• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2004.10a
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• pp.334-339
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• 2004

Ultraprecision machining and MEMS technology have been taken more and more important position in machining of microparts. Micro endmilling is one of the prominent technology that has wide spectrum of application field ranging from macro parts to micro products. Also, the method of micro-grooving using micro endmilling is used widely owing to many merit, but has problems of precision and quality of products due to tool wear and tool fracture. This investigation deals with state monitoring using acoustic emission(AE) signal in the micro-grooving. Characteristic evaluation of AE raw signal, AE hit and frequency analysis for state monitoring is also presented in the paper.

• Journal of the Korean Society for Precision Engineering
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• v.28 no.8
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• pp.904-914
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• 2011

The volumetric errors of CNC machining centers are determined by 21 errors, including 3 linear errors, 6 straightness errors, 3 perpendicular errors, 9 angular errors and non-rigid body errors of the machine tool. It is very time consuming and hard to measure all of these errors in which laser interferometer and other parts are used directly. Hence, as many as 21 separate setups and measurements are needed for the linear, straightness, angular and perpendicular errors. In case of the 5-axis machining centers, two more rotary tables are used. It can make 35 error sources of the movement. Therefore, the measured errors of multi movements of the 5-axis tables are very complicated, even if the relative measured errors are measured. This paper describes the methods, those analyze the error sources of the machining centers. Those are based on shifted diagonal measurements method (SDM), R-test and Double ball bar. In case, the angular errors of machine are small enough comparing with others, twelve errors including three linear position errors, six straightness errors and three perpendicular errors can be calculated by using SDM. To confirm the proposed method, SDM was applied to measuring 3 axes of machine tools and compared with directly measurement of each errors. In addition, the methods for measuring relative errors of multi-axis analysis methods using R-test and Double Ball Bar are introduced in this paper.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.7 no.6
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• pp.132-140
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• 1998

Recently, precision machining technology has been developed continuously in order to make high productivity and quality assurance of the precision parts of several industrial fields. Waviness may occur on the surface of the machined parts due to the table motion error and the dynamic cutting mechanism between the tool and the workpiece. The waviness may fall off the form accuracy of the precision machine parts. In the research, a micro cutting device with piezoelectric actuator has been developed to control precise depth of cut and compensate the waviness on the surface of the workpiece. Experiments have been carried out in the precision lathe. The characteristics of the surface profile and cause of the waviness profile have been analyzed and waviness profiles of some cause have been compared with those of experiments.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1998.10a
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• pp.198-203
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• 1998

To acquire the high precision of profile for standard electrode of loss angle, it is needed ultraprecision machining technology like MEAP(Magnetic Electronic Abrasive Polishing) and the very high profile measurement technology which can measure a micro unit about the workpiece. So, in this paper, it was developed the measurement system of precision of profile using non-contactable sensor that was approximate sensor of capacitance type, because that is better than others in the electrical characteristics. And standard electrode of loss angle was machined by the MEAP machining technology. In this study, it was development of precision measurement system. This system could be used measure the workpiece of roundness and straightness much more precise and faster than general mechanical measurement system done before. And it could be helped to minimize machining time and planning by very fast and precise measurement about the workpiece.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1999.10a
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• pp.502-506
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• 1999

Recently, the miniature of electric products such as notebook, cellular-phone etc. is apparently appeared, due to the smaller size of the semiconductor chips. As the size of chip gets smaller, the circuit could be easily damaged by the slightest influence, so it is important to control the chipping generation in the process of dicing. This paper deals with chipping of the silicon wafer dicing. The relationships between the dicing force and the wafer chipping are investigated. It is confirmed that the wafer chipping increases as the dicing force increases.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.11 no.3
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• pp.28-32
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• 2002

Recently, the miniature of electric products such as notebook, cellular-phone etc. is apparently appeared, due to the smaller size of the semiconductor chips. As the size of chip gets smaller, the circuit could be easily damaged by the slightest influence, therefore it is important to investigate the machining quality of $\mu$ BGA. This paper deals with machining characteristics of the $\mu$ BGA singulation. The relationships between the singulation face and machining quality of the $\mu$ BGA singulation are investigated. It is confirmed that machining quality improves as the singulation force decreases.