• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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• pp.214.2-214.2
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• 2013

Device performance for the 45 and 32 nm node CMOS technology requires the integration of ultralow-k materials. To lower the dielectric constant for PECVD and spin-on materials, partial replacement of the solid network with air (k=1.01) appears to be more intuitive and direct option. This can be achieved introducting of second "labile" phase during depositoin that is removed during a subsequent UV curing and annealing step. Besides, with shrinking line dimensions the resistivity of barrier films cannot meet the International Technology Roadmap for Semiconductors (ITRS) requirements. To solve this issue self-forming diffusion barriers have drawn attention for great potential technique in meeting all ITRS requirments. In this present work, we report a Cu-V alloy as a materials for the self-forming barrier process. And we investigated diffusion barrier properties of self-formed layer on low-k dielectrics with or without UV curing treatment. Cu alloy films were directly deposited onto low-k dielectrics by co-sputtering, followed by annealing at various temperatures. X-ray diffraction revealed Cu (111), Cu (200) and Cu (220) peaks for both of Cu alloys. The self-formed layers were investigated by transmission electron microscopy. In order to compare barrier properties between V-based interlayer on low-k dielectric with UV curing and interlayer on low-k dielectric without UV curing, thermal stability was measured with various heat treatment temperature. X-ray photoelectron spectroscopy analysis showed that chemical compositions of self-formed layer. The compositions of the V based self-formed barriers after annealing were strongly dominated by the O concentration in the dielectric layers.

• 한국세라믹학회지
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• 제47권6호
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• pp.515-523
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• 2010

Porous SiC candle filter preforms were fabricated by extrusion and ramming process. To fabricate SiC candle filter preform, commercially available F180 mesh ($85\;{\mu}m$) $\alpha$-SiC powder and $44\;{\mu}m$ mullite, $CaCO_3$ powder were used as the starting materials. The candle type preforms were fabricated by vacuum extrusion and ramming process, and sintered at $1400^{\circ}C$ 2 h in air atmosphere. Corrosion test of the sintered candle filter specimens as forming method was performed at $600^{\circ}C$ for 2,400 h in simulated IGCC syngas atmosphere. The effect of forming method on mechanical properties, pore distribution, microstructure and crystalline phase was investigated.

• 한국세라믹학회지
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• 제46권6호
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• pp.662-667
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• 2009

Porous SiC candle filter preforms were fabricated by extrusion and ramming process. To fabricate SiC candle filter preform, commercially available 85 ${\mu}m\;{\alpha}-$-SiC powder and 44 ${\mu}m$ mullite, CaC$O_3$ powder were used as the starting materials. The candle type preforms were fabricated by vacuum extrusion and ramming process, and sintered at $1400{^{\circ}C}$ 2 h in air atmosphere. The effect of forming method on porosity, density, strength (flexural and compressive strength) and microstructure was investigated. Also, corrosion test of the sintered candle filter specimens as forming method was performed at $600{^{\circ}C}$ in IGCC syngas atmosphere. The sintered SiC filter which was formed by ramming process has more higher density and exhibit higher strength than extruded filter. Its maximum density and 3-point bending strength were 2.00 g/$cm^3$ and 45 MPa, respectively.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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• pp.256-256
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• 2012

Oxide semiconductors such as zinc tin oxide (ZTO) or indium gallium zinc oxide (IGZO) have attracted a lot of research interest owing to their high potential for application as thin film transistors (TFTs) [1,2]. However, the instability of oxide TFTs remains as an obstacle to overcome for practical applications to electronic devices. Several studies have reported that the electrical characteristics of ZnO-based transistors are very sensitive to oxygen, hydrogen, and water [3,4,5]. To improve the reliability issue for the amorphous InGaZnO (a-IGZO) thin-film transistor, back channel passivation layer is essential for the long term bias stability. In this study, we investigated the instability of amorphous indium-gallium-zinc-oxide (IGZO) thin film transistors (TFTs) by the back channel contaminations. The effect of back channel contaminations (humidity or oxygen) on oxide transistor is of importance because it might affect the transistor performance. To remove this environmental condition, we performed vacuum seasoning before the deposition of hybrid passivation layer and acquired improved stability. It was found that vacuum seasoning can remove the back channel contamination if a-IGZO film. Therefore, to achieve highly stable oxide TFTs we suggest that adsorbed chemical gas molecules have to be eliminated from the back-channel prior to forming the passivation layers.

• 한국정밀공학회지
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• 제17권8호
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• pp.180-188
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• 2000

Fine multi-hole sheet metal product(FMSMP) is a specific metal plate which is used in color TV and computer monitor. Processes of manufacturing FMSMP are generally composed of coating cleaning exposure and etching processes. After a thin metal plate is made by rolling photosensitive liquid is coated on the metal plate in coating process. Then the coated thin metal plate consecutively passes through exposure process in which upper and lower glasses are compressed by vacuuming the space between glasses and metal plate. In this lowered glasses are compressed by vacuuming the space between glasses and metal plate. In this lowered vacuum state certain part of metal plate is desirably exposed to light and will be etched into forming lots of well-arranged holes with a specific diameter, nowadays to manufacture FMSMP of 17 inch braun tube 80 second is required for complete vacuum but 35 second is applied to manufacture FMSMP in reality. In the present study vacuuming time is tried to reduce for improvement of productivity by analyzing vacuum system and proposing several solutions, for faster vacuuming speed degree of vacuum state between glasses and metal plate is improved by the proposed method and experiments using the proposed method are performed for verification. In addition microstructure of FMSMP is investigated to prevent stain phenomena and to improve quality of the product.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2009년도 추계학술대회 논문집
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• pp.267-270
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• 2009

