• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 추계학술대회 논문집 Vol.16
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• pp.27-30
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• 2003

Recently, on power system, it is used to high voltage of transmission and distribution due to safe power supply and have high quality and insulation in order to satisfy excellent insulator. Thus, according to underground of high voltage cable, is occurred break down by ground short. Therefore, it is used to high quality XLPE power cable to interrupt instantaneous voltage drop. If it appear inner defect for cable whose have high quality and insulation, it is reduced rapidly due to concentration of electrical field. After assemble to manufacture, in order to inspect cable condition, it is decided much inspection standard. In this paper, In inner defect of assembling cable at manufacture, for measure the variation of insulation condition by void. it tested the variation of insulating characteristics, using $\phi$-q-n distribution variation in partial discharge experiment.

• International journal of advanced smart convergence
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• 제4권1호
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• pp.145-153
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• 2015

Friction Stir Welding (FSW) is a solid state welding that could successfully weld the difficult-to-weldmaterials such as an aluminum alloy. In this welding process, the stirrer of the welding tool is one of the important factors for producing the perfect sound joint that indicates the higher joint strength. So, this report aims to apply the friction stir welding using various stirrer geometries to weld the AA6063-T1 aluminum alloy butt joint, investigates the mechanical properties of the joint and then compares the mechanical properties with the microstructure of the joint. An experiment was started by applying the friction stir welding process to weld a 6.3 mm thickness of AA6063-T1 aluminum alloy butt joint. A study of the stirrer geometries effect such as a cylindrical geometry, a cone geometry, a left screw geometry and a right screw geometry at a rotational speed of 2000 rpm and a welding speed of 50-200 mm/min was performed. The mechanical properties such as a tensile strength and a hardness of the joint were also investigated and compared with the microstructure of the joint. The results are as follows. A variation of FSW Stirrer shape directly affected the quality AA6063-T1 aluminum alloy butt joint. A cylindrical stirrer shape and a cone stirrer shape produced the void defect at the bottom part of the weld metal and initiated the failure of the joint when the joint was subjected to the load during the tensile test. Left and right screw stirrer shapes gave the sound joint with no void defect in the weld metal and affected to increase the joint strength that was higher than that of the aluminum base metal.

• 한국전기전자재료학회논문지
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• 제35권6호
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• pp.594-602
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• 2022

Cast-resin transformers are widely installed in various electrical power systems because of their low operating cost and low influence on external environmental factors. However, when they have an internal defect during the manufacturing process or operation, a partial discharge (PD) occurs, and eventually destroys the insulation. In this paper, a Rogowski-type PD sensor was studied to replace commercial PD sensors used for the insulation diagnosis of power apparatus. The proposed PD sensor was manufactured with four different types of PCB-based winding structures, and it was analyzed in terms of the detection characteristics for standard calibration pulses and the changes of the output voltage according to the distance. The output increased linearly in accordance with the applied discharge amount. It was confirmed that the hexagon structure sensor had the highest sensitivity, because the winding cross-sectional area of the sensor was larger than others. In addition, as the distance from the defect increased, the output voltage of the sensors decreased by 7.32% on average. It was also confirmed that the attenuation rate according to the distance decreased as the input discharge amount increased. For the application of this new type sensor, PD electrode system was designed to simulate the void defect. Waveforms and PRPD patterns measured by the proposed PD sensors at DIV and 120% of DIV were the same as the results measured by MPD 600 based on IEC 60270. The proposed PD sensors can be installed on the inner wall of the transformer tank by coating its surfaces with a non-conductive material; therefore, it is possible to detect internal defects more effectively at a closer distance from the defect than the conventional sensors.

