• Proceedings of the KSME Conference
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• 2003.04a
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• pp.7-12
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• 2003

When the wind turbine is used in cold regions, the mechanical properties and dimension stability of the blade will be changed. The proposal of this paper is to test the durability of the blade for wind turbine. It is necessary to select the most comfortable materials and fabrication processes for more stable wind turbine blade in cold regions. To select the most comfortable materials and processes, the static strength has to know through the tensile static tests at the severe condition as cold regions. First, the tensile static specimens made by RIM (Resin injection molding) process & vacuum bagging process with reinforcement materials and resin. Tensile static tests were carried out on three laminate lay-ups (carbon prepreg, carbon fiber dry fabric and glass fiber dry fabric) at different test temperature($24^{\circ}$, $-30^{\circ}$), determining properties such as the mechanical strength, stiffness and strain to failure. At different test temperature, in order to test the tensile strengths of these specimens used the low temperature chamber. Next, the results of this test were compared with each other. Finally, the most comfortable materials and fabrication processes can select based on these results. The results show the changes in the static behavior of three laminate lay-ups at different test temperatures. At low temperatures, the static strengths are higher than the ones at room temperature.

• Journal of the Korean Vacuum Society
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• v.6 no.3
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• pp.282-286
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• 1997

Reactive ion etching (RIE) characteristics of InP in the $Cl_2$/ CH_4/H_2$ discharges was investigated, as a function of the rf power, substrate temperature and gas composition. It was observed that the etch rate increased as the rf power, sample temperature and/or $Cl_2$ gas concentration increased. Etch rate of about 0.9$\mu\textrm{m}$/min was obtained at the optimum condition of 150W rf power, $180^{\circ}C$ substrate temperature and $10Cl_2$ /$5CH_4/85H_2$ gas ratio. Polymer formation was completely suppressed by adding $Cl_2$ to the $CH_4$ /$H_2$ discharges.

• Proceedings of the KIEE Conference
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• 2005.11a
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• pp.139-141
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• 2005

It is possble to study charge transfer property which is caused by height variation because we can see the organic materials barrier height and STM tip by organic materials energy band gap. Here, we investigated the negative differential resistance(NDR) and charge transfer property of self-assembled 4,4-Di(ethynylphenyl)-2'-nitro-1-(thioacetyl)benzene, which has been well known as a conducting molecule. Self-assembly monolayers(SAMs) were prepared on Au(111), which had been thermally deposited onto pre-treatment($H_{2}SO_{4}:H_{2}O_{2}$=3:1) Si. The Au substrate was exposed to a 1 mM/l solution of 1-dodecanethiol in ethanol for 24 hours to form a monolayer. After thorough rinsing the sample, it was exposed to a $0.1{\mu}M/1$ solution of 4,4-Di(ethynylphenyl)-2'-nitro-1-(thioacetyl)benzene in dimethylformamide(DMF) for 30 min and kept in the dark during immersion to avoid photo-oxidation. After the assembly, the samples were removed from the solutions, rinsed thoroughly with methanol, acetone, and $CH_{2}Cl_{2}$, and finally blown dry with $N_2$. Under these conditions, we measured electrical properties of self-assembly monolayers(SAMs) using ultra high vacuum scanning tunneling microscopy(UHV-STM). The applied voltages were from -1.50 V to -1.20 V with 298 K temperature. The vacuum condition is $6{\times}10^{-8}$ Torr. As a result, we found that NDR and charge transfer property by a little change of height when the voltage is applied between STM tip and electrode.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2003.04a
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• pp.196-201
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• 2003

When the structures are used in cold regions, the mechanical properties and dimension stability of the blade will be changed. The proposal of this study is to test the durability of the structures in cold regions. It is necessary to select the most comfortable materials and fabrication processes for more stable structures in cold regions. To select the most comfortable materials and processes, the static strength has to know through the tensile static tests at the severe condition as cold regions. First, the tensile static specimens made by RIM (Resin injection molding) process & vacuum bagging process with reinforcement materials and resin. Tensile static tests were carried out on three laminate lay-ups (carbon prepreg, carbon fiber dry fabric) at different test temperature($24^{\circ}C$, $-30^{\circ}C$), determining properties such as the mechanical strength, stiffness and strain to failure. At different test temperature, in order to test the tensile strengths of these specimens used the low temperature chamber. Next, the results of this test were compared with each other. Finally, the most comfortable materials and fabrication processes can select based on these results. The results show the changes in the static behavior of three laminate lay-ups at different test temperatures. At low temperatures, the static strengths are higher than the ones at room temperature.

