• Journal of Satellite, Information and Communications
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• v.1 no.2
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• pp.63-70
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• 2006

This paper presents the results of Ka band qualification model multiplexers for COMS Payload to be launched in 2008. These are the input and output multiplexers of the satellite transponder to use available frequency resources effectively and the diplexer of the satellite antenna to use the same reflector for both transmitting and receiving frequency bands, respectively. The input multiplexer with four frequency channels has four(4) independent channel filters which consist of an 8-pole elliptic band-pass filter for high frequency selectivity and a 2-pole equalizer for group delay equalization. For low insertion loss, mass and volume reduction, manifold type os employed for output multiplexer. E-plane T-junction is used for either splitting or combining a frequency band into two sub-bands. Asymmetric inductive irises are used to tune the receiving filter easily. The electrical performance and environmental test such as vibration test, mechanical shock test, thermal vacuum test and EMC test are performed and the results of all qualification model multiplexers are compliant to the requirement of each multiplexer. Followed by this qualification, the flight model equipment will be developed.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.6
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• pp.72-78
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• 1998

An optical modulator Ti:LiNbO$_3$optical waveguide and CPW electrode structure were fabricated. The optical modulator was packaged using components such as ferrules, dirmy LN block and glass, vibration and shock absorbption pad, and alumina feeder through processings of pigtailing. Au wire bonding, epoxing, SMA connecting, sealing. The electrical and optical characteristics were measured after packaging. The electrical properties of S$_{21}$ and S$_{11}$ were obtained as 9.8 GHz at -3 dB and -8.9dB at 14.4GHz, respectively. Optical waveguide prepared met requirements for a single mode at a 1550nm wavelength range. Insertion loss was 4.3dB at room temperature after packaging, and was varied 4.3~6.4dB at various temperatures, 5~45$^{\circ}C$. E-O bandwidth measurement showed 3dB optical response at 7.8GHz, which means that it is applicable for 10Gbps optical communicationon

• Transactions of the KSME C: Technology and Education
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• v.3 no.3
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• pp.175-181
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• 2015

Because internal space of combat vehicle reachs about $80^{\circ}C$ at high temperature period, Proximity Sensor exposed high temperature and humidity, which has function to sense the distance and transfer signal for control unit, have enlarged sensing distance and finally locked on. Malfunction of sensing itself occur frequently, therefore we carried out cause analysis and improvement. We accomplish improvement activity secondly. Through-out many trial and error, we find out that malfunction of sensor occur at high temperature circumstance. To improve, the another Emitter Coil is added to increase voltage difference and improve sensing accuracy about 5~10 times. And we accomplish design improvement to dull temperature and humity change after increasing molding surface to add vibration and shock resistance. We prove that the improved product do not fail after enduring 136hr at $85^{\circ}C$ temperature and 85% relative humidity circumstance chamber.

• Steel and Composite Structures
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• v.3 no.5
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• pp.321-331
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• 2003

The paper presents the results of an experimental investigation conducted on welded tubular joints, that are employed in offshore platforms, to study the behaviour and strength of these joints under axial brace compression loading. The geometrical configuration of the joints tested were T and Y. The nominal diameter of the chord and brace members of the joint were 324 and 219 mm respectively. The chord thickness was 12 mm and the brace 8 mm. The tested joints are approximately quarter size when compared to the largest joints in the platforms built in a shallow water depth of 80 m in the Bombay High field. Some of the joints were actually fabricated by a leading offshore agency which firm is directly involved in the fabrication of prototype structures. Strength of the internally ring-stiffened joints was found to be almost twice that of the unstiffened joints of the same configuration and dimensions. Bending of the chord as a whole was observed to be the predominant mode of deformation of the internally ring-stiffened joints in contrast to ovaling and punching shear of the unstiffened joints. It was observed in this investigation that unstiffened joint was stiffer in ovaling mode than in bending and that midspan deflection of unstiffened joint was insignificant when compared to that of the internally ring stiffened joint. The measured midspan deflection of the unstiffened joint in this investigation and its relation with the applied axial load compares very well with that predicted for the brace axial displacement by energy method published in the literature. A comparison of the measured deflection and ovaling of the unstiffened joint was made with that published by the author elsewhere in which numerical prediction of both quantities have been made using ANSYS software package. The agreement was found to be quite good.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.1 s.38
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• pp.63-72
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• 2006

Mobile products, such as cellular phones, PDA and notebook, are subjected to many different mechanical loads, which include bending, twisting, impact shock and vibration. In this study, a cyclic bending test of the BGA package was performed to evaluate the fatigue life. Special bending tester, which was suitable for electronic package, was developed using an electromagnetic actuator. A nonlinear finite element model was used to simulate the mechanical bending deformation of solder joint in BGA packages. The fatigue life of lead-free (95.5Sn4.0Ag0.5Cu) solder joints was compared with that of lead-contained (63Sn37Pb). When the applied load to the specimen is small, the lead-free solder has longer fatigue life than lead-contained solder. The fatigue crack is initialized at the exterior solder joints and is propagated into the inner solder joints.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.38 no.8
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• pp.767-773
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• 2010

This paper describes development of a non-explosive separation device which can be equipped on small satellites. The spur geared micro DC motor, which has high reliability and advantage of price, is adopted as an actuator. The proposed separation device has resettability and it does not need extra jig to reload. In addition, the simple structure makes it easy to fabricate and assemble. To verify the performance of the proposed device, the response time tests, maximum preload tests and maximum shock level tests were performed. Also, through the vibration tests and thermal vacuum tests, feasibility of the proposed separation device was shown in launching and space environments. Therefore, we expect that the proposed separation device can replace the imported separation devices in near future.

