• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.04a
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• pp.572-577
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• 1997

This present paper describes a mathematical model of profile elliptical gears, and this model is based on the concepts of envelop theory and conjugate geometry between the blank and the straight-sided rack cutter. The geometric model of the rack cutter includes working regions generating involute curves andd fillets for trocoidal curves, and furthermore the addendum modified coeff,is considered for avoiding undercutting. The addendum modified coeff, is changed linearly along with pitch curves and must be the must be the same absolute value at both major semi-axis and minor semi-axis. If undercutting is at all pronounced, the undercut tooth not only are weakened in strength, but lose a small portion of the involute adjacent to the base circle, then this loss of involute may ncause a serios reduction in the length of contact. A very effective method of avoiding undercutting is to use the so-called profile shifted gearing. Non-undercutting conditon is examined with the change of eccentricity and addendum modefied coeff. in elliptical gears and then the minimum number of tooth is proposed not to gernerate undercutting phenomenon.

• Journal of the Korean Society for Precision Engineering
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• v.15 no.5
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• pp.85-92
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• 1998

This present paper describes a mathematical model of profile shifted elliptical gears, and this model is based on the concepts of envelope theory and conjugate geometry between the blank and the straight-sided rack cutter. The geometric model of the rack cutter includes working regions generating involute curves and fillets for trocoidal curves, and furthermore the addendum modified coeff. is considered for avoiding undercutting. The addendum modified coeff. is changed linearly along with pitch curves and must be the same absolute value at both major semi-axis and minor semi-axis. If undercutting is at all pronounced, the undercut tooth not only are weakened in strength, but lose a small portion of the involute adjacent to the base circle, then this loss of involute may cause a serious reduction in the length of contact. A very effective method of avoiding undercutting is to use the so-called profile shifted gearing. Non-undercutting condition is examined with the change of eccentricity and addendum modified coeff. in elliptical gears and then the minimum number of tooth is proposed not to gernerate undercutting phenomenon.

• Tunnel and Underground Space
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• v.30 no.6
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• pp.591-602
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• 2020

Several alternative rock-cutting concepts, which are modified from the conventional ones, have been developed lately. Of the concepts, undercutting is one of the latest technologies. In this study, as a fundamental study on the undercutting technique, the rock-cutting mechanism and important parameters of the undercutting were introduced. This study built up cutting test system for evaluating the cutting performance of an actuated undercutting disc cutter (ADC), and carried out a series of cutting tests under different cutting parameters of ADC. The characteristics of cutter forces obtained from ADC rock-cutting tests were analyzed. The both average and peak values of the three directional cutter forces were linearly increased with the increases of linear velocity, penetration depth in vertical direction and eccentricity of ADC.

• Journal of Korean Tunnelling and Underground Space Association
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• v.23 no.3
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• pp.199-209
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• 2021

Alternative methods of rock cutting have been introduced to substitute and to improve the traditional mechanical rock excavation methods (e.g., TBM and roadheader). Undercutting methods have been recently studied in some countries. In undercutting, several additional cutting parameters are involved in its cutting process compared to the traditional rock-cutting. As a fundamental study, this paper introduces the concept of undercutting method with actuated disc, lab-scaled testing system, and testing procedures of undercutting by the system. Also, we present the calculation methods of cutter forces and specific energy, and discuss the results of undercutting tests compared to those of traditional rock-cutting methods.

• Tunnel and Underground Space
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• v.29 no.3
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• pp.148-156
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• 2019

In urban area, the use of mechanical excavators (e.g., TBM and roadheader) has been increasing in construction of tunnelling and underground space. The undercutting technology, which is modified from the conventional rock-cutting concept, has been developed by advanced countries. Therefore, research on the latest technology of mechanical excavation is required, and keeping carrying out research on conventional mechanical tunneling methods at the same time. In this study, as a fundamental study of the undercutting technique, the principle and concept of the undercutting were introduced, as well as the current status of the research of advanced countries. The undercutting is applicable as a full-face excavation method for the tunnels and underground spaces, as well as an auxiliary(partial-face excavation) method for extension of the existing tunnels.

