• Proceedings of the KSME Conference
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• 2000.04a
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• pp.873-878
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• 2000

Semiconductor packaging technology is changed rapidly according to the trends of the micro miniaturization of multimedia and information equipment. For I/O limitation and fine pitch limitation, DIP and SOP/QFP are replaced by BGA/CSP. This is one of the surface mount technology(SMT). Solder ball is bumped n the die pad and connected onto mounting board. In ball bump formation, vacuum suction type ball alignment process is widely used, However this type has some problems such as ionization, static electricity and difficulty of fifo(first-input first-out) of solder balls. Seesaw type is reducing these problems and has a structural simplicity and economic efficiency. Ball cartridge velocity and ball aligned plate angle are Important variables to improve the ball alignment Process. In this paper, seesaw-type CSP solder ball loader is developed and the optimal velocity and plate angle are proposed.

• Journal of the Korean Ceramic Society
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• v.32 no.7
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• pp.825-831
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• 1995

Reaction-bonded SiC-Si material was fabricated by infiltration of Si melt into a mixture of $\alpha$-SiC and carbon at 175$0^{\circ}C$ under the vacuum atmosphere. Wear properties were analyzed by ball-on-plate wear tester, changing loading weight, sliding speed, sliding time and atmosphere, Results showed that the friction coefficient was decreased with increasing load and sliding velocity. The lowest friction coefficient of 0.05 was obtained under an oil atmosphere. The analysis of the wear surface indicated that the areas wehre particles were pulled out and where free silicon particles worn out preferentially serve as liquid reservoirs to decrease the wear resistance.

• Proceedings of the SAREK Conference
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• 2007.11a
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• pp.229-234
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• 2007

Microscale heat transfer and microfluidics have become increasingly important to overcome some very complex engineering challenges. The use of very small passages to gain heat transfer enhancement is a well documented method for achieving high heat flux dissipation. As the passage size is decreased, the heat transfer performance increases but the pressure drop increases sharply when the passage size is reduced. In this study, the performance evaluation of micro plated heat exchangers under the counter flows with straight, V-shaped and Y-shaped channel are carried out.

• 한국신재생에너지학회:학술대회논문집
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• 2008.05a
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• pp.441-443
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• 2008

A non-vacuum process for fabrication of $CuInSe_2$ (CIS) absorber layer from the corresponding Cu, In solution precursors was described. Cu, In solution precursors was prepared by a room temperature colloidal route by reacting the starting materials $Cu(NO_3)_2$, $InCl_3$ and methanol. The Cu, In solution precursors were mixed with ethylcellulose as organic binder material for the rheology of the mixture to be adjusted for the doctor blade method. After depositing the mixture of Cu, In solution with binder on Mo/glass substrate, the samples were preheated on the hot plate in air to evaporate remaining solvents and to burn the organic binder material. Subsequently, the resultant CI/Mo/glass sample was selenized in Se evaporation in order to get a solar cell applicable dense CIS absorber layer. The CIS absorber layer selenized at $530^{\circ}C$ substrate temperature for 30 min with various Se gas evaporation temperature was characterized by XRD, SEM, EDS.

• Korean Journal of Poultry Science
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• v.24 no.1
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• pp.9-15
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• 1997

This experiment was carried out to investigate the effects on shelf-life of chilling and packing methods of cold chicken breast and thigh meats. Deboned chicken breast and thigh meats were packed by either vacuum or atmosphere packing method, and stored at -2˚C for 1, 3, 7, 11, 15, and 20 days. The thiobarbituric acid(TBA) values of all treatments were significantly increased as the storage period extended(P<0.05), however, TBA values of all treatments were remark-ably decreased at 15 days. TBA values of immersion chilled and vacuum-packed thigh meats were increased, but no difference between atmosphere and vacuum-packing methods was found. The volatile basic nitrogen(VBN) values at 1 day of storage were low, but they were increased as the storage period extended. The VBN values at 20 days after storage were from 12.25~19.28 mg %. Total bacterial counts tended to increase in all treatments, however, no significant difference was found in any treatment. Total plate counts of breast meat were higher than those of thigh meat as the storage period extended.

