• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2005년도 춘계학술대회 논문집
• /
• pp.444-447
• /
• 2005

This paper is described about the technique of ultra-precision machining for a infrared camera aspheric mirror. A 200 mm diameter aspheric mirror was fabricated by SPDTM. Aluminum alloy as mirror substrates is known to be easily machined, but not polishable due to its ductility. Aspheric large reflector without a polishing process, the surface roughness of 5 nm Ra, and the form error of $\lambda/2\;(\lambda=632.8 nm)$ for reference curved surface 200 mm has been required. The purpose of this research is to find the optimum machining conditions for cutting reflector using A16061-T651 and apply the SPDTM technique to the manufacturing of ultra precision optical components of Al-alloy aspheric reflector.

• 한국생산제조학회지
• /
• 제20권3호
• /
• pp.316-321
• /
• 2011

Recently, it has been studied machining of micro parts with increasing demands for ultra precision parts. However, many engineering problems have already begun in polishing of optical parts or lens. As a method to overcome such problems, a new technology for the polishing of the target surface is being studied by controlling abrasives using MR fluids which are sensitive to magnetic fields. Since the current MR polishing system uses a big electromagnet, and is difficult to polish micro parts or spherical lens. Therefore, in this study, a round endmill type MR polishing system was developed to polish a three-dimensional structure which has spherical or inclined plane. And then, series of experiments were performed to verify the polishing performance of the developed round endmill type MR polishing system.

• 한국정밀공학회지
• /
• 제21권10호
• /
• pp.26-33
• /
• 2004

Ultra precision grinding technology has been developed from the refinement of the abrasive, the development of high stiffness equipment and grinding skill. The conventional wafering process which consists of lapping, etching, 1 st, 2nd and 3rd polishing has been changed to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Furthermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focuses on the flatness of the ground wafer. Generally, the ground wafer has concave pronto because of the difference of wheel path density, grinding temperature and elastic deformation of the equipment. Wafer tilting is applied to avoid non-uniform material removal. Through the geometric analysis of wafer grinding process, the profile of the ground wafer is predicted by the development of profile simulator.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2003년도 춘계학술대회 논문집
• /
• pp.98-101
• /
• 2003

As the ultra precision grinding can be applied to wafering process by the refinement of the abrasive. the development of high stiffness equipment and grinding skill, the conventional wafering process which consists of lapping, etching, 1st, 2nd and 3rd polishing could be exchanged to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Futhermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focused on the flatness of the ground wafer. Generally, the ground wafer has concave profile because of the difference of wheel path density, grinding temperature and elastic deformation of the equiptment. Tilting mathod is applied to avoid such non-uniform material removes. So, in this paper, the geometric analysis on grinding process is carried out, and then, we can predict the profile of th ground wafer by using profile simulation.

• 한국공작기계학회논문집
• /
• 제11권4호
• /
• pp.1-5
• /
• 2002

A 110 m diameter aspheric metal secondary mirror for a test model of an earth observation satellite camera was fsbricated by ultra-precision single point diamond turning (SPDT). Aluminum alloy for mirror substrates is known to be easily machinable, but not polishable due to its ductility. A harder material, Ni, is usually electrolessly coated on an A1 substrate to increase the surface hardness for optical polishing. Aspheric metal secondary mirror without a conventional polishing process, the surface roughness of Ra=10nm, and the form error of Ra=λ/12(λ=632.8nm) has been required. The purpose of this research is to find the optimum machining conditions for reflector cutting of electroless-Ni coated A1 alloy and apply the SPDT technique to the manufacturing of ultra precision optical components of metal aspheric reflector.

