• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.102-102
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• 2018

Electronic industry had required the finer size and the higher performance of the device. Therefore, 3-D die stacking technology such as TSV (through silicon via) and micro-bump had been used. Moreover, by the development of the 3-D die stacking technology, 3-D structure such as chip to chip (c2c) and chip to wafer (c2w) had become practicable. These technologies led to the appearance of HBM (high bandwidth memory). HBM was type of the memory, which is composed of several stacked layers of the memory chips. Each memory chips were connected by TSV and micro-bump. Thus, HBM had lower RC delay and higher performance of data processing than the conventional memory. Moreover, due to the development of the IT industry such as, AI (artificial intelligence), IOT (internet of things), and VR (virtual reality), the lower pitch size and the higher density were required to micro-electronics. Particularly, to obtain the fine pitch, some of the method such as copper pillar, nickel diffusion barrier, and tin-silver or tin-silver-copper based bump had been utillized. TCB (thermal compression bonding) and reflow process (thermal aging) were conventional method to bond between tin-silver or tin-silver-copper caps in the temperature range of 200 to 300 degrees. However, because of tin overflow which caused by higher operating temperature than melting point of Tin ($232^{\circ}C$), there would be the danger of bump bridge failure in fine-pitch bonding. Furthermore, regulating the phase of IMC (intermetallic compound) which was located between nickel diffusion barrier and bump, had a lot of problems. For example, an excess of kirkendall void which provides site of brittle fracture occurs at IMC layer after reflow process. The essential solution to reduce the difficulty of bump bonding process is copper to copper direct bonding below $300^{\circ}C$. In this study, in order to improve the problem of bump bonding process, copper to copper direct bonding was performed below $300^{\circ}C$. The driving force of bonding was the self-annealing properties of electrodeposited Cu with high defect density. The self-annealing property originated in high defect density and non-equilibrium grain boundaries at the triple junction. The electrodeposited Cu at high current density and low bath temperature was fabricated by electroplating on copper deposited silicon wafer. The copper-copper bonding experiments was conducted using thermal pressing machine. The condition of investigation such as thermal parameter and pressure parameter were varied to acquire proper bonded specimens. The bonded interface was characterized by SEM (scanning electron microscope) and OM (optical microscope). The density of grain boundary and defects were examined by TEM (transmission electron microscopy).

• Korean Journal of Construction Engineering and Management
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• v.6 no.1 s.23
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• pp.99-108
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• 2005

Interactive electronic technical manual(IETM) for construction projects means an electronic tool that regulations and specifications related to construction method or maintenance process ale described by electronic book type. It has a meaning of integrated information system that includes virtual reality(VR), 3D animation and image contents for representing real construction information so that user can easily understand the construction situation and maintenance process. The basic information and technical manuals of construction facilities are being written as paper documents in our construction industry. As the result, the information management in the maintenance phase of construction projects is inefficient, and maintenance cost is being increased. This study attempts to improve the lack of understanding about construction IETM through the analysis of necessity and unique function of construction IETM comparing with the IETMS in other industry, Finally, this study shows a scenario of construction IErM for mitigating natural disaster of construction facilities to verify applicability of IETM.

• Journal of the Korea Computer Graphics Society
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• v.21 no.1
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• pp.1-11
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• 2015

Researchers have developed virtual reality environments to provide audience with more visually immersive experiences than previously possible. One of the most popular solutions to build the immersive VR space is a multi-projection technique. However, utilization of multiple projectors requires large spaces, expensive cost, and accurate geometry calibration among projectors. This paper presents a novel omnidirectional projection system with a single projector and a single spherical mirror.We newly designed the simple and intuitive calibration system to define the shape of environment and the relative position of mirror/projector. For successful image projection, our optimized omnidirectional image generation step solves image distortion produced by the spherical mirror and a calibration problem produced by unknown parameters such as the shape of environment and the relative position between the mirror and the projector. Additionally, the focus correction is performed to improve the quality of the projection. The experiment results show that our method can generate the optimized image given a normal panoramic image for omnidirectional projection in a rectangular space.