• Title/Summary/Keyword: Vacuum packaged process.

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Front Aluminum Subframe of High Level Vacuum Die-casting (고진공 다이캐스팅 공법 적용한 알루미늄 서브프레임 개발)

  • Cho, Young-Gun;Lim, Tae-Seong;Jang, Sang-Gil;Cho, Cheol-Hwan
    • Transactions of the Korean Society of Automotive Engineers
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    • v.20 no.4
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    • pp.52-59
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    • 2012
  • The subframe has been generally manufactured by using stamped steel material. Recently, automotive designers are considering aluminum as lightweight material. This paper describes the development process of an aluminum subframe which is made by high level vacuum die casting process, which is beneficial for minimizing gas contents and material properties. The weight of manufactured subframe is reduced by 4kg with the comparison of steel subframe. The aluminum subframe is packaged for the current vehicle layout and the imposed requirement is to attain a better structural performance that is evaluated in terms of mounting stiffness, noise and vibration, and endurance performance. The NVH evaluation results show that sound level is decreased by 8dB with the help of high roll-rod mounting stiffness as well as high structural modes.

Developed Vacuum Film Packaging Method Maintains Quality of Enoki Mushrooms (Flammulina velutipes) during Simulated Vessel Export to Vietnam (팽이버섯의 베트남 모의수출 중 진공포장방법 개선을 통한 품질 유지 효과)

  • Choi, Ji Weon;Lim, Sooyeon;Lee, Ji Hyun;Eum, Hyang Lan;Lee, Jung-Soo;Park, Hye Sung;Im, Ji-Hoon;Do, Kyung Ran
    • KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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    • v.28 no.2
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    • pp.133-142
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    • 2022
  • Korean enoki mushrooms are exported to Southeast Asia and the United States, where there are complaints due to quality deterioration during the distribution process. In this study, we evaluated the efficacy of vacuum film packaging on quality maintenance in Korean enoki mushrooms during simulated vessel export to Vietnam using selected film, which was developed with vacuum packaging machine and oxygen absorber. We selected two MA film, one was 2-layerd 30 ㎛ CPP film (control) and the other was 3-layered 30 ㎛ CPP film (treatment) which is optimized film of higher gas and moisture permeability. The Korean enoki mushrooms were packaged with these two films using PAC-2000 or PAC-3000 vacuum packaging machine which was improved vacuuming of higher speed. Packed mushrooms were stored at 1℃ for 2 weeks and distributed at 20℃ for 2 days or 8℃ for 6 days. The efficiency of the film packaging was analyzed by vacuum maintaining index, and overall the quality characteristics such as off odor, color, cap cleavage, stem elongations and sensory evaluation were evaluated during storage and distribution. Results suggest that postharvest loss of fresh enoki mushroom could be reduced by packaging mushroom with 3-layered 30 ㎛ CPP films packaged using PAC-3000 machine during simulated vessel export to Vietnam due to vacuum maintaining. Oxygen absorber promoted off-odor at 20℃ distribution temperature, and did not affect storability at 1℃ storage compared to treated group without oxygen absorber treatment.

Reliability Assessment of MEMS Gyroscope Sensor (MEMS 자이로스코프 센서의 신뢰성 문제)

  • Choi, Min-Seog;Choa, Sung-Hoon;Kim, Jong-Seok;Jeong, Hee-Moon;Song, In-Seob;Cho, Yong-Chul
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.28 no.9
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    • pp.1297-1305
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    • 2004
  • Reliability of MEMS devices is receiving more attention as they are heading towards commercial production. In particular are the reliability and long-term stability of wafer level vacuum packaged MEMS gyroscope sensors subjected to cyclic mechanical stresses at high frequencies. In this study, we carried out several reliability tests such as environmental storage, fatigue, shock, and vibration, and we investigated the failure mechanisms of the anodically bonded vacuum gyroscope sensors. It was found that successful vacuum packaging could be achieved through reducing outgassing inside the cavity by deposition of titanium as well as by pre-taking process. The current gyroscope structure is found to be safe from fatigue failure for 1000 hours of operation test. The gyroscope sensor survives the drop and vibration tests without any damage, indicating robustness of the sensor. The reliability test results presented in this study demonstrate that MEMS gyroscope sensor is very close to commercialization.

Vacuum Packaging Technology of AC-PDP using Direct-Joint Method

  • Lee, Duck-Jung;Lee, Yun-Hi;Moon, Gwon-Jin;Kim, Jun-Dong;Choi, Won-Do;Lee, Sang-Geun;Jang, Jin;Ju, Byeong-Kwon
    • Journal of Information Display
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    • v.2 no.4
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    • pp.34-38
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    • 2001
  • We suggested new PDP packaging technology using the direct joint method, which does not need an exhausting hole and tube. The advantages of this method are simple process, short process time and time panel package. To packaging, we drew the seal line of glass frit by dispenser followed by forming the lump, which provide pumping-out path during the packaging process. And, we have performed a pretreatment of glass frit to reduce the out-gases. After which, both front and rear glass plates were aligned and loaded into vacuum packaging chamber. The 4-inch monochrome AC-PDP was successfully packaged and fully emitted with brightness of 1000 $cd/m^2$. Also, glass frit properties for pretreatment condition was investigated by AES and SEM analyses.

