• Title/Summary/Keyword: Vertical Integration

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A Study on the Determinants of Global Sourcing Strategies in Korean Apparel Industry (한국의류산업의 범세계적 조달전략 결정요인에 관한 연구)

  • 김용주
    • Journal of the Korean Society of Clothing and Textiles
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    • v.23 no.1
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    • pp.42-53
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    • 1999
  • Global sourcing strategy is the one that apparel firms adopt in order to improve efficiency. Souring statesgies are not limited to the decision of sourcing country or vertical integration of sewing process Sourcing strategies include all the ecision of marketing process from the acquisition of fabric to distribution of products. The present study aims to analyze the soucing strategies of Korea apparel industry in global perspectives by applying transaction cost approach and aims to provide the implications for the future. The results are as follows ; (1) sourcing strategies in the dimension of domestic versus offshore soucing are determined by the experience in foreign business and the degree of fashionability of the product. (2) Firms tend to increase affshore soucing as they accumulate the experience in foreign business because they can decrease transaction costs as the perceived risks decrease (3) Also firms tend to source their products in foreign countries when the products are more fashionable. Brand loyalty of the product is a additional factor that increases the proportion of domestic sourcing. (4) Degree of vertical integration of sourcing is determined by the fashionability brand loyalty and the experience in foreign business. That is firms decrease the transaction costs by avoiding the investment to short life fashion products. However firms increase the control over the high reputation product by in house production. As the apparel firms tend to more marketing oriented and the national boundaries of business envrionment becomes permeable more efficient global sourcing strategies should be stablished, Besides the production costs nonproduction costs should be equallly considered in order to analyze the total costs.

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Performance Analysis of Long Baseline Relative Positioning using Dual-frequency GPS/BDS Measurements

  • Choi, Byung-Kyu;Yoon, Ha Su;Lee, Sang Jeong
    • Journal of Positioning, Navigation, and Timing
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    • v.8 no.2
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    • pp.87-94
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    • 2019
  • The Global Navigation Satellite System (GNSS) Real-Time Kinematic (RTK) positioning has been widely used in geodesy, surveying, and navigation fields. RTK can benefit enormously from the integration of multi-GNSS. In this study, we develop a GPS/BeiDou Navigation Satellite System (BDS) RTK integration algorithm for long baselines ranging from 128 km to 335 km in South Korea. The positioning performance with GPS/BDS RTK, GPS-only RTK, and BDS-only RTK is compared in terms of the positioning accuracy. An improvement of positioning accuracy over long baselines can be found with GPS/BDS RTK compared with that of GPS-only RTK and that of BDS-only RTK. The positioning accuracy of GPS/BDS RTK is better than 2 cm in the horizontal direction and better than 5 cm in the vertical direction. A lower Relative Dilution of Precision (RDOP) value with GPS/BDS integration can obtain a better positional precision for long baseline RTK positioning.

The Measurement of Nano-grating by Scanning Probe Microscopy Using Digital PID Control (Digital PID Control을 적용한 Scanning Probe Microscopy의 Nano-grating 측정)

  • Park, Gyeong-Deok;Ji, Won-Su;Kim, Dae-Chan;Jang, Dong-Hun;O, Beom-Hwan;Park, Se-Geun;Lee, Il-Hang;Lee, Seung-Geol
    • Proceedings of the Optical Society of Korea Conference
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    • 2008.07a
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    • pp.185-186
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    • 2008
  • In this paper, the nano-grating was measured by Scanning Probe Microscopy (SPM) system using digital Proportion, Integration and Derivative (PID) control. Through this measurement, we could confirm the improvement of the vertical resolution compared with analog Proportion and Integration (PI) control method.

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MQW electroabsorption modulator integrated with a tapered waveguide vertical interconnect

  • Han, Sang-Kook
    • Journal of the Optical Society of Korea
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    • v.1 no.1
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    • pp.44-47
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    • 1997
  • The integration of a GaAs/AlGaAs multi-quantum well electroabsorption modulator and a tapered waveguide vertical direction optical interconnect has been performed without the complicated regrowth process. Zn impurity-induced layer disordering of MQW layer is used to achieve the energy transfer between SQW and MQW regions. Light coupled into a SQW region was transferred to an MQW region and an intensity modulation of 10 dB extinction ratio was demonstrated.

An Experiment of Traceability-Driven System Testing

  • Choi, Eun-Man;Seo, Kwang-Ik
    • Journal of Information Processing Systems
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    • v.4 no.1
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    • pp.33-40
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    • 2008
  • Traceability has been held as an important factor in testing activities as well as model-driven development. Vertical traceability affords us opportunities to improve manageability from models and test cases to a code in testing and debugging phase. This paper represents a vertical test method which connects a system test level and an integration test level in testing stage by using UML. An experiment how traceability works to effectively focus on error spots has been included by using concrete examples of tracing from models to the code.

