• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.102-102
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• 2018

Electronic industry had required the finer size and the higher performance of the device. Therefore, 3-D die stacking technology such as TSV (through silicon via) and micro-bump had been used. Moreover, by the development of the 3-D die stacking technology, 3-D structure such as chip to chip (c2c) and chip to wafer (c2w) had become practicable. These technologies led to the appearance of HBM (high bandwidth memory). HBM was type of the memory, which is composed of several stacked layers of the memory chips. Each memory chips were connected by TSV and micro-bump. Thus, HBM had lower RC delay and higher performance of data processing than the conventional memory. Moreover, due to the development of the IT industry such as, AI (artificial intelligence), IOT (internet of things), and VR (virtual reality), the lower pitch size and the higher density were required to micro-electronics. Particularly, to obtain the fine pitch, some of the method such as copper pillar, nickel diffusion barrier, and tin-silver or tin-silver-copper based bump had been utillized. TCB (thermal compression bonding) and reflow process (thermal aging) were conventional method to bond between tin-silver or tin-silver-copper caps in the temperature range of 200 to 300 degrees. However, because of tin overflow which caused by higher operating temperature than melting point of Tin ($232^{\circ}C$), there would be the danger of bump bridge failure in fine-pitch bonding. Furthermore, regulating the phase of IMC (intermetallic compound) which was located between nickel diffusion barrier and bump, had a lot of problems. For example, an excess of kirkendall void which provides site of brittle fracture occurs at IMC layer after reflow process. The essential solution to reduce the difficulty of bump bonding process is copper to copper direct bonding below $300^{\circ}C$. In this study, in order to improve the problem of bump bonding process, copper to copper direct bonding was performed below $300^{\circ}C$. The driving force of bonding was the self-annealing properties of electrodeposited Cu with high defect density. The self-annealing property originated in high defect density and non-equilibrium grain boundaries at the triple junction. The electrodeposited Cu at high current density and low bath temperature was fabricated by electroplating on copper deposited silicon wafer. The copper-copper bonding experiments was conducted using thermal pressing machine. The condition of investigation such as thermal parameter and pressure parameter were varied to acquire proper bonded specimens. The bonded interface was characterized by SEM (scanning electron microscope) and OM (optical microscope). The density of grain boundary and defects were examined by TEM (transmission electron microscopy).

• Applied Microscopy
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• v.36 no.1
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• pp.7-16
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• 2006

A new remote access system for a 1.3 MV high voltage electron microscope has been developed. Almost all essential functions for HVEM operation, huck as stage control, specimen tilting, TV camera selection and image recording, are successfully embedded into this prototype of the remote system. Particularly, this system permits perfect and precise operation of the goniometer and also controls the high resolution digital camera via simple Web browsers. Transmission of control signals and communication with the microscope is accomplished via the global ring network for advanced applications development (GLORIAD). This fact makes it possible to realize virtual laboratory to carry out practical national and international HVEM collaboration by using the present system

• Journal of Life Science
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• v.26 no.2
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• pp.253-258
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• 2016

In this study, nano-micelled curcumin was produced with natural sea salt with a view to comparing the in silico molecular binding affinity of pure curcumin compound to the active site of transthyretin. Using an optical light microscope and an electron microscope, it was found that the structure of the surface and the cross-section of nano-micelled curcumin was significantly different from natural sea salt. In particular, the crystal structure and nano-components in the nano-micelled curcumin were united, and the layer was more strongly stabilized than untreated salts. In the virtual 3D structure, in silico molecular docking study, the ligand binding affinity of nano-micelled curcumin to the transthyretin active site was found to be higher than that of pure curcumin. In addition, a nano-micelled curcumin formula interacted with more amino acid residues of transthyretin domains. The pharmacophore feature of the nano-micelled curcumin also showed more condensed and constrained features than normal curcumin. These results suggest that nano-micelled curcumin may effectively bind to and stabilize transthyretin, thereby regulating transthyretin-related physiological diseases. Collectively, the nano-micelled curcumin process suggests that normal curcumin can be modified more efficiently into the novel bio-functional chemical formula to stabilize the transthyretin structure. Therefore, the nano-micelled curcumin process can be applied to the field of the regulation of Alzheimer's disease.

• Journal of the Korea Computer Graphics Society
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• v.24 no.1
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• pp.9-16
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• 2018

In this paper, we introduce a visualization framework for cell image data obtained from optical diffraction tomography (ODT), including a method for representing cell morphology in 3D virtual environment and a color mapping protocol. Unlike commonly known volume data sets, such as CT images of human organ or industrial machinery, that have solid structural information, the cell image data have rather vague information with much morphological variations on the boundaries. Therefore, it is difficult to come up with consistent representation of cell structure for visualization results. To obtain desired visual representation of cellular structures, we propose an interactive visualization technique for the ODT data. In visualization of 3D shape of the cell, we adopt a volume rendering technique which is generally applied to volume data visualization and improve the quality of volume rendering result by using empty space jittering method. Furthermore, we provide a layer-based independent rendering method for multiple transfer functions to represent two or more cellular structures in unified render window. In the experiment, we examined effectiveness of proposed method by visualizing various type of the cell obtained from the microscope which can capture ODT image and fluorescence image together.