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Quality Changes of Minimally Processed Sliced Deodeok (Codonopsis lanceolata) during Storage by Packaging Method (포장방법 차이에 따른 신선편이 슬라이스 더덕의 저장 중 품질 변화)

  • Choi, Duck-Joo;Lee, Yun-Jung;Kim, Youn-Kyeong;Kim, Mun-Ho;Choi, So-Rye;Park, In-Seon;Cha, Hwan-Soo;Youn, Aye-Ree
    • Food Science and Preservation
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    • v.19 no.5
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    • pp.626-632
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    • 2012
  • In this study, the changes that occurred in the quality of minimally processed sliced Deodeok (Codonopsis lanceolata) in relation to the packing method during storage at $7^{\circ}C$ were investigated. The storage tests were conducted for seven days using PE sealing, but PP sealing and vacuum packaging preserved the Deodeok for 14 days. On the seventh day, the vinyl-packaged Deodeok showed a remarkable fall in quality with 4.5 °Brix, but the PP-sealed and vacuum-packaged Deodeok showed slight falls with 6.4 and $6.8^{\circ}Brix$, respectively. The PE- and PP-sealed Deodeok did not show significant differences in texture and moisture content for two days, and the moisture content was highest in the vacuum-packaged Deodeok during storage. In relation to the total viable cell and the coliform count, the vacuum-packaged Deodeok showed the lowest rate of increment during storage, followed by the others. Thus, the bubble-washed and vacuum-packaged minimally processed sliced Deodeok was found to have the best quality.

Resonant Loop Design and Performance Test for a Torsional MEMS Accelerometer with Differential Pickoff

  • Sung, Sang-Kyung;Hyun, Chul;Lee, Jang-Gyu
    • International Journal of Control, Automation, and Systems
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    • v.5 no.1
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    • pp.35-42
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    • 2007
  • This paper presents an INS(Inertial Navigation System) grade, surface micro-machined differential resonant accelerometer(DRXL) manufactured by an epitaxially grown thick poly silicon process. The proposed DRXL system generates a differential digital output upon an applied acceleration, in which frequency transition is measured due to gap dependent electrical stiffness change. To facilitate the resonance dynamics of the electromechanical system, the micromachined DRXL device is packaged by using the wafer level vacuum sealing process. To test the DRXL performance, a nonlinear self-oscillation loop is designed based on the extended describing function technique. The oscillation loop is implemented using discrete electronic elements including precision charge amplifier and hard feedback nonlinearity. The performance test of the DRXL system shows that the sensitivity of the accelerometer is 24 Hz/g and its long term bias stability is about 2 mg($1{\sigma}$) with dynamic range of ${\sigma}70g$.

Sensory Characteristics and Rheological Change of Kongdduk (soybean rice cake) depending on Cooking, and Packaging Method (콩떡의 제조 및 저장과 포장에 따른 물성 변화와 관능적 특성)

  • 정혜숙
    • Korean Journal of Human Ecology
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    • v.5 no.2
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    • pp.55-74
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    • 2002
  • This study, observing each respectively packaged Kongdduk during 12-day storing period and comparing it with unpackaged Kongdduk, through a cross-sectional view of its fiber and temperament, through a sensory evaluation rheometer measurement of rheological change depending on storing period and packaging type and through the organic acid content, micro-organic change, and retrogressive process. The results are as follows: 1. Kongdduk made of bean oil shows better chewiness, cohesiveness, and moistness than Kongdduk made of bean flour while Kongdduk made of bean flour shows better rheological properties as to roasted nutty taste or roasted nutty order. 2. The test of the cutted loaves of Kongdduk shows that adding oil of proper proportion to the dough of steamed rice cake in accordance with the amount of rice flour has a good influence on rheological properties of softness. 3. Rice cakes were prepared by addition of yellow soybean flour or peanut flour and packaged with CMP or VP, and their physical characteristics were monitored by sensory evaluation and mechanical measurement while storing for 6 days. For VP samples, yellow soybean rice cake showed little changes in cohesiveness, moistness and chewiness for 6 days of storage, while pure rice cake and peanut rice cake showed an increase in strength and hardness from the 4th day of storage. In case of CMP, yellow soybean rice cake hardly showed a difference in cohesiveness, moistness and chewiness for 6 days, while pure rice cake and peanut rice cake showed a significant difference from the 4th day in sensory evaluation. 4. For rheometer measurement, yellow soybean rice cake with CMP or VP showed little changes in strength or hardness for 6 days, while peanut rice cake and pure rice cake showed a drastic decrease in cohesiveness, from the End day and adhesiveness from the 4th day of storage. As there was no remarkable difference or deterioration for 6 days of storage in yellow soybean rice cake between CMP and VP, the ingredients of rice cakeappeared to be more important than the type of packaging in terms of quality deterioration of rice cake. 5. As the storing period passed by, organic acid is detected less at CMP-packaged Knngdduk than at wrapped. and its increasing speed proves to be slower as well. 6. The one wrapped with plyethylene film began to get moldy from pure rice cake or Kongdduk (rice cake mixed with yellow soybean or peanut) after 6 days, and more and more modly after 9 daysor after 12 days, but the CMP-packaged ones didn't get modly until 12 days or more. 7. CMP-packaged Kongdduk showed higher enthalpy of retrogradation than PE-wrapped one. As storing Period Passed by, Kongdduk,s enthalpy grew high. That is to say, it shows that Kongdduk got retrograded.