• 한국광학회:학술대회논문집
• /
• 한국광학회 2001년도 제12회 정기총회 및 01년도 동계학술발표회
• /
• pp.96-97
• /
• 2001

A 110 mm diameter aspheric metal secondary mirror for a test model of an earth observation satellite camera was fabricated by ultra-precision single point diamond turning (SPDT) . Without a conventional polishing process, the surface texture of R$\sub$a/=2.8 nm, and the form error of R$\sub$a/=0.05 λ has been stably achieved In a laboratory condition. (omitted)

• 한국정밀공학회지
• /
• 제13권6호
• /
• pp.59-65
• /
• 1996

There are many difficulties in automatic polishing for die & mold surfaces. Even though the process has been studied in the past 15 years, it has not been achieved yet, but by the process of actual hand work of well-skilled workers. A new magentic assisted polishing process, which is one of the potential methods for automation of surface finishing has been studied in the past 10 years by colleagues. The process has many merits, but on the other hand also has demerits, one being low efficiency of grindability by comparision with wheel polish. Therefore, some attempts were tried to improve the grindability by adopting electropolishing, ultra-high speed milling, 5-axis controlled machine etc... most recently by colleagues. This paper also aims to improve the efficiency of polishing by introducing the easily-polished shape surface cutting method equalizing the tool feed per revolution to the pick feed. This cutting method was experimentally confirmed to have sufficient grindability to polish milled surface (with $10{{\mu}m}$Rmax surface roughness) into mirror surface (with $0.4{{\mu}m}$Rmax surface roughness).

• 소성∙가공
• /
• 제22권2호
• /
• pp.74-79
• /
• 2013

The ultra-precision polishing method using MR fluid has come into the spotlight for polishing metals and optical materials. The MR fluid jet polishing process can be controlled using a change of viscosity by an imposed magnetic field. The MR fluid used for polishing process is a mixture of CI particles, DI water, $Na_2CO_3$ and glycerin. The efficiency of polishing depends on parameters such as polishing time, magnetic field, stand-off distance, pressure, etc. In this paper, the MR fluid jet polishing was used to polish nickel and brass mold materials, which is used to fabricate backlight units for 3-D optical devices in mobile display industries. In MR jet polishing, ferromagnetic materials like nickel can decrease the polishing efficiency by interaction with the cohesiveness of the MR fluid more than non-ferromagnetic materials like copper. A series of tests with different polishing times showed that the surface roughness of brass (Ra=1.84 nm) was lower than that of nickel (Ra=2.31 nm) after polishing for 20 minutes.

• 한국생산제조학회지
• /
• 제21권5호
• /
• pp.761-766
• /
• 2012

Abrasive fluid jet polishing processes have been used for the polishing of optical surfaces with complex shapes. However, unstable and unpredictable polishing spots can be generated due to the fundamental property of an abrasive fluid jet that it begins to lose its coherence as the jet exits a nozzle. To solve such problems, MR fluid jet polishing has been suggested using a mixture of abrasives and MR fluid whose flow properties can be readily changed according to imposed magnetic field intensity. The MR fluid jet can be stabilized by imposed magnetic fields, thus it can remain collimated and coherent before it impinges upon the workpiece surface. In this study, MR fluid jet polishing characteristics of fused silica glass were investigated according to injection time and magnetic field intensity variations. Material removal rates and 3D profiles of the generated polishing spots were investigated. From the results, it can be confirmed that the developed MR fluid polishing system can be applied for stable and predictable precise polishing of optical parts.

• 한국생산제조학회지
• /
• 제19권2호
• /
• pp.267-274
• /
• 2010

Recently, the magnetorheological (MR) polishing process has been examined as a new ultra-precision polishing technology for mirror surface generation in many applications, such as aspheric lenses, biochips, micro parts, etc. This method uses MR fluids which contains micro abrasives as a polishing media, and can. It is possible to obtain nano level surface roughness under suitable process conditions, however, required polishing time is highly dependent on the applied pre-polishing methods due to its very small material removal rate. Thus, in this study, a combined polishing method is presented to reduce total polishing time for SUS304. First, the electropolishing (EP) method was applied to obtain fine surface roughness, and the MR polishing was followed. Surface roughness variations were investigated according to the process conditions. As the results of this study, it was possible to reduce total polishing time for SUS304 using the proposed combined polishing method.