• Journal of Mechanical Science and Technology
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• v.19 no.6
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• pp.1329-1337
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• 2005

The OLED (Organic Light Emitting Diodes) display recently used for the information indicating device has many advantages over the LCD (Liquid Crystal Display), and its demand will be increased highly. The linear cell should be designed carefully considering the uniformity of thin film on the substrate. Its design needs to compute the temperature field analytically because the uniformity for the thin film thickness depends on the temperature distribution of the source (organic material). In the present study, the design of the linear cell will be modified or improved on the basis of the temperature profiles obtained for the simplified linear cell. The temperature distributions are numerically calculated through the STAR-CD program, and the grids are generated by means of the ICEM CFD program. As the results of the simplified linear cell, the temperature deviation was shown in the parabolic form among the both ends and the center of the source. In order to reduce the temperature deviation, the configuration of the rectangular ends of the crucible was modified to the circular type. In consequence, the uniform temperature is maintained in the range of about 90 percent length of the source. It is expected that the present methods and results on the temperature analysis can be very useful to manufacture the vapor deposition device.

• Food Science and Preservation
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• v.17 no.1
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• pp.16-22
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• 2010

To maintain the storage quality of agricultural products, temperature uniformity during cold storage, which is affected by fan flow rate and product arrangement, is important. We simulated and validated a CFD (Computational Fluid Dynamics) model that can predict both airflow and temperature distribution in a cold storage environment. Computations were based on a commercial code (FLUENT 6.2) and two turbulence models. The standard k-$\varepsilon$ model and the Reynolds stress model (RSM) were chosen to improve the accuracy of CFD prediction. To obtain comparative data, the temperature distribution and velocity vector profiles were measured in a full-scale cold storage facility and in a 1/5 scale model. The agricultural products domain in cold storage was modeled as porous for economical computation. The RSM prediction showed good agreement with experimental data. In addition, temperature distribution was simulated in the cold storage rooms to estimate the uniformity of temperature distribution using the validated model.

• Proceedings of the KSME Conference
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• 2004.11a
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• pp.1178-1183
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• 2004

Temperature distribution and heating characteristic of the panel heater for infrared heating have been investigated. The temperature variation with time is firstly measured with the thermocouple to figure out the response time of the heater to the power input. The heater reaches faster to the steady state in comparison to the ceramic heater. The infrared thermal imaging system is utilized to investigate the temperature distribution over the heater surface. The measured thermal images show that the thermal boundary layer induced by the free convection near the heater surface affects the temperature distribution on the surface. The images also show the fairly good uniformity of the temperature distribution in the core region of the surface.

• 한국신재생에너지학회:학술대회논문집
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• 2009.11a
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• pp.127-130
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• 2009

The uniform gas distribution between anode channels of the indirect internal reforming type molten carbonate fuel cell (MCFC) is crucial design parameter because of the electric performance and the durability problems. A three-dimensional computational fluid dynamics (CFD) analysis is performed to investigate flow characteristics in the anode channels and manifold under different pressure drop and channel temperature conditions. The combined meshes consists of hexadral meshes in the channels and polyhedral meshes in the manifold are adopted and chemical reactions inside the MCFC system are not included because of computational difficulties associated with the size and geometric complexity of the system. Results indicate that the uniformity in flow-rate is in the range of $\pm$ 0.048 % between the anode channels when the pressure drop of anode channel is about 150 Pa. A gas flow-rate uniformity decreases as the pressure drop of anode channels decreases and as the temperature difference between indirect internal reforming (IIR) channels and anode channels increases.

• Journal of the Semiconductor & Display Technology
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• v.5 no.3 s.16
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• pp.29-32
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• 2006

Because of new requirements related to the employment of SMT(Surface Mounting Technology) manufacturing and the diversity of components on high density PCB(Printed Circuit Boards), Thermal control of the reflow process is required in order to achieve acceptable yields and reliability of SMT assemblies. Accurate control of the temperature distribution during the reflow process is one of the major requirements, especially in lead-free assembly. This study has been performed for reflow process using the commercial CFD(Computational Fluid Dynamics) tool for predicting flow and temperature distributions. Porous plate was installed to prevent leakage flow which was one of the major problem of temperature uniformity in the reflow process. There is a separation region where the flow is turned. Outside wall made of porous plate is to prevent and minimize separation region for acquiring uniform temperature during operation. This paper provided design concept from CFD results of the steady state temperature distribution and flow field inside a reflow oven.