• 한국신재생에너지학회:학술대회논문집
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• 2009.06a
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• pp.19-22
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• 2009

A non-vacuum process for fabrication of $CuIn_xGa_{1-x}Se_2$ (CIGS) absorber layer from the corresponing Cu, In, Ga solution precursors was described. Cu, In, Ga precursor solution was prepared by a room temperature colloidal route by reacting the starting materials $Cu(NO_3)_2$, $InCl_3$, $Ga(NO_3)$ and methanol. The Cu, In, Ga precursor solution was mixed with ethylcellulose as organic binder material for the rheology of the mixture to be adjusted for the doctor blade method. After depositing the mixture of Cu, In, Ga solution with binder on Mo/glass substrate, the samples were preheated on the hot plate in air to evaporate remaining solvents and to burn the organic binder material. Subsequently, the resultant CIG/Mo/glass sample was selenized in Se evaporation in order to get a solar cell applicable dense CIGS absorber layer. The CIGS absorber layer selenized at $530^{\circ}C$ substrate temperature for 1h with various metal organic ratio.

• Membrane and Water Treatment
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• v.9 no.1
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• pp.53-62
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• 2018

In this study, vacuum membrane distillation (VMD) was used to treat high-salinity wastewater (concentration about 17%) discharged by chlor-alkali plant after resin regeneration. The feasibility of VMD for the treatment of real saline wastewater by using Polyvinylidene fluoride (PVDF) microporous plate membrane with a pore diameter of $0.2{\mu}m$ was investigated. The effects of critical operating parameters such as feed temperature, velocity, vacuum degree and concentration on the permeate water flux were analyzed. Numerical simulation was used to predict the flux and the obtained results were in good agreement with the experimental data. The results showed that an increase in the operating conditions could greatly promote the permeate water flux which in turn decreased with an increase in the concentration. When the concentration varied from 17 to 25%, the permeate water flux dropped marginally with time indicating that the concentration was not sensitive to the decrease in permeate water flux. The permeate water flux decreased sharply until zero due to the membrane fouling resistance as the concentration varied from 25 to 26%. However, the conductivity of the produced water was well maintained and the average value was measured to be $4.98{\mu}s/cm$. Furthermore, a salt rejection of more than 99.99% was achieved. Overall, the outcome of this investigation clearly indicates that VMD has the potential for treating high-salinity wastewater.

• Korean Journal of Materials Research
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• v.17 no.3
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• pp.179-183
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• 2007

A plate heat exchanger (PHE) normally uses vacuum brazing technology for connecting plates and fins. However, the reliability of high temperature brazing, especially with nickel-based filler metals containing boron the formation of brittle intermetallic compounds (IMCs) in brazed joints is of major concern. since they considerably degrade the mechanical properties. This research was examined the vacuum brazing of commercially SUS304 stainless steel with BNi-2 (Ni-Cr-B-Si) filler metal, and discussed to determine the influence of brazing temperatures on the microstructure and mechanical strength of brazed joints. In the metallographic analysis it is observed that considerable large area of Cr-B intermetallic compound phases at the brazing layer and the brazing tensile strength is related to removal of this brittle phase greatly. The mechanical properties of brazing layer could be stabilized through increasing the brazing temperature over $100^{\circ}C$ more than melting temperature of filler metals, and diffusing enough the brittle intermetallic compound formed in the brazing layer to the base metal.

• Journal of the Semiconductor & Display Technology
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• v.11 no.1
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• pp.73-78
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• 2012

In this study, the optimal process condition was induced about the pillar arrangement process of applying the screen printing method in the manufacture process of vacuum glazing panel. The high precision screen printing is technology which pushes out the paste and spreads it by using the squeegee on the stainless steel plate in which the pattern is formed. The screen printing method is much used in the flat panel display field including the LCD, PDP, FED, organic EL, and etc for forming the high precision micro-pattern. Also a number of studies of screen printing method have been conducted as the method for the cost down through the improvement of productivity. The screen printing method has many parameters. So we used Taguchi method in order to decrease test frequencies and optimize this parameters efficiently. In this study, experiments of pillar arrangement were performed by using Taguchi experimental design. We analyzed experimental results and obtained optimal conditions which are 4 m/s of squeegee speed, $40^{\circ}$ of squeegee angle and distance between metal mask and glass.

• Journal of Welding and Joining
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• v.25 no.4
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• pp.42-48
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• 2007

An inert gas atomized NiTiZrSiSn bulk metallic glass feedstock was sprayed onto the copper plate using vacuum plasma spraying process. In order to change the in-flight particle energy, that is, thermal energy, the hydrogen gas flow rate in plasma gas mixture was increased at the constant flow rate of argon gas. Coating and single pass spraying bead were produced with the least feeding rate. Regardless of the plasma gas composition, fully melted through unmelted particle could be observed on the overlay coating. However, the frequency of the unmelted particle number density was increased with the decrease of the hydrogen gas flow rate. The amorphous phase fraction within coating was also affected by the number density of the unmelted particle.