In the present investigation, we are newly developing a new forming process which can fabricate micro patterns on large-area polymeric substrates for high speed mass production. The key idea of the new process is to pressurize multiple vacuum-packed substrate-mold stacks above the glass transition temperature ($T_g$) of the polymeric substrates. The new process is thought to be promising micro-pattern fabrication technique in three aspects; firstly, isostatic pressing ensures the uniform micro-pattern replicating condition regardless of the substrate area. Secondly, the control of forming condition such as temperature and pressure can realize well-defined process condition exploited in the conventional hot embossing research field. Thirdly, multiple substrates can be patterned at the same time. A prototype forming machine for the new process was developed with the design consideration realizing the present idea. With a developed machine, micro prismatic array patterns with 50 um in size were successfully made on the $380{\times}300{\times}6\;mm$ PMMA plate.

• 한국주조공학회지
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• 제26권2호
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• pp.98-103
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• 2006

Metal-mold reactions between investment mold and TiAl alloys were investigated for the economic net-shape forming of TiAl alloys. The effect of mold preheating temperatures on the metal-mold reaction were investigated using a vacuum induction-melting furnace. In the case of TiAl alloys, there were no ${\alpha}$-case formation reactions. There were neither interstitial nor substitutional ${\alpha}$-case formations as TiAl alloys have both negligible solubility of oxygen and low activity in molten states. The fluidity of TiAl alloys increases with mold preheating temperature since they have a peritectic reaction that appears in the form of envelope, surrounding each particles of the primary constituent. The results of the investment casting of TiAl alloys confirm that the casting route in our study can be an effective approach for the economic net-shape forming of TiAl alloys.

• 한국자기학회지
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• 제8권3호
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• pp.125-130
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• 1998

13Cr-1.5Nb-Fe합금분말이 수분사법으로 제조되엇다. 제조된 합금뷴말을 압축기를 이용하여 ring현상으로 성형한후, 진공중에서 소결하였다. as-prepared 분말의 현상, 입도분포, 성분분석 및 포화자화물 조사하였으며, 소결된 시편의 투자율, 교류자기이력손실이 조사되었다. as-prepared 13Cr-1.5Nb-Fe합금분말의 포화자화는 160emu/g이었으며, 산소함유량은 약 600ppm이었다. 입도분포는 약 70$\mu$m에서 50%vol.을 나타낸다. 교류투자율은 소결온도 및 성형온도가 증가할수록 증가한다. 주파수 20KHz에서 교류자기이력손실은 12ton/cm2성령압력 및 120$0^{\circ}C$ 소결온도 조건에서 107W/cc로 가장우수하다.

• 한국정밀공학회지
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• 제18권12호
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• pp.167-176
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• 2001

The effects of heat treatments and testing temperatures on the mechanical properties of Invar materials were investigated through experiments, which call influence the formability in metal forming fields. Annealing temperatures were changed from $900^{\circ}C$ to $1200^{\circ}C$ with an increment of $100^{\circ}C$ under two different furnace atmosphere(vacuum and H$_2$gas). Microstructure and hardness tests were performed for annealed specimens at room temperature(RT) and tensile tests were also performed by changing annealing temperatures as well as testing temperatures from RT to $300^{\circ}C$. The grain size of annealed materials increased with increasing annealing temperature, while micro-hardness distributions showed almost same hardness values regardless of annealing temperatures. Strength ratio (tensile/yield strength), which influences the forming characteristics of sheet metal, remained almost constant for various experimental conditions in case of unannealed specimens. However, it showed increasing tendency with increasing both annealing and testing temperatures, particularly at the testing temperature higher than $200^{\circ}C$. Therefore it can be concluded that press formability of fully-annealed Invar material can be improved by warm forming technique.

• Composites Research
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• 제23권6호
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• pp.61-66
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• 2010

본 논문에서는 필라멘트 와인딩 시 장력에 의해 압밀을 유발하는 압력을 선행연구자들의 연구를 참조하여 결정한 후 T800 탄소섬유/에폭시 복합재료의 기본적인 물성과 성형압력 변화에 따른 면 내 외의 물성 변화를 측정하였다. 실험 시편은 오토클레이브 진공백 성형을 통해 압력(절대압력 0.1MPa, 0.3MPa, 0.7MPa)을 조절하여 제조되었다. 모든 시편은 적층판 형태로 정화된 후 워터젯을 이용하여 시편 모양으로 절단되었으며, 층간 전단시편의 V-노치는 밀링가공을 통하여 제작되었다. 평면 내 물성을 위해 다양한 인장실험이 실시되었으며, 평면 외 물성을 측정하기 위해 층간 전단 실험이 수행되었다 성형압력과 물성 변화를 관련시키기 위해 시편의 섬유 부피분율을 측정하였다. 본 연구에서 측정된 물성은 동일한 탄소섬유 (T800 탄소섬유)를 사용하여 필라멘트 와인딩 공정으로 제작되는 차량용 Type III 수소저장용기의 설계에 유용하게 활용될 수 있을 것으로 기대된다.