• Geomechanics and Engineering
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• v.29 no.3
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• pp.359-368
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• 2022

Undercutting using an actuated disc cutter (ADC) involves more complex cutting mechanism than traditional rock cutting does, requiring the application of various new cutting parameters, such as eccentricity, cutter inclination angle, and axis rotational speed. This study presents cutting-edge laboratory-scale testing equipment that allows performing ADC tests. ADC tests were carried out on a concrete block with a specified strength of 20 MPa, using a variety of cutting settings that included penetration depth (p), eccentricity (e), and linear velocity (v). ADC, unlike pick and disc cutting, has a non-linear cutting path with a dynamic cutting direction, requiring the development of a new method for predicting cutting force and specific energy. The influence of cutting parameters to the cutter forces were discussed. The ratio of eccentricity to the penetration depth (e/p) was proposed to evaluate the optimal cutting condition. Specific energy varies with e/p ratio, and exhibits optimum values in particular cases. In general, actuated undercutting may potentially give a more efficient cutting than conventional pick and disc cutting by demonstrating reasonably lower specific energy in a comparable cutting environment.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.04b
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• pp.112-116
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• 2000

This paper presents anisotropic ethcing characteristics of single-crystal silicon in tetramethylammonium hydroxide(TMAH):isopropyl alcohol(IPA) solutions containing pyrazine. With the addition of IPA to TMAH solutions, etching characteristics are exhibited that indicate an improvement in flatness on the etching front and a reduction in undercutting, but the etch rate on (100) silicon is decreased. The (100) silicon etch rate is improved by the addition of pyrazine. An etch rate on (100) silicon of $0.8\;{\mu}m/min$, which is faster by 13 % than a 20 wt.% solution of pure TMAH, is obtained using 20 wt.% TMAH:0.5 g/100 ml pyrazine solutions, but the etch rate on (100) silicon is decreased if more pyrazine is added. With the addition of pyrazine to a 25 wt.% TMAH solution, variations in flatness on the etching front were not observed and the undercutting ratio was reduced by 30 ~ 50 %.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.3
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• pp.65-71
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• 1999

The effects of mask materials and etching solutions on the dimensional accuracy of V-groove were studied for the alignment between optoelectronic devices and optical fibers in optical packaging. PECVD nitride, LPCVD nitride, or thermal oxide($SiO_2$) was used as a mask material. The anisotropic etching solution was KOH(40wt%) or the mixture of KOH and IPA. LPCVB nitride has the best etching selectivity and thermal oxide was etched most rapidly in KOH(40wt%) at $85^{\circ}C$ among the mask materials studied here. The V-groove size enlarged than the designed value. This phenomenon was due to the undercutting benearth the mask layer from the etching toward Si (111) plane. The etch rate of (111) plane wart 0.034 - 0.037 $\mu\textrm{m}$/min in KOH(40wt%). This rate was almost same regardless of mask materials. When IPA added to KOH(40wt%), the etch rate of (100) plane and (111) plane decreased, but etching ratio of (100) to (111) plane increased. Consequently, the undercutting phenomenon due to etching toward (111) plane decreased and the size of V-groove could be controlled more accurately.

• Transactions on Electrical and Electronic Materials
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• v.2 no.2
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• pp.21-25
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• 2001

This paper presents the effect of pyrazine on tetramethylammonium hydroxide (TMAH):isopropyl alcohol (IPA) single-crystal silicon anisotropic etching properties. With the addition of IPA to TMAH solutions, etching characteristics are exhibited an improvement in flatness on the etching front and a reduction in undercutting, but the etch rate on (100) silicon is decreased. The (100) silicon etch rate is improved by the addition of pyrazine. An etch rate on (100) silicon of 0.8 ${\mu}{\textrm}{m}$/min, which is faster by 13% than a 20 wt.% solution of pure TMAH, is obtained using 20 wt.% TMAH: 0.5 g/100 ml pyrazine solutions, but the etch rate on (100) silicon is decreased when more pyrazine is added. With the addition of pyrazine to a 25 wt.% TMAH solution, variations in flatness on the etching front are not observed and the undercutting ratio is reduced by 30~50%. These results indicate that anisotropic etching technology using TMAH:IPA:pyrazine solutions provides a powerful and versatile method for realizing of microelectromechanical systems.

• Electrical & Electronic Materials
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• v.10 no.5
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• pp.481-486
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• 1997

This paper describes the anisotropic etching characteristics of Si in acqueous TMAH/IPA solutions. The etch rates of (100) oriented Si crystal planes decrease with increasing TMAH concentration and IPA concentration. Etchant concentration and etch temperature have a large effect on hillock density. Hillock density strongly increase with lower TMAH concentration and higher etch temperature. The etched (100) planes are covered by pyramidal-shaped hillocks below TMAH 15 wt.%, but very smooth surface is obtained TMAH 25 wt.%. The addition of IPA to TMAH solution leads to smoother surfaces of sidewalls etched planes. Undercutting ratio of pure TMAH solution is much higher than KOH. But, addition of IPA to TMAh the underrcutting ratio reduces by a factor of 3∼4. Therefore, acqueous TMAH/IPA solution is able to use as anisotropic etchant of Si because of full compability with IC fabrication process.