• 한국전기전자재료학회논문지
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• 제19권10호
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• pp.947-952
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• 2006

It has been confirmed that the inner defect of insulator and the perfect diagnosis for aging are closely related to safe electric power transmission system and that the detection of accident and diagnosis technique turn out to be very important issues. But perfect diagnosis is difficult because discharge pattern is irregular. Thus, we investigated discharge pattern using the new distribution statistical models with cross-inked polyethylene(XLPE) specimens. Voltage was applied to power frequency by step method, and calibration of discharge was set to 50 pC. After the voltage was applied, it measured the discharge occurring during 10s. We investigated discharge pattern using the K-means analysis and Weibull function. We also investigated variation of centroid and shape parameter due to variation of voltage. As a result of analyzing K-means, it was confirmed that cluster including many object numbers was formed by the presence of void. And result of Weibull distribution, it was confirmed that shape parameter of discharge varied from 1.28 to 1.62 in no void specimens, and that shape parameter of discharge number varied from 1.28 to 1.62. In the void, shape parameter of discharge varied from 5.66 to 6.43, and shape parameter of discharge number varied from 5.05 to 5.08.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2016년도 추계학술대회 논문집
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• pp.128-128
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• 2016

Cu 배선폭 미세화 기술은 반도체 디바이스의 성능 향상을 위한 핵심 기술이다. 현재 배선 기술은 lithography, deposition, planarization등 종합적인 공정 기술의 발전에 따라 10x nm scale까지 감소하였다. 하지만 지속적인 feature size 감소를 위하여 요구되는 높은 공정 기술 및 비용과 배선폭 미세화로 인한 재료의 물리적 한계로 인하여 배선폭 미세화를 통한 성능의 향상에는 한계가 있다. 배선폭 미세화를 통한 2차원적인 집적도 향상과는 별개로 chip들의 3차원 적층을 통하여 반도체 디바이스의 성능 향상이 가능하다. 칩들의 3차원 적층을 위해서는 별도의 3차원 배선 기술이 요구되는데, TSV(through-Si-via)방식은 Si기판을 관통하는 via를 통하여 chip간의 전기신호 교환이 최단거리에서 이루어지는 가장 진보된 형태의 3차원 배선 기술이다. Si 기판에 $50{\mu}m$이상 깊이의 via 및 seed layer를 형성 한 후 습식전해증착법을 이용하여 Cu 배선이 이루어지는데, via 내부 Cu ion 공급 한계로 인하여 일반적인 공정으로는 void와 같은 defect가 형성되어 배선 신뢰성에 문제를 발생시킨다. 이를 해결하기 위해 각종 유기 첨가제가 사용되는데, suppressor를 사용하여 Si 기판 상층부와 via 측면벽의 Cu 증착을 억제하고, accelerator를 사용하여 via 바닥면의 Cu 성장속도를 증가시켜 bottom-up TSV filling을 유도하는 방식이 일반적이다. 이론적으로, Bottom-up TSV filling은 sample 전체에서 Cu 성장을 억제하는 suppressor가 via bottom의 강한 potential로 인하여 국부적 탈착되고 via bottom에서만 Cu가 증착되어 되어 이루어지므로, accelerator가 없이도 void-free TSV filling이 가능하다. Accelerator가 Suppressor를 치환하여 오히려 bottom-up TSV filling을 방해한다는 보고도 있었다. 본 연구에서는 유기 첨가제의 치환으로 인한 TSV filling performance 저하를 방지하고, 유기 첨가제 조성을 단순화하여 용액 관리가 용이하도록 하기 위하여 suppressor만을 이용한 TSV filling 연구를 진행하였다. 먼저, suppressor의 흡착, 탈착 특성을 이해하기 위한 연구가 진행되었고, 이를 바탕으로 suppressor만을 이용한 bottom-up Cu TSV filling이 진행되었다. 최종적으로 $60{\mu}m$ 깊이의 TSV를 1000초 내에 void-free filling하였다.

• 한국컴퓨터산업학회논문지
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• 제4권4호
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• pp.579-588
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• 2003

지중전선로에 있어서 케이블을 연결하는 중간 접속재에 발생하는 전계 집중, 각종 불순물의 침투 및 케이블 절연층의 손상은 궁극적으로 열화 및 절연파괴를 야기하게 되어 케이블의 수명을 단축시키고 있다. 본 연구에서는 경계요소법을 이용하여 초고압 케이블 절연재료로 널리 사용되고 있는 가교폴리에틸렌과 접속재 키트의 절연층으로 사용되고 있는 EPDM의 전계분포를 시뮬레이션 하였다. 시료는 두께 1[mm]로 3장을 중첩한 것으로 모델링하여 컴퓨터 시뮬레이션을 하였다. 전계해석 결과 보이드 내부의 defect는 silicone oil에 의해 전계집중을 약화시킴을 확인하였고, XLPB보다 EPDM의 전계분포가 낮게 유지됨을 확인하였다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1998년도 추계학술대회 논문집 학회본부 C
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• pp.941-943
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• 1998

