표면처리법의 영향 (THE EFFECT OF ABUTMENT MATERIALS AND SURFACE TREATMENT ON RUBBER BASE IMPRESSION)

  • 정도진;양홍서
    • 대한치과보철학회지
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    • 제39권2호
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    • pp.146-156
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    • 2001
  • The purpose of this study was twofold. One was to evaluate the wettability of 4 elastomeric impression materials on tooth and different kinds of filling materials. The other was to identify the effect of topical surfactants sprayed on the surface of each impression. The elastomeric impression mate rials used in this experimental study were one polyether(Impregum F) and three polyvinyl siloxanes(Provil novo, Zerosil, Imprint). The abutments were prepared for 3/4 crown or onlay on the extracted human first molar. The filling materials used in this study for the duplication of prepared abutment were composite resin, amalgam, and casting metal. Impression was taken by manufacturer's recommendations and the number of voids on the impression surface was counted. The topical surfactants were Spannex $II^{(R)}$ and $Cohere^{(R)}$. The wettability was evaluated by comparing the number of voids between non-treated group and treated groups. The results were as follows : 1. $Zerosil^{(R)}$ showed the least number of voids on the impression surface. The number of voids increased in order of Provil $novo^{(R)}$, Impregum $F^{(R)}$, and $Imprint^{(R)}$. 2. Impregum $F^{(R)}$ and $Zerosil^{(R)}$ showed the least number of voids on the surface of dental stone master cast. The number is inclosed in order of Provil $novo^{(R)}$ and Imprint 3. When abutment material is tooth, the number of voids on the surface of master cast was smallest compared with that of other abutment materials. The number of voids increased in order of casting metal, amalgam and composite resin 4. The number of voids on the surface of the dental stone master cast was smallest when Spannex $II^{(R)}$ was used, followed by $Cohere^{(R)}$ treated group and non-treated group. These results suggest that the difference in wettability caused by the types of rubber base impression materials as well as abutment materials can affect the number of voids. And the use of topical surfactant for rubber base impression materials can improve the wettability of the materials and enhance the accurate master cast which has fewer surface voids.

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X-ray 단층촬영기법을 이용한 스트랜드보드의 내부공극구조에 관한 연구 (Internal Void Structure of Strandboard using X-ray Computed Tomography)

  • 오세창
    • Journal of the Korean Wood Science and Technology
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    • 제36권6호
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    • pp.13-22
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    • 2008
  • 보드의 기계적 성질에 영향을 미치는 공극에 대하여 공극을 두가지로 분류하고 밀도에 따른 오에스비의 내부 공극구조의 특성에 대하여 살펴보고자 하였다. 스트랜드보드의 내부공극을 X-ray 단층촬영기로 측정하고 이미지분석 소프트웨어를 사용하여 밀도에 따른 공극의 분포와 공극의 함유량을 조사하였다. 측정 전에 보드의 밀도를 밀도측정기와 전건법으로 측정하였으며 이 두 방법에 의해 측정된 결과는 아주 높은 상관관계를 보여주었다. X-ray를 서로 다른 배율로 조사하여 획득한 이미지를 바탕으로 분석한 결과, 저해상도에서는 스트랜드간의 공극(macro-void)의 측정이 가능하나 스트랜드내의 미세공극(micro-void)은 이미지획득이 불가능하였다. 중해상도에서는 두가지 형태 모두의 이미지 획득이 가능하였고, 고해상도에서는 대부분의 미세공극 이미지의 획득이 가능하였다. 저배율을 채택하여 스트랜드간의 공극을 측정하고 스트랜드내의 미세공극은 관련식을 이용하여 추정하였다. 이를 통해 보드내부에 존재하는 스트랜드간의 공극분포를 파악할 수 있었으며 그 공극의 함유비율을 정확하게 산정할 수 있었다.

VOIDS LENSING OF THE CMB AT HIGH RESOLUTION

  • SANGKA, ANUT;SAWANGWIT, UTANE;SANGUANSAK, NUANWAN
    • 천문학논총
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    • 제30권2호
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    • pp.397-399
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    • 2015
  • Recently, cosmic voids have been recognized as a powerful cosmological probe. A number of studies have focused on the effects of the gravitational lensing by voids on the temperature (and in some cases polarization) anisotropy of the Cosmic Microwave Background (CMB) background at relatively large to medium scales, l ~ 1000. Many of these studies attempt to explain the unusually large cold spot in CMB temperature maps and dynamical evidence of dark energy via detections of late-time integrated Sachs Wolfe (ISW) effect. Here, the effects of lensing by voids on the CMB temperature anisotropy at small scales, up to l = 3000, will be investigated. This work is carried out in the light of the benefits of adding large catalogues of cosmic voids, to be identified by future large galaxy surveys such as EUCLID and LSST, to the analysis of CMB data such as those from Planck mission. Our numerical simulation utilizes two methods, namely, the small-de ectionangle approximation and full ray-tracing analysis. Using the fitted void density profiles and radius (RV ) distribution available in the literature from N-body simulations, we simulated the secondary temperature anisotropy (lensing) of CMB photons induced by voids along a line of sight from redshift 0 to 2. Each line of sight contains approximately 1000 voids of effective radius $RV_{,eff}=35h^{-1}Mpc$ with randomly distributed radial and projected positions. Both methods are used to generate temperature maps. The two methods will be compared for their accuracy and effciency in the implementation of theoretical modeling.