• Korean Journal of Fisheries and Aquatic Sciences
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• v.21 no.4
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• pp.225-231
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• 1988

As the studies on effective utilization of polyunsaturated lipids in sardine (Sardinops melanosticta), the conditions of deacidification, decoloring, and deodorization for processing of refined sardine oil were investigated In the process of refining, phosphoric acid treatment was not effective in removing phosphatides, and optimal condition to neutralize the crude sardine ill was treating for 30min at $40^{\circ}C$. with $0.5\%$ excess of 3M NaOH solution. Decoloring was optimized by adding $5\%$ bleaching earth and treating for 20min at $50^{\circ}C$ under vacuum, and deodorizing was done by steam destillation at $180^{\circ}C$ under 3 torr of vacuum. When deodorizing temperature exceeded $200^{\circ}C$, some changes occured in fatty acid composition and artifacts were appeared on GLC chromatogram.

• The Journal of the Korea Contents Association
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• v.7 no.12
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• pp.66-73
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• 2007

The Jewelry-relation industry is being placed in the crises which are serious with depression of domestic market, design development and a major force absence also high labor cost charge. The consumers have the value of the price preparation maximum and product differentiation which they want. The Jewelry CAD and RP equipment shorten cost of production enterprise which depended hand-metal work provided for the various design and a rapid new product. But until now, it was necessary to the original work of best condition casting vacuum cycle as difficult with direct casting of synthetic resin from RP equipment. I intend to imply significance about through the CAD and RP equipment application result with it analyses, after jewelry CAD and RP work applicable to direct casting will be possible and able to through the casting vacuum cycle produce the product which is suitable in the original production. Through the this paper jewelry secures a quality improvement of the product and discrimination characteristic being various competitive power of design and provide a new base in product production.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.178-178
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• 2010

With the scaling down of ULSI(Ultra Large Scale Integration) circuit of CMOS(Complementary Metal Oxide Semiconductor)based electronic devices, the electronic devices become more faster and smaller size that are promising field of semiconductor market. However, very narrow line width has some disadvantages. For example, because of narrow line width, deposition of conformal and thin barrier is difficult. Besides, proportion of barrier width is large, thus resistance is high. Conventional PVD(Physical Vapor Deposition) thin films are not able to gain a good quality and conformal layer. Hence, in order to get over these side effects, deposition of thin layer used of ALD(Atomic Layer Deposition) is important factor. Furthermore, it is essential that copper atomic diffusion into dielectric layer such as silicon oxide and hafnium oxide. If copper line is not surrounded by diffusion barrier, it cause the leakage current and devices degradation. There are some possible methods for improving the these secondary effects. In this study, TaNx, is used of Tertiarybutylimido tris (ethylamethlamino) tantalum (TBITEMAT), was deposited on the 24nm sized trench silicon oxide/silicon bi-layer substrate with good step coverage and high quality film using plasma enhanced atomic layer deposition (PEALD). And then copper was deposited on TaNx barrier using same deposition method. The thickness of TaNx was 4~5 nm. TaNx film was deposited the condition of under $300^{\circ}C$ and copper deposition temperature was under $120^{\circ}C$, and feeding time of TaNx and copper were 5 seconds and 5 seconds, relatively. Purge time of TaNx and copper films were 10 seconds and 6 seconds, relatively. XRD, TEM, AFM, I-V measurement(for testing leakage current and stability) were used to analyze this work. With this work, thin barrier layer(4~5nm) with deposited PEALD has good step coverage and good thermal stability. So the barrier properties of PEALD TaNx film are desirable for copper interconnection.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.222-222
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• 2010