• Journal of the Semiconductor & Display Technology
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• v.10 no.4
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• pp.21-23
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• 2011

Uniformity of plasma etching processes critically depends on the wafer temperature and its distribution. The wafer temperature is affected by plasma, chucking force, He back side pressure and the surface temperature of ESC(electrostatic chuck). In this work, 3D mathematical modeling is used to investigate the influence of the geometry of coolant path and the temperature distribution of the ESC surface. The model that has the coolant path with less change of the cross-sectional area and the curvature shows low standard deviation of the ESC surface temperature distribution than the model with the coolant path of the larger surface area and more geometric change.

• Journal of the Korea Institute of Military Science and Technology
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• v.3 no.2
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• pp.244-249
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• 2000

Thermal gradient chemical vapor infiltration (TG-CVI) process, which is one of the CVI techniques to densify a porous fiber preform, requires for a heater to have uniform surface temperature distribution. Thus, it is essential to design the shape of the heater and to predict the temperature distribution when the heater has a profile which is not a simple cylinder. In this study, an analytical method has been used to design the inner profile of a conical heater showing uniform temperature distribution, if its outer shape is specified. Temperature distribution on the heater surface has been calculated with the finite difference method and compared with the experimental results. When a heater had a combined profile with a large cone and a small cylinder, temperature was higher in the cylindrical part. To reduce the temperature difference between these areas, a hole-machining method has been proposed including other possible ones. A shape design and optimization program has been made to improve the temperature uniformity of the TG-CVI heater better than that designed with the analytical method.

• Journal of the Semiconductor & Display Technology
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• v.11 no.2
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• pp.71-74
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• 2012

Uniformity of the wafer temperature is one of the important factors in etching process. Plasma, chucking force, backside helium pressure and the surface temperature of ESC(electrostatic chuck) affect the wafer temperature. ESC consists of several layers of structure. Each layer has own thermal resistance and the Si-adhesive layer has highest thermal resistance among them. In this work, the temperature distribution of ESC was analyzed by 3-D FEM with various defects and the thickness deviation of the Si-adhesive layer. The result with Si-adhesive layer with the low center thickness deviation shows modified temperature distribution of ESC surface.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.18 no.12
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• pp.98-103
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• 2019

With the increasing need for environmental protection, it is particularly important to improve the energy saving and reliability of refrigerators. Generally, the cold air flowing into the freezer compartment transits to the bottom of the refrigerating compartment, which can lead to uneven temperature distribution. This paper proposes two design solutions for improving the temperature distribution problem. Of these, the optimal refrigeration design was selected and tested using Computational Fluid Dynamics (CFD) modeling and simulation. The results showed improved uniformity of the temperature distribution inside the refrigerator, thus benefitting food storage while reducing energy consumption.

• The Transactions of the Korean Institute of Electrical Engineers D
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• v.49 no.2
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• pp.62-67
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• 2000

The uniformity of temperature on a wafer is one of the most important parameters to control the RTP (Rapid Thermal Process) with proper input signals. Since it is impossible to achieve the uniformity of temperature without exact estimation of temperature at all points on the wafer, the difficulty of understanding internal dynamics and structural complexities of the RTP is a primary obstacle to accurately measure the distributed temperatures on the wafer. Furthermore, it is also hard to accomplish desirable estimation because only few pyrometers have been commonly available in the general equipments. In the paper, a thermal model based on the chamber geometry of the AST SHS200 RTP system is developed to effectively control the thermal uniformity on the wafer. First of all, the estimation method of one-point measurement is developed, which is properly extended to the case of multi-point measurements. This thermal model is validated through certain simulation and experiments. The work can be usefully contributed to building a run-by-run or a real-time controls of the RTP.