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Wafer Level Vacuum Packaged Out-of-Plane and In-Plane Differential Resonant Silicon Accelerometers for Navigational Applications

  • Kim, Illh-Wan;Seok, Seon-Ho;Kim, Hyeon-Cheol;Kang, Moon-Koo;Chun, Kuk-Jin
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.5 no.1
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    • pp.58-66
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    • 2005
  • Inertial-grade vertical-type and lateral-type differential resonant accelerometers (DRXLs) are designed, fabricated using one process and tested for navigational applications. The accelerometers consist of an out-of-plane (for z-axis) accelerometer and in-plane (for x, y-axes) accelerometers. The sensing principle of the accelerometer is based on gap-sensitive electrostatic stiffness changing effect. It says that the natural frequency of the accelerometer can be changed according to an electrostatic force on the proof mass of the accelerometer. The out-of-plane resonant accelerometer shows bias stability of $2.5{\mu}g$, sensitivity of 70 Hz/g and bandwidth of 100 Hz at resonant frequency of 12 kHz. The in-plane resonant accelerometer shows bias stability of $5.2{\mu}g$, sensitivity of 128 Hz/g and bandwidth of 110 Hz at resonant frequency of 23.4 kHz. The measured performances of two accelerometers are suitable for an application of inertial navigation.

Study of New Light Source with Nano Carbon Material (나노카본을 이용한 조명용 신광원에 관한 연구)

  • Kim, Kwang-Bok;Kim, Yong-Won;Jung, Han-Gi;Song, Yoon-Ho
    • Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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    • 2006.05a
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    • pp.31-34
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    • 2006
  • The characteristic of carbon nano fiber (CNF) as electron emitters was described. Carbon nano fiber (CNF) of herringbone was prepared by thermal chemical vapor deposition(CVD), mixed with binders and conductive materials, and then were formed by screen-printing process. In order to increase effectively field emissions, the surface treatment of rubbing & peel-off was applied to the printed CNF emitters on cathode electrode. The measurements of field emission properties were carried out by using a diode structure inline vacuum chamber. CNF of herringbone type showed good emission properties that a turn on field was as low as $2.5V/{\mu}m$ and current density was as large as $0.15mA/cm^2$ of $4.5V/{\mu}m$ with electric field. After the vacuum packaged panel of 5-inch in diagonal, the measured white brightness was as high as $7000cd/m^2$ at 1900V of anode and 700V of gate voltage.

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Influence of Ambient Gases on Field Emission Performance in the Frit-sealing Process of Mo-tip Field Emission Display (몰리브덴 팁 전계 방출 표시 소자의 프릿 실링에 있어서 분위기 기체가 전계 방출 성능에 미치는 영향)

  • Ju, Byeong-Kwon;Kim, Hoon;Jung, Jae-Hoon;Kim, Bong-Chul;Jung, Sung-Jae;Lee, Nam-Yang;Lee, Yun-HI;Oh, Myung-Hwan
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.48 no.7
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    • pp.525-529
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    • 1999
  • The influence of ambient gases on field emission performance of Mo-field emitter array(FEA) in the frit-sealing step of field emission display(FED) packaging process was investigated. Mo-tip FEA was mounted on the glass substrate having a surrounded frit(Ferro FX11-137) and fired at $415^{\circ}C$ in the ambient gases of air, $N_2$ and Ar. The Ar gas was proved to be most proper ambient among the used gases through evaluating the turn-on voltage and field emission current of the fired Mo-tip FEA devices. It was confirmed that the Mo surface fired in Ar ambient was less oxidized when compared with another ones annealed in air and Ar ambient by the AFM, XPS, AES and SIMS analysis. Finally, the 3.5 inch-sized Mo-tip FED, which was packaged using frit-sealing process in the Ar ambient, was proposed.

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