• Journal of the Korean Society of Fisheries and Ocean Technology
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• v.46 no.4
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• pp.503-508
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• 2010

Common LED (Light Emitting Diode) lamp has many advantages to compare with fluorescent lamp, long life and no pollution matter like the mercury. The LED lamp is a good light source especially for shipboard lighting because of its compact structure which prevents explosion and shock. Also, low maintenance cost is expected due to its longer life time in comparison with conventional lamps. The LED lamp, however, need some estimates that change of voltage and frequency, vibration, moisture on board to definite accommodation of the LED lamp to shipboard. The purpose of this study is to compare physical properties of a fluorescent lamp with one of the common LED lamp so as to analyze accommodation of common LED lamp on board. This study was carried out in two stages. First, temperature, humidity of illumination, voltage, electric current, frequency and electric power were measured by using experimental equipments. Second, a comparative analysis of consumption electric power, annual oil charge, annual CO2 emission and lamp life time, etc of the fluorescent lamp and common LED one was made. As a result of the study, the consumption electric power of fluorescent lamp was 50% higher than one of the common LED lamp. As a result of measuring life time, it was found that life time of common LED lamp was more about 3.5 fold than one of the fluorescent lamp. Considering these results, it's thought that common LED lamp is verified that energy saving is possible and using is possible as substitute for fluorescent lamp on board.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.33 no.7
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• pp.33-39
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• 2005

A mathematical model, GUNBLAST, of blast waves emitted from a gun muzzle is established, and structural response analyses for the blast load are performed. The blast wave can be divided into two kinds of waves, free field and reflected blast waves. In this research, the free field blast wave model is established by the use of a scaling approach, and the reflected blast wave is calculated by using the oblique shock theory and computational fluid dynamic calculation. GUNBLAST is applied to two kinds of structural models. To investigate the effect of the muzzle distance from a structural surface, the blast waves on a plate for various muzzle distances are compared to uniform loads. Moreover, the transient response analysis of an aircraft wing model with a 12.7mm gun is carried out by using MSC/NASTRAN. From the results, it can be shown that the blast wave can cause broad random vibration and high frequency damage to equipments mounted in the aircraft.

• Journal of the Korean institute of surface engineering
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• v.42 no.3
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• pp.109-115
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• 2009

Magnesium is one of the lightest metals, and magnesium alloys have excellent physical and mechanical properties such as high stiffness/weight ratios, good castability, good vibration and shock absorption. However their poor corrosion resistance, wear resistance, hardness and so on, have limited their application. To improve these defects, many techniques are developed. Micro arc oxidation(MAO) is a one of the surface treatments under anodic oxidation in which ceramic coating is directly formed on the surface of magnesium alloy. In this study, the characteristics of anodic film were examined after coating the AZ31B magnesium alloy through the MAO process. MAO was carried out in potassium hydroxide, potassium fluoride, and various concentration of sodium silicate in electrolyte. The morphology and chemical composition of the coating layer were characterized by SEM, XRD, EPMA and EDS. The hardness of anodic films was measured by micro-vickers hardness tester. As a result, the morphology and composition of anodic film were changed by concentration of sodium silicate. Thickness and Si composition of anodic film was increased with increasing concentration of sodium silicate in electrolyte. The hardness of anodic film was highly increased when the concentration of sodium silicate was above 40 g/l in electrolyte.

• Journal of the Korea Institute of Building Construction
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• v.2 no.3
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• pp.163-170
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• 2002

Recently, polishing tile(porcelain homogeneous polished tile) was used in the construction field as a finishing material. But, there happened some problems such as tile exfoliation by construction condition in early ages. Also, for use of polishing tile in the dry wall system which used to lightweight wall, the examination of adhesive stability of polishing tile is needed. In this study, adhesive strength of Polishing tile was investigated by tile bond types on gypsum board and non asbestos board coated by tar-urethane and Polymer modified cementitious waterproofing membrane(Series I). Then, the effect of heat stress and vibration was estimated on gypsum and non asbestos board(Series II). As the result of study are the follows; (1) Polishing tile(600$\times$400mm) construction on waterproofing layer : Both laboratory estimation and spot examination sieve were happened that fall of tile because their hardening speed is late. (2) To using powder style adhesives in the dry wail with waterproofing layer : Adhesive strength of tile is Influenced by interface bond area and base side condition. (3) Shock and heat stresses : obvious decline of adhesive strength is not happened