• Design & Manufacturing
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• v.2 no.1
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• pp.33-38
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• 2008

As consumer in optics, electronics, aerospace and electronics industry grow, the demand for ultra precision aspherical surface lens increases higher. Precision turning with single-diamond tools has a long history of development for fabrication of optical quality surfaces since the advent of aerostatic rotary spindles and precise linear motion guide ways. To enhance the precision and productivity of ultra precision aspherical surface micro lens, the following specification of ultra precision grinding system is required: the highest rotational speed of the grinder is 100,000rpm and its turning accuracy is $0.1{\mu}m$, positioning accuracy is $0.1{\mu}m$. The development process of the grinding system for the ultra precision aspherical surface micro lens for optoelectronics industry is introduced. In the work reported in this paper, an intelligent grinding system for ultra precision aspherical surface machining was designed by considering the factors affecting the surface roughness and profiles accuracy. An aerostatic form was adopted to build the spindle of the workpiece and the spindle of grinder and ultra precision LM guide way was adopted in this system. And this paper deals with mirror grinding of an aspheric surface micro lens by resin bonded diamond wheel and spherical lens of BK7. It results was that a form accuracy of $0.6{\mu}m$ P-V and a surface roughness of $0.006{\mu}m$ Rmax.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.10
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• pp.26-33
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• 2004

Ultra precision grinding technology has been developed from the refinement of the abrasive, the development of high stiffness equipment and grinding skill. The conventional wafering process which consists of lapping, etching, 1 st, 2nd and 3rd polishing has been changed to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Furthermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focuses on the flatness of the ground wafer. Generally, the ground wafer has concave pronto because of the difference of wheel path density, grinding temperature and elastic deformation of the equipment. Wafer tilting is applied to avoid non-uniform material removal. Through the geometric analysis of wafer grinding process, the profile of the ground wafer is predicted by the development of profile simulator.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.98-101
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• 2003

As the ultra precision grinding can be applied to wafering process by the refinement of the abrasive. the development of high stiffness equipment and grinding skill, the conventional wafering process which consists of lapping, etching, 1st, 2nd and 3rd polishing could be exchanged to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Futhermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focused on the flatness of the ground wafer. Generally, the ground wafer has concave profile because of the difference of wheel path density, grinding temperature and elastic deformation of the equiptment. Tilting mathod is applied to avoid such non-uniform material removes. So, in this paper, the geometric analysis on grinding process is carried out, and then, we can predict the profile of th ground wafer by using profile simulation.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.6 no.3
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• pp.9-15
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• 2007

Three methods for grinding: cross grinding, slanted tool axis grinding and parallel grinding, were carried out to study the machinability of tungsten carbide mold for glass formed aspherics lens. In our research, the optimum grinding conditions were investigated in terms of feed-rate, relative velocity of wheel and work piece, tool marks and surface roughness. It is shown that cross grinding are most effective in removal ratio but poor in surface roughness. In addition, tool marks of each method were differentiated on direction and shape.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.4 no.2
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• pp.10-15
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• 2005

For the development of compensation machining program, ultra precision grinding used in ultra precision machine and corrective machining was studied. We explored a new rough grinding technique on optical material such as zerodur. The facility used is a polishing machine with a custom grinding module and a range of diamond resin bond wheel. Surface roughness and form accuracy are measured by surface measurement equipment(Form Talysurf series2). Our compensation machining program has complied with a target of producing surface roughness better than $0.05{\mu}m$ Ra and form accuracy of around $0.05{\mu}m$ Rt and has been unveiled as a work-hour model.

• Journal of the Korean Society for Precision Engineering
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• v.10 no.1
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• pp.42-51
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• 1993

Recently, WC-Co have some excellent properities as the material for the mechanical component such as metallic moulding parts, ball dies parts, and punch parts. This paper describes the surface roughness and grinding force caused by experimental study on the surface grinding of WC-Co with ultra-precision like a mirror shape using diamond wheel. Also, some investigations are carried out using WA grinding wheel to increase improved ground surface roughness such as polishing, lapping effect. Some important results obtained here are summarized as follow. 1) Within this experimental grinding condition, we can be obtained $R_{max}.\;2\mu\textrm{m}\;R_a\;0.3\mu\textrm{m}$ whichare the most favourable ground surface roughness using #140 diamond wheel, and improved surface roughness values about 20 .approx. 25% throughout 5 times sparkout grinding 2) The value of surface roughness is Rmax. $0.49\mu\textrm{m},\;R_a\;0.06\mu\textrm{m}$ using #600 diamond wheel. 3) The area of no rack zone is less than $F_{n}$ 0.27N/mm, Ft 0.009N/mm

• Journal of the Korean Society for Precision Engineering
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• v.19 no.2
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• pp.58-64
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• 2002

In these days, according to increasing the technical development, the dimension of a product goes up for ultra-precision. For the net shape manufacturing, grinding is a important process that influences directly the accuracy and the integrity of produced products. In this study, an experimental evaluation was carried out. Workpiece materials were used STD11, SUS304, and STB2 in accordance with varing condition of feedrate and depth of cut. From measuring the grinding force and the surface roughness, material characteristics of grinding by using CBN wheel were examined.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1994.10a
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• pp.92-97
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• 1994

The there axis CNC grinding machine tool for ultra-precison mirror surface grinding of advanced materials such as ceramics and other hard and brittle materials was designed and manufactured. The grinding machine is composed of the air spindle, the high damping resin concrete bed, and the three axis CNC controller with the high resolution AC servo motor. To investigate the dynamic properties of the grinding machine, the natural frequencies of the spindle and the headstock were experimentally measured. The truing method using the break truer to revise the shape of the metal bonded diamond wheel was developed. Form the results of the machining using the prototype three axis CNC grinding machine manufactured, the mirror surface were achieved.

• Journal of the Korean Society for Precision Engineering
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• v.33 no.11
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• pp.893-898
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• 2016

Plastic array lens are cheap to manufacture; however, plastic is not resistant to high temperatures and moisture. Optical glass represents a better solution but is a more-expensive alternative. Glass array lens can be produced using lithography or precision-molding techniques. The lithography process is commonly used, for instance, in the semiconductor industry; however, the manufacturing costs are high, the processing time is quite long, and spherical aberration is a problem. To obtain high-order aspherical shapes, mold-core manufacturing is conducted through ultra-precision grinding machining. In this paper, a $4{\times}1$ mold core was manufactured using an ultra-precision machine with a jig for the injection molding of an aspherical array lens. The machined mold core was measured using the Form TalySurf PGI 2+ contact-stylus profilometer. The measurement data of the mold core are suitable for the design criterion of below 0.5 um.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.178-178
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• 2009

High-density optical information storing equipment, which is using Blu-ray, is the next generation information storing equipment that has about form six times to thirty-five times capacities. and high-density optical information storing equipment uses high NA(Numerical Aperture) aspheric glass objective lens as optical pick-up equipment to record and recognize high-density date. Generally this objective lens is developed and produced through a way of GMP(Glass Molding Press) that uses molding core that is performde by Ultra precision grinding, but grinding performing that has high-accuracy is very difficult because objective lens form is high NA. In this research, we preformed Ultra precision turning, using single crystal diamond bite, about WC(Co 0.5%), sintering brittleness material that is used molding core's material for GMP. and we confirmed aspheric glass lens compression of deformities molding core's Ultra precision turning possibility by measuring surface roughness(Ra) and processing surface's condition.