3 다이폴 안테나 방식 레이더에 의한 콘크리트 터널 라이닝 배면 공동의 형상 추정 (Estimation of Shape of Voids behind Concrete Tunnel Linings Using Radar of Three Dipole Antenna Type)

  • 박석균
    • 콘크리트학회논문집
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    • 제17권2호
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    • pp.221-227
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    • 2005
  • 콘크리트 터널 라이닝의 배면 공동은 구조물의 붕괴로까지 이어질 가능성이 있다. 이와 같은 공동을 비파괴로 조사하기 위한 방법 중의 하나가 레이더법이다. 본 연구는 레이더를 이용해 공동을 정량적이고 효율적으로 검사하기 위한 것이다. 본 목적에 부합되도록 3 다이폴 안테나 방식의 레이더를 이용해 특정된 공동의 방향성과 형상을 추정할 수 있는 해석방법을 제안하였다. 이를 위해 3 다이폴 안테나로부터 얻을 수 있는 전자파의 편파모드방식의 해석방법을 이용해 다양한 방향성과 기하학적형상을 갖는 공동에 대하여 측정 및 해석을 수행하였다. 그 결과, 전자파의 각 편파모드가 공동의 기하학적 특성에 따라 다르게 응답하는 것을 확인하였고, 이를 통해 특정된 공동의 방향성 및 기하학적 형상을 구분하는 것이 가능하였다.

Enhancement of Dye-Sensitized Solar Cell Efficiency by Spherical Voids in Nanocrystalline ZnO Electrodes

  • Hieu, Hoang Nhat;Dao, Van-Duong;Vuong, Nguyen Minh;Kim, Dojin;Choi, Ho-Suk
    • 한국재료학회지
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    • 제24권9호
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    • pp.458-464
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    • 2014
  • Light scattering enhancement is widely used to enhance the optical absorption efficiency of dye-sensitized solar cells. In this work, we systematically analyzed the effects of spherical voids distributed as light-scattering centers in photoanode films made of an assembly of zinc oxide nanoparticles. Spherical voids in electrode films were formed using a sacrificial template of polystyrene (PS) spheres. The diameter and volume concentration of these spheres was varied to optimize the efficiency of dye-sensitized solar cells. The effects of film thickness on this efficiency was also examined. Electrochemical impedance spectroscopy was performed to study electron transport in the electrodes. The highest power conversion efficiency of 4.07 % was observed with $12{\mu}m$ film thickness. This relatively low optimum thickness of the electrode film is due to the enhanced light absorption caused by the light scattering centers of voids distributed in the film.

An investigation into the effects of voids, inclusions and minor cracks on major crack propagation by using XFEM

  • Jiang, Shouyan;Du, Chengbin;Gu, Chongshi
    • Structural Engineering and Mechanics
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    • 제49권5호
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    • pp.597-618
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    • 2014
  • For the structures containing multiple discontinuities (voids, inclusions, and cracks), the simulation technologies in the framework of extended finite element method (XFEM) are discussed in details. The level set method is used for representing the location of inner discontinuous interfaces so that the mesh does not need to align with these discontinuities. Several illustrations have been given to verify that the implemented XFEM program is effective. Then, the implemented XFEM program is used to investigate the effects of the voids, inclusions, and minor cracks on the path of major crack propagation. For a plate containing cracks and voids, two possibly crack path can be observed: i) the crack propagates into the void; ii) the crack initially curves towards the void, then, the crack reorients itself and propagates along its original orientation. For a plate with a soft inclusion, the final predicted crack paths tend to close with the inclusion, and an evident difference of crack paths can be observed with different inclusion material properties. However, for a plate with a hard inclusion, the paths tend to away from the inclusion, and a slightly difference of crack paths can only be seen with different inclusion material properties. For a plate with several minor cracks, the trend of crack paths can still be described as that the crack initially curves towards these minor cracks, and then, the crack reorients itself and propagates almost horizontally along its original orientation.

Active Infrared Thermography for Visualizing Subsurface Micro Voids in an Epoxy Molding Compound

  • Yang, Jinyeol;Hwang, Soonkyu;Choi, Jaemook;Sohn, Hoon
    • 비파괴검사학회지
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    • 제37권2호
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    • pp.106-114
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    • 2017
  • This paper presents an automated subsurface micro void detection technique based on pulsed infrared thermography for inspecting epoxy molding compounds (EMC) used in electronic device packaging. Subsurface micro voids are first detected and visualized by extracting a lock-in amplitude image from raw thermal images. Binary imaging follows to achieve better visualization of subsurface micro voids. A median filter is then applied for removing sparse noise components. The performance of the proposed technique is tested using 36 EMC samples, which have subsurface (below $150{\mu}m{\sim}300{\mu}m$ from the inspection surface) micro voids ($150{\mu}m{\sim}300{\mu}m$ in diameter). The experimental results show that the subsurface micro voids can be successfully detected without causing any damage to the EMC samples, making it suitable for automated online inspection.