• Laser Solutions
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• v.11 no.1
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• pp.1-6
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• 2008

We proposed new light guide panel (LGP) fabrication method exploiting laser-processed inner scatterers and surface pattern. The proposed method has achieved LGP performance improvement in both brightness and uniformity. The inner scatterers and surface pattern of grid type were fabricated with a 2nd harmonic Nd:YAG pulse laser engraving system and a $CO_2$ laser scanning system, respectively. In the implementation of LGP, inner scatterers was arranged in accordance with linear or curved pattern with changing density and surface pattern was engraved on the surface of an inner-scatterers embedded LGP. The increase of scatterers' density and the use of surface patterns in both linear and curved pattern provided high luminance and uniformity enhancement. While thecurved pattern incorporated with increased scatterers' density and surface patterns yielded brightness improvement with preserving good uniformity, the linear pattern showed highly localized brightness near the light entrance of the LGP. We can also observe that the uniformity was mainly determined by pattern of inner scatterers, and the brightness was improved by the higher density and the utilization of surface patterns. From the results, the use of laser-processed inner and surface patterns can be a potential alternative for efficient and simple LGP fabrication method.

• Transactions of Materials Processing
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• v.16 no.1 s.91
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• pp.42-47
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• 2007

LCD-BLU is one of kernel parts of LCD and it consists of several optical sheets: LGP, light source and mold frame. The LGP of LCD-BLU is usually manufactured by etching process and forming numerous dots with $50\sim300{\mu}m$ diameter on the surface. But the surface of the etched dots of LGP is very rough due to the characteristics of the etching process during the mold fabrication, so that its light loss is high along with the dispersion of light into the surface. Accordingly, there is a limit in raising the luminance of LCD-BLU. In order to overcome the limit of current etched dot patterned LGP, optical pattern with continuous microlens was designed using optical simulation CAE. Also, a mold with continuous micro-lens was fabricated by UV-LiGA reflow process and applied to 7 inch size of navigator LCD-BLU in the present study.

• Journal of the Korean Society of Safety
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• v.31 no.3
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• pp.47-52
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• 2016

This paper describes the design and fabrication of high frequency ground impedance measuring system for assessment of grounding system for Lightning protection. The ground impedance measuring system has been designed and fabricated which makes it possible to assess the ground impedance by frequency ranges from 100 Hz to 1 MHz. The effective grounding systems having a very low impedance to electromagnetic disturbance such as lightning surges and noises in microelectronics and high-technology branches are strongly required. In order to analyze the dynamic characteristic of grounding system impedances in lightning and surge protection grounding systems, it is highly desirable to assess the ground impedances as a measure of performance of grounding system in which lightning and switching surge currents with fast rise time and high frequency flow. The measuring system is based on the variable frequency power supply and consists of signal circuit part, main control part, data acquisition and processing unit, and voltage and current probe system. The ground impedance measuring system can be used to assess grounding system during occurrence of lightning.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08b
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• pp.1220-1224
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• 2007

The effects of plasma damages to the organic thin film transistor (OTFT) during the fabrication process are investigated; metal deposition process on the organic gate insulator by plasma sputtering mainly generates the process induced damages of bottom contact structured OTFTs. For this study, various deposition methods (thermal evaporation, plasma sputtering, and neutral beam based sputtering) and metals (gold and Indium-Tin Oxide) have been tested for their damage effects onto the Poly 4-vinylphenol(PVP) layer surface as an organic gate insulator. The surface damages are estimated by measuring surface energies and grain shapes of organic semiconductor on the gate insulator. Unlike thermal evaporation and neutral beam based sputtering, conventional plasma sputtering process induces serious damages onto the organic surface as increasing surface energy, decreasing grain sizes, and degrading TFT performance.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.36D no.3
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• pp.85-91
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• 1999

$H:LiNbO_3$ optical modulator with Cu/parylene electrode layer, which has a merits in the bandwidth, power consumption and fabrication conditions as compared with conventional Au/Cr/$SiO_2$, is proposed and fabricated. Analysis and design of optical modulator is performed by finite element calculation. Various unit processes for fabricating the proposed modulator, 1550nm $H:LiNbO_3$ optical waveguide, parylene buffer layer, and CPW Cu electrode, were developed, After dicing and end-face polishing of fabricated modulator chip, optical modulation responses as sawtooth electrical driving voltage has been measured at low frequencies. Properties of optical waveguide had not been changed before and after Cu/parylene electrode processes, which make confirm the reproducible fabrication of optical modulator.

• The Journal of Korean Academy of Prosthodontics
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• v.41 no.4
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• pp.451-465
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• 2003

Statement of problem : Recently various implant components such as premachined gold cylinder, plastic cylinder gold UCLA abutment and plastic abutment were developed and used clinically without clinical investigation. Purpose : The purpose of this study was to evaluate the effects of fabrication of gold cylinder on the fitness and preload of the standard abutment and also the effects of fabrication of UCLA gold abutment on the fitness and stress transfer around the implant fixture. Material and method : Three kinds of gold cylinders such as, as-received gold cylinder (Nobel Biocare, Sweden), gold cylinder after casting, and plastic cylinder after casting with type IV gold alloy were tested over the top of the standard abutment. At the same time, three types of abutments such as, gold UCLA abutment before and after casting, and plastic abutment after casting were tested. The cylinder and abutment was secured over the fixture with conventional pre-load values using an electronic torque controller (Nobel Biocare, Sweden). The fitness of the abutment on the fixture and gold cylinder over the standard abutment were measured using the microhardness tester (MXT 70, Matsuzawa, Japan). Preload and the strain values were recorded using the strain balance unit (SB-10, Measurement group, Raleigh, USA) and strain indicator (P-3500, Measurement group, Raleigh, USA) systems. Results and conclusion : 1. Significant differences were found in the fit between the gold cylinder and plastic cylinder. 2 There were significant differences between the preload of the gold cylinder and that of the plastic cylinder. 3. Significant differences were found in the fit between the gold UCLA abutment and plastic UCLA abutment. 4. There were no significant differences in the stress generated on the supporting structure of the fixture among different cylinder and abutment groups.