Wafer-Level Three-Dimensional Monolithic Integration for Intelligent Wireless Terminals

  • Gutmann, R.J.;Zeng, A.Y.;Devarajan, S.;Lu, J.Q.;Rose, K.
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.4 no.3
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    • pp.196-203
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    • 2004
  • A three-dimensional (3D) IC technology platform is presented for high-performance, low-cost heterogeneous integration of silicon ICs. The platform uses dielectric adhesive bonding of fully-processed wafer-to-wafer aligned ICs, followed by a three-step thinning process and copper damascene patterning to form inter-wafer interconnects. Daisy-chain inter-wafer via test structures and compatibility of the process steps with 130 nm CMOS sal devices and circuits indicate the viability of the process flow. Such 3D integration with through-die vias enables high functionality in intelligent wireless terminals, as vertical integration of processor, large memory, image sensors and RF/microwave transceivers can be achieved with silicon-based ICs (Si CMOS and/or SiGe BiCMOS). Two examples of such capability are highlighted: memory-intensive Si CMOS digital processors with large L2 caches and SiGe BiCMOS pipelined A/D converters. A comparison of wafer-level 3D integration 'lith system-on-a-chip (SoC) and system-in-a-package (SiP) implementations is presented.

A Study on the Vertical, Horizontal and Torsional Vibration of Ship(1st Report) (배의 상하(上下), 수평(水平) 및 비틂진동(振動)에 관(關)하여(제1보)(第1報) -Box형(型) Barge의 상하진동(上下振動)에 대(對)하여-)

  • Sa-Soo,Kim
    • Bulletin of the Society of Naval Architects of Korea
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    • v.8 no.2
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    • pp.1-12
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    • 1971
  • This paper describes, firstly, on analytical method of computing the eigenvalues of vertical vibration of ships, taking into account for the distribution of hull weight including added mass and the effect of shear deflection and rotary inertia. The frequency equation is solved by Galerkins method into form of numerical integration. Applying the above described equation, model experiment of vertical vibration was carried out in order to varify the validity of the analytical method of vertical vibration. The model, which was made of acrylite plate, was ship-shaped wall-sided vessel with bulkheads, deck openings, and fore and after peak tank at both ends. The results of experiments carried out both in air and on water showed that the observed natural frequencies and the observed patterns of natural modes of vibration were in good agreement with analytically calculated values for 2,3, and 4-node vibration.

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A Low Voltage Driven Electrostatic Micro Actuator with an Added Vertical Electrode for Optical Switching (추가된 수직전글을 구비한 저전압 구동의 광 스위칭용 정전구동 마이크로 액츄에이터)

  • Yoon, Yong-Seop;Bae, Ki-Deok;Choi, Hyung;Koh, Byung-Cheon
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.52 no.1
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    • pp.55-59
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    • 2003
  • With the progress of optical communication technology recently, the development of micro actuator using MEMS technology has been made for optical switching. The actuation types are various; electrostatic, electromagnetic, and electrostatic +electromagnetic etc. Among them, the electrostatic type is the most popular because of the relative ease of fabrication, integration and shielding as well as low power consumption. However, it needs a high voltage to generate a larger driving force. To overcome this problem, we proposed a new type of electrostatic actuator with an extra vertical electrode in addition to the horizontal one. The vertical electrode also lays a role of making the stable angular rotation as a stopper. From the theoretical analysis and experiment, we find the actuation voltage can be reduced up to 50 % of that of the conventional one.

A Study on the Relationship between Vertical Separation and Operational Efficiency of Railway Industry (철도산업의 수직분리와 운영효율성의 관련성에 관한 연구)

  • Kim, Seong-Ho;Choi, Tae-Sung
    • Journal of the Korean Society for Railway
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    • v.12 no.6
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    • pp.844-851
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    • 2009
  • Since 1990s, the European railway sector has undergone both a vertical separation and a vertical integration. Recently Simar and Wilson (2008) provides a bootstrap test procedure for testing whether two groups' mean efficiencies are equivalent. The purpose of this paper is to ascertain the relationship between vertical separation and operational efficiency of railway industry using the Simar and Wilson's bootstrap test procedure not used in previous studies with a data set of 20 European countries from 1998 to 2005. From the value of test statistic it seems that the mean operational efficiencies of vertically separated railway industry were higher than those of vertically integrated railway industry. However the p-value indicates that the differences of mean operational efficiencies are not significat at any meaningful level.