Exploitation of equipment with cross linked polyethylene (XLPE) insulation requires its condition monitoring and diagnostic. Traditionally diagnostics of insulation is carried out by means of partial discharge detection. Many researchers have developed a lot of methods to identify the defect by the PD form. However, such identification of a defect, for example, void, inclusion or treeing, does not say about its danger from a point of view of full insulation gap breakdown and insulation construction failure. The information about the form and size of formed upon high voltage treeing is necessary for prediction of the remained resource of XLPE insulation. For this purpose we carry out experimental research for determination of the dependencies between PD characteristics in XLPE upon time and three dimension PD patterns of corresponding treeing. The investigations were carried out by means of electrical measurement of PD current and simultaneous optical recording of treeing image. Test results show that the PD patterns can be applied for detecting tree growth well.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제54권5호
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• pp.198-205
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• 2005

Many precedent investigations hate been made for the reliable assessment of the insulation state of large power apparatus for which partial discharge detection is one of tile plausible way. In this work, experimental investigations have been carried out to make the comparison on the PD(partial discharge) pattern analysis related to the five different types of artificial defects such as SFMP (Single Free Moving Particle), MFMP (Multi Free Moving Particle), Void, CFP (Conductor-Fixed Protrusion), EP (Enclosure Protrusion). For each PD pattern, PD detection has been done by tee different types of PD sensors such as HFCT(High Frequency Current Transformer), AE(Acoustic Emission) and UHF(Ultra High Frequency). And, in addition, frequency spectrum by the UHF sensor has been also made for each defect respectively. As a result, it is observed that the possibility of obtaining PD pattern based on PRPD(Phase Resolved Partial Discharge) in connection with the defects tinder investigation is dependant on the type of the sensor while the spectrum analysis is always successful to be achieved for every defect. Therefore, it could be suggested that the nature of PD source can be identified more distinctively when the conventional PRPDA is combined with spectrum analysis.

• 산업기술연구
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• 제35권
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• pp.3-8
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• 2015

A study has been made on defects which are formed in manufacturing processes of engine bearing and also on fatigue crack growth behavior in each step of bearing metal manufacturing. After the first step(sinter brass powder on steel plate ; Series A) many voids are made on brass surface and its size is decreased by the second step(rolling process of sintered plate ; Series B). After the third step(re-sintering step of brass powder and rolling ; Series C) the number of voids is decreased and its type shows line. The time of fatigue crack initiation and the growth rate of fatigue crack are in order of Series A, Series B, Series C. These reasons are that void fosters the crack initiation and growth, and residual stress made by rolling process effects on the crack growth rate in Series B, C. In forming and machining processes by use of final bearing metal, crack was observed at internal corner of flange and peeling off was observed at junction between steel and brass. Owing to the above crack and peeling off, it is considered that there is a possibility of fatigue fracture during the application time.

• 한국표면공학회지
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• 제46권4호
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• pp.153-157
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• 2013

The defect like the void or seam is frequently generated in the PCB (Printed Circuit Board) Via-Filling plating inside via hole. The organic additives including the accelerating agent, inhibitor, leveler, and etc. are needed for the copper Via-Filling plating without this defect for the plating bath. However, the decomposition of the organic additive reduces the lifetime of the plating bath during the plating process, or it becomes the factor reducing the reliability of the Via-Filling. In this paper, the interaction of each organic additives and the decomposition of additive were discussed. As to the accelerating agent, the bis (3-sulfopropyl) disulfide (SPS) and leveler the Janus Green B (JGB) and inhibitor used the polyethlylene glycol 8000 (PEG). The research on the interaction of the organic additives and decomposition implemented in the galvanostat method. The additive decomposition time was confirmed in the plating process from 0 Ah/l (AmpereHour/ liter) to 100 Ah/l with the potential change.