III-V반도체 태양전지는 다양한 에너지 밴드갭을 만들 수 있으며 다중접합 태양전지의 경우 흡수 전류가 커져 효율이 증가한다. 태양전지의 효율의 증가는 태양광 발전시스템의 발전 단가를 낮추는 중요한 요인이다. 우리는 효율이 높은 III-V 태양전지를 제작하기 위해 일차적으로 Ge기판 위에 GaAs를 성장하고자 한다. Ge기판과 GaAs의 격자상수는 0.07%차이로 거의 일치하나 물질의 열팽창계수가 다르고 비극성인 Ge기판 위에 극성인 GaAs를 성장 시 위상불일치(Anti Phase Domain) 나타난다. 위상불일치 현상을 줄이기 위해 성장 시 온도와 V/III비율, 성장두께 등을 달리하여 성장한다. 표면의 상태가 좋아질수록 위상불일치 현상이 작으며 단일성장 보다 두 단계 과정으로 성장 했을 때 표면의 상태가 더 좋은 결과를 바탕으로[1], 20nm 이하로 얇게 seed층을 성장하고 그 위에 두꺼운 버퍼층을 성장하는 두 단계로 진행하였다. seed층의 성장온도는 $400{\sim}550^{\circ}C$, V/III 비율을 3.5~30으로 다양하게 바꿔가면서 표면의 상태를 비교하였다. 이때 버퍼층의 성장 온도와 V/III 비율은 $680^{\circ}C$, 192으로 일정하게 유지하였다. 표면은 SEM과 AFM을 통해 분석하였으며 결정질의 상태는 XRD 장비(Panalytical사)로 분석하고 광학적 특성은 LTPL(Accent Optical Technologies사)로 측정하였다. 실험의 결과는 seed층의 온도가 낮고 V/III 비율이 낮으며 성장률이 높았을 때 표면상태가 좋은 반면 버퍼층은 온도가 높고 V/III 비율이 높으며 성장률이 낮을 때 표면상태가 좋았다. seed층을 $450^{\circ}C$온도에서 V/III 비율이 3.5이고 성장률이 버퍼층에 비교하여 크게 하여 성장 했을 때 표면 거칠기가 3.75nm로 작아 표면의 상태가 좋음을 확인할 수 있었다. 두 단계 성장 시 표면의 상태는 seed층의 조건에 따라 결정됨을 알 수 있었다. 표면상태가 좋았을 때 결정상태 역시 좋았으며 성장률이 바뀜에 따라 반치폭이 42~45 arcsec의 값을 나타내었다. 광학적 특성은 10K에서 1.1512eV 밴드갭 에너지를 가지고 있어 양질의 GaAs가 성장됨을 알 수 있다.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.490.1-490.1
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• 2014

The ZnO nanowire (NW)-based nanogenerators (NGs) can have rectifying current and potential generated by the coupled piezoelectric and semiconducting properties of ZnO by variety of external stimulation such as pushing, bending and stretching. So, ZnO NGs needed to enhance durability for stable properties of NGs. The durability of the metal electrodes used in the typical ZnO nanogenerators(NGs) is unstable for both electrical and mechanical stability. Indium tin oxide (ITO) is used as transparent flexible electrode but because of high cost and limited supply of indium, the fragility and lack of flexibility of ITO layers, alternatives are being sought. It is expected that carbon nanotube and Ag nanowire conductive coatings could be a prospective replacement. In this work, we demonstrated transparent flexible ZnO NGs by using CNT/Ag nanowire hybrid electrode, in which electrical and mechanical stability of top electrode has been improved. We grew vertical type ZnO NW by hydrothermal method and ZnO NW was coated with hybrid silicone coating solution as capping layer to enhance adhesion and durability of ZNW. We coated the CNT/Ag nanowire hybrid electrode by using bar coating system on a capping layer. Power generation of the ZnO NG is measured by using a picoammeter, a oscilloscope and confirmed surface condition with FE-SEM. As a results, the NGs using the CNT/Ag NW hybrid electrode show 75% transparency at wavelength 550 nm and small change of the resistance of the electrode after bending test. It will be discussed the effect of the improved flexibility of top electrode on power generation enhancement of ZnO NGs.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.273.2-273.2
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• 2014

Sputtering process has been widely used in Si-based semiconductor industry and it is also an ideal method to deposit transparent oxide materials for thin-film transistors (TFTs). The oxide films grown at low temperature by conventional RF sputtering process are typically amorphous state with low density including a large number of defects such as dangling bonds and oxygen vacancies. Those play a crucial role in the electron conduction in transparent electrode, while those are the origin of instability of semiconducting channel in oxide TFTs due to electron trapping. Therefore, post treatments such as high temperature annealing process have been commonly progressed to obtain high reliability and good stability. In this work, the scheme of electron-assisted RF sputtering process for high quality transparent oxide films was suggested. Through the additional electron supply into the plasma during sputtering process, the working pressure could be kept below $5{\times}10-4Torr$. Therefore, both the mean free path and the mobility of sputtered atoms were increased and the well ordered and the highly dense microstructure could be obtained compared to those of conventional sputtering condition. In this work, the physical properties of transparent oxide films such as conducting indium tin oxide and semiconducting indium gallium zinc oxide films grown by electron-assisted sputtering process will be discussed in detail. Those films showed the high conductivity and the high mobility without additional post annealing process. In addition, oxide TFT characteristics based on IGZO channel and ITO electrode will be shown.