• Journal of the Microelectronics and Packaging Society
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• v.16 no.3
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• pp.39-43
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• 2009

In this paper, the flow characteristics of underfill material driven by capillary action between flip-chip and substrate were investigated. Also, the effects of viscosity level and dispensing point of underfill on flow characteristics were investigated. Flip chip package size was $5mm{\times}5mm{\times}0.65^tmm$, the diameter of solder bump was 100 ${\mu}m$, and the pitch was 150 ${\mu}m$. It was full grid area-array type with 1024 I/Os. The glass substrate was used and the gap between the chip and substrate was 50 ${\mu}m$. For the experimental study, three different underfills with different viscous properties($2000{\sim}3700$ cps), and two different types of dispensing methods(center dot and edge dot) were used. The flow characteristics and filling time of underfill were investigated by using CCD camera. The results show that the edge flow was faster than center flow due to the edge effect, which was caused by the resistance of solder bumps. In case of edge dot dispensing type, the filling time was faster due to the large edge effect, compared to center dot dispensing type. Also, it was found that the underfill flow was faster and the filling time decreased as the viscosity level of underfill was decreased.

• Nuclear Engineering and Technology
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• v.54 no.1
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• pp.162-176
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• 2022

In Lead-based reactor (LBR) severe accident, the meltdown and migration inside the reactor core will lead to fuel fragment concentration, which may further cause re-criticality and even core disintegration. Accurately predicting the migration and solidification behavior of melt in LBR severe accidents is of prime importance for safety analysis of LBR. In this study, the Moving Particle Semi-implicit (MPS) method is validated and used to simulate the migration and solidification behavior. Two main surface tension models are validated and compared. Meanwhile, the MPS method is validated by the L-plate solidification test. Based on the improved MPS method, the migration and solidification behavior of melt in LBR severe accident was studied furthermore. In the Pb-Bi coolant, the melt flows upward due to density difference. The migration and solidification behavior are greatly affected by the surface tension and viscous resistance varying with enthalpy. The whole movement process can be divided into three stages depending on the change in velocity. The heat transfer of core melt is determined jointly by two heat transfer modes: flow heat transfer and solid conductivity. Generally, the research results indicate that the MPS method has unique advantage in studying the migration and solidification behavior in LBR severe accident.

• Korean Chemical Engineering Research
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• v.55 no.3
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• pp.385-394
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• 2017

In this study, reaction mechanism and curing characteristics of adhesives formulated with NaOH- and $H_2SO_4$-hydrolyzed chicken feather (CF) and formaldehyde-based crosslinkers were investigated by FT-IR and DSC. In addition, adhesive properties and formaldehyde emission of medium-density fiberboards (MDF) applied with the adhesives were measured. CF-based adhesives having a solid content of 40% and over were very viscous at $25^{\circ}C$, but the viscosity reduced to $300{\sim}660m{\cdot}Pa{\cdot}s$ at $50^{\circ}C$. Consequently, the adhesives could be used as a sprayable resin. Through the FT-IR spectra of liquid and cured CF-based adhesives, addition reaction of methylol group and condensation reaction between the functional groups with the use of formaldehyde-based crosslinkers were identified. From the analysis of DSC, it was elucidated for CF-based adhesives to require a higher pressing temperature or longer pressing time comparing to commercial urea-formaldehyde (C-UF) resin. MDF bonded with CF-based adhesives, which was formulated with 5% NaOH-hydrolyzed CF (CF-AK-5%) and PF of formaldehyde to phenol mole ratio of 2.5 (PF-2.5), and pressed for 8 min had higher MOR and IB than those with other CF-based adhesives. MOR and IB of MDF bonded with the CF-based adhesives regardless of formulation type and pressing time were higher than those with C-UF resin. When the values compared with the minimum requirements of KS standard, IB exceeded the KS standard in all formulations and pressing time, but MOR of only MDF bonded with CF-AK-5% and PF-2.5 and pressed for 8 min satisfied the KS standard. What was worse, 24-TS of MDF bonded with all CF-based adhesives did not satisfied the KS standard. However, MOR and 24-TS can be improved by increasing the target density of MDF or the amount of wax emulsion, which is added to improve the water resistance of MDF. Importantly, the use of CF-based adhesives decreased greatly the formaldehyde emission. Based on the results, we reached the conclusion that CF-based adhesives formulated under proper conditions had a potential as a sprayable resin for the production of wood panels.