• Safety and Health at Work
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• v.10 no.3
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• pp.347-354
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• 2019

Background: The aim of this study was to describe the types of diseases that developed in semiconductor workers who have registered with the Korea Workers' Compensation and Welfare Service (KWCWS) and to identify potential common occupational characteristics by the type of claimed disease. Methods: A total of 55 semiconductor workers with cancer or rare diseases who claimed to the KWCWS were compared based on their work characteristics and types of claimed diseases. Leukemia, non-Hodgkin lymphoma, and aplastic anemia were grouped into lymphohematopoietic (LHP) disorder. Results: Leukemia (n = 14) and breast cancer (n = 10) were the most common complaints, followed by brain cancer (n = 6), aplastic anemia (n = 6), and non-Hodgkin lymphoma (n = 4). LHP disorders (n = 24) accounted for 43%. Sixty percent (n = 33) of registered workers (n = 55) were found to have been employed before 2000. Seventy-six percent (n = 42) of registered workers and 79% (n = 19) among the registered workers with LHP (n = 24) were found to be diagnosed at a relatively young age, ${\leq}40years$. A total of 18 workers among the registered semiconductor workers were finally determined to deserve compensation for occupational disease by either the KWCWS (n = 10) or the administrative court (n = 8). Eleven fabrication workers who were compensated responded as having handled wafers smaller than eight inches in size. Eight among the 18 workers compensated (44 %) were found to have ever worked at etching operations. Conclusion: The distribution of cancer and rare diseases among registered semiconductor workers was closely related to the manufacturing era before 2005, ${\leq}8$ inches of wafer size handled, exposure to clean rooms of fabrication and chip assembly operations, and etching operations.

• Safety and Health at Work
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• v.15 no.1
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• pp.87-95
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• 2024

Background: This study focuses on assessing occupational risk for the health hazards encountered during maintenance works (MW) in semiconductor fabrication (FAB) facilities. Objectives: The objectives of this study include: 1) identifying the primary health hazards during MW in semiconductor FAB facilities; 2) reviewing the methods used in evaluating the likelihood and severity of health hazards through occupational health risk assessment (OHRA); and 3) suggesting variables for the categorization of likelihood of exposures to health hazards and the severity of health effects associated with MW in FAB facilities. Methods: A literature review was undertaken on OHRA methodology and health hazards resulting from MW in FAB facilities. Based on this review, approaches for categorizing the exposure to health hazards and the severity of health effects related to MW were recommended. Results: Maintenance workers in FAB facilities face exposure to hazards such as debris, machinery entanglement, and airborne particles laden with various chemical components. The level of engineering and administrative control measures is suggested to assess the likelihood of simultaneous chemical and dust exposure. Qualitative key factors for mixed exposure estimation during MW include the presence of safe operational protocols, the use of air-jet machines, the presence and effectiveness of local exhaust ventilation system, chamber post-purge and cooling, and proper respirator use. Using the risk (R) and hazard (H) codes of the Globally Harmonized System alongside carcinogenic, mutagenic, or reprotoxic classifications aid in categorizing health effect severity for OHRA. Conclusion: Further research is needed to apply our proposed variables in OHRA for MW in FAB facilities and subsequently validate the findings.

• Bulletin of the Korean Chemical Society
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• v.32 no.spc8
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• pp.3045-3050
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• 2011

The synthesis of copolymers containing thiophene and benzimidazole unit by Stille polymerization is reported. The polymers with many unsubstituted thiophene units in the backbone have been reported to show low solubility, which has been a problem for spin-coating for the device fabrication. In dihexyl-2H-benzimidazole, the sulfur at 2-position of BT unit was replaced with dialkyl substituted carbon, while keeping the 1,2-quinoid form, to improve the solubility of the polymers. The PL emission spectra of the PHBIT1, PHBIT2 and PHBIT3 in chloroform solutions show maximum peaks at 500~561 nm. In thin films, maximum peaks of the PHBITs appeared at 529, 562 and 569 nm, respectively. The EL emission maxima of the PHBIT1 and PHBIT2 appear at around 588 and 576 nm, respectively. The current density and maximum luminescence of the LED with the configuration of ITO/PEDOT/ PHBIT2/Ca/Al are 552 mA/$cm^2$ and 46 cd/$m^2$, respectively.

• Design & Manufacturing
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• v.2 no.5
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• pp.1-4
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• 2008

LCD-BLU (Liquid Crystal Display - Back Light Unit) is one of kernel parts of LCD unit and it consists of several optical sheets(such as prism, diffuser and protector sheets), LCP (Light Guide Plate), light source (CCFL or LED) and mold frame. The LGP of LCD-BLU is usually manufactured by forming numerous dots with $50-200{\mu}m$ in diameter on it by erosion method. But the surface of the erosion dots of LGP is very rough due to the characteristics of the erosion process during the mold fabrication, so that its light loss is high along with the dispersion of light into the surface. Accordingly, there is a limit in raising the luminance of LCD-BLU. Especially, the negative and positive micro-lens pattern fabricated by modified LiGA with thermal reflow process was applied